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MF1PLUS6031DUD/03

NXP Semiconductors

MF1PLUS6031DUD/03 by NXP Semiconductors

MF1PLUS6031DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,892 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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7,892

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Digiode

USA . 1,271 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,271

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Anansix

USA . 413 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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413

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 313 parts In-Stock

1+ parts

$13.710

100+ parts

-

1k+ parts

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10k+ parts

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313

$13.710

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One Stop Electronics

USA . 627 parts In-Stock

1+ parts

$13.800

100+ parts

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1k+ parts

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627

$13.800

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UNI Independent Distributors

Spain . 4,005 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,005

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Corphita

USA . 3,356 parts In-Stock

1+ parts

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3,356

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Overview

Unlock endless possibilities with the MF1PLUS6031DUD/03 from NXP Semiconductors, a leader in innovative technology. This high-quality consumer IC enhances your projects with superior reliability and performance, thriving in diverse applications from smart devices to interactive systems. Experience remarkable efficiency and durability, ensuring your solutions stand out while maximizing value. Elevate your designs with trusted excellence that only NXP can provide!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact PCB layouts, making it ideal for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, this IC is optimized for performance and reliability in everyday electronic devices.

Package Style (Meter): UNCASED CHIP

The unencased chip format reduces weight and volume, enabling higher density in device designs, while also allowing for better thermal management.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for various consumer environments, ensuring stable performance without overheating.

Minimum Operating Temperature: -25 °C

The capability to function at low temperatures (-25 °C) ensures reliability in diverse climates, expanding the range of applications for this IC.

Terminal Position: UPPER

The upper terminal positioning allows for straightforward mounting processes, contributing to quicker assembly times in manufacturing.

Terminal Form: NO LEAD

The no-lead terminal form minimizes space usage and enhances the overall design flexibility, making it suitable for a variety of applications where PCB real estate is critical.

Technical Specifications

Other Function Consumer ICs MF1PLUS6031DUD/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MF1PLUS6031DUD/03 General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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