Loading...

MF1PLUS8001DUD/03

NXP Semiconductors

MF1PLUS8001DUD/03 by NXP Semiconductors

MF1PLUS8001DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,450

-

-

-

-

Anansix

USA . 2,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

-

-

-

-

Digiode

USA . 1,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,768

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$15.160

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$15.160

-

-

-

One Stop Electronics

USA . 1,075 parts In-Stock

1+ parts

$19.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

$19.800

-

-

-

UNI Independent Distributors

Spain . 5,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,435

-

-

-

-

Corphita

USA . 2,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,697

-

-

-

-

Overview

Elevate your projects with the MF1PLUS8001DUD/03 from NXP Semiconductors—where quality meets innovation! Designed for versatile applications in consumer electronics, this cutting-edge IC enhances performance while ensuring reliability under varying conditions. With NXP’s renowned commitment to excellence, you benefit from superior functionality and durability, making it the perfect choice for developers seeking to deliver standout solutions that impress and endure.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design and efficient use of space in consumer electronic devices, making it a versatile choice for modern applications.

General IC Type: CONSUMER CIRCUIT

Being classified as a consumer circuit IC, this product is optimized for everyday electronics, ensuring high performance and reliability in consumer applications.

Package Style (Meter): UNCASED CHIP

The unencased chip package style reduces the overall footprint, enabling it to fit into smaller devices while still maintaining effective heat dissipation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is suitable for environments with moderate heat generation, ensuring stable performance in various consumer products.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25 °C makes this IC a reliable choice for outdoor and harsh environment applications, extending its usability across different conditions.

Terminal Position: UPPER

The upper terminal position facilitates easier mounting on PCB layouts, contributing to simpler assembly processes and improving manufacturability.

Terminal Form: NO LEAD

The no lead terminal form ensures a compact design and helps reduce the potential for solder joint failures, enhancing the overall durability of the product.

Technical Specifications

Other Function Consumer ICs MF1PLUS8001DUD/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MF1PLUS8001DUD/03 General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15