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MF1PLUS8011DA4/03

NXP Semiconductors

MF1PLUS8011DA4/03 by NXP Semiconductors

MF1PLUS8011DA4/03 by NXP Semiconductors is a surface-mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features a no-lead terminal form, and comes in a microelectronic assembly package. Ideal for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,155

-

-

-

-

Vyrian

USA . 1,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

-

-

-

-

Digiode

USA . 662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

662

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,528 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,528

$12.800

-

-

-

Corphita

USA . 4,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,498

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-

-

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UNI Independent Distributors

Spain . 3,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,132

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-

-

-

Overview

Unlock seamless connectivity and unparalleled performance with the MF1PLUS8011DA4/03 from NXP Semiconductors. Renowned for their commitment to excellence, NXP delivers a top-tier solution that enhances various consumer applications, ensuring reliability in every environment. With its innovative design and robust capabilities, this IC empowers your projects, providing flexibility and efficiency that boost productivity while keeping costs down. Experience the NXP difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Being surface mount compatible allows for compact design and easy integration into modern electronics, which is ideal for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it is designed specifically for consumer electronics applications, ensuring optimal performance and functionality in everyday devices.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style is advantageous for high-density applications, thus promoting efficiency and cost-effectiveness in manufacturing.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for use in a variety of consumer environments, ensuring reliable operation under standard conditions.

Minimum Operating Temperature: -25 °C

The ability to operate at a minimum temperature of -25 °C means this product can function reliably in colder climates, broadening its usability across different applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances the IC's footprint, allowing for higher integration and minimizing the risk of soldering defects during assembly.

Technical Specifications

Other Function Consumer ICs MF1PLUS8011DA4/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS8011DA4/03 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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