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MF1PLUS8031DA4/03

NXP Semiconductors

MF1PLUS8031DA4/03 by NXP Semiconductors

MF1PLUS8031DA4/03 by NXP Semiconductors is a surface-mount consumer IC designed for microelectronic applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form in a plastic/epoxy package. Ideal for various consumer electronics, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,828 parts In-Stock

1+ parts

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6,828

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Digiode

USA . 3,784 parts In-Stock

1+ parts

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1k+ parts

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3,784

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Anansix

USA . 204 parts In-Stock

1+ parts

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204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,137 parts In-Stock

1+ parts

$13.300

100+ parts

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1k+ parts

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10k+ parts

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1,137

$13.300

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One Stop Electronics

USA . 200 parts In-Stock

1+ parts

$19.800

100+ parts

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1k+ parts

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200

$19.800

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QUARKTWIN TECHNOLOGY LTD

USA . 12,062 parts In-Stock

1+ parts

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12,062

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UNI Independent Distributors

Spain . 7,241 parts In-Stock

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7,241

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Corphita

USA . 648 parts In-Stock

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648

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Overview

Elevate your applications with the MF1PLUS8031DA4/03 from NXP Semiconductors, a leader in innovative solutions. This high-quality consumer IC delivers unmatched reliability and performance across diverse industries, ensuring your projects are built to last. Its robust design caters to a range of uses, making it ideal for modern smart devices. Choose NXP for superior technology that enhances efficiency, boosts productivity, and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this product reliable for various consumer applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern circuit designs, promoting space efficiency and simpler manufacturing processes.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, this product is specifically designed for use in consumer electronics, ensuring optimized performance for common applications.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style enhances thermal and electrical performance, making it suitable for high-performance consumer electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, it is well-suited for typical consumer environments, ensuring reliable operation under normal conditions.

Minimum Operating Temperature: -25 °C

The ability to operate down to -25 °C allows this IC to function effectively in colder environments, thus expanding its application range.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the layout design and reduces the footprint on the PCB, making it advantageous for compact circuit designs.

Technical Specifications

Other Function Consumer ICs MF1PLUS8031DA4/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS8031DA4/03 General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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