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MF1PLUS6001DUD/13

NXP Semiconductors

MF1PLUS6001DUD/13 by NXP Semiconductors

MF1PLUS6001DUD/13 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,747

-

-

-

-

Anansix

USA . 2,274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,274

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-

-

-

Digiode

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 164 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$17.800

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-

-

Corphita

USA . 4,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,533

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-

-

-

UNI Independent Distributors

Spain . 3,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,795

-

-

-

-

Overview

Unlock a world of seamless connectivity and enhanced performance with the MF1PLUS6001DUD/13 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers this versatile consumer IC designed for diverse applications, offering unmatched reliability in challenging environments. With its compact, surface-mount design, this chip is perfect for modern electronics, ensuring efficiency and longevity that elevate your projects to new heights. Discover the benefits of superior technology today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact installation on PCBs, making it suitable for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring it meets the demands of everyday electronic devices.

Package Style (Meter): UNCASED CHIP

The unencased chip package style allows for flexibility in mounting and can reduce overall weight and size constraints in the final design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is viable for applications that operate in moderate thermal environments, ensuring reliability.

Minimum Operating Temperature: -25 °C

The capability to function at a minimum temperature of -25 °C makes this IC suitable for outdoor or harsh environment applications.

Terminal Position: UPPER

Upper terminal positioning facilitates easier connections and integration into various circuit designs.

Terminal Form: NO LEAD

The no lead design minimizes the footprint and enhances the performance by reducing parasitic capacitance and inductance.

Technical Specifications

Other Function Consumer ICs MF1PLUS6001DUD/13 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MF1PLUS6001DUD/13 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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