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MF1PLUS8001DA4/03

NXP Semiconductors

MF1PLUS8001DA4/03 by NXP Semiconductors

MF1PLUS8001DA4/03 by NXP Semiconductors is a consumer circuit IC designed for surface mount applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form in a microelectronic assembly package. Ideal for various electronic devices, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,849 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,849

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Anansix

USA . 2,798 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,798

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Digiode

USA . 741 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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741

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$18.350

100+ parts

-

1k+ parts

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10k+ parts

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393

$18.350

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One Stop Electronics

USA . 355 parts In-Stock

1+ parts

$20.800

100+ parts

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1k+ parts

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10k+ parts

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355

$20.800

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UNI Independent Distributors

Spain . 3,538 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,538

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Corphita

USA . 882 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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882

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Overview

Unlock seamless connectivity and enhance user experiences with the MF1PLUS8001DA4/03 by NXP Semiconductors. This premium consumer IC combines cutting-edge technology with robust reliability, making it perfect for a wide range of applications—from smart devices to interactive systems. With NXP's legacy of quality and innovation, you can trust this chip to deliver exceptional performance, ensuring your products stand out in today's competitive market. Embrace the future with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making this IC suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for compact placement on printed circuit boards, enhancing design flexibility and enabling high-density manufacturing.

General IC Type: CONSUMER CIRCUIT

Being classified as a consumer circuit IC indicates its suitability for everyday electronic devices, ensuring compatibility and meeting the demands of consumer products.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style is designed for efficient space utilization and improved performance, making it ideal for modern electronic applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can function reliably in moderately warm environments, ensuring stability in consumer electronics.

Minimum Operating Temperature: -25 °C

The IC can operate in temperatures as low as -25 °C, making it suitable for use in environments with colder conditions, expanding its application range.

Terminal Form: NO LEAD

The no lead terminal form minimizes size and enhances integration options in compact designs, promoting energy efficiency and reducing material usage.

Technical Specifications

Other Function Consumer ICs MF1PLUS8001DA4/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS8001DA4/03 General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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