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MF1PLUS8031DUD/03

NXP Semiconductors

MF1PLUS8031DUD/03 by NXP Semiconductors

MF1PLUS8031DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, featuring an unencased chip design with no lead terminals. Ideal for compact electronic devices, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,804 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,804

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Anansix

USA . 2,876 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,876

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Digiode

USA . 2,140 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,140

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,103 parts In-Stock

1+ parts

$18.590

100+ parts

-

1k+ parts

-

10k+ parts

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1,103

$18.590

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One Stop Electronics

USA . 812 parts In-Stock

1+ parts

$18.800

100+ parts

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1k+ parts

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10k+ parts

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812

$18.800

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UNI Independent Distributors

Spain . 3,930 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,930

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Corphita

USA . 115 parts In-Stock

1+ parts

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115

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Overview

Unlock seamless connectivity and unmatched quality with the MF1PLUS8031DUD/03 from NXP Semiconductors, a trusted leader in innovative solutions. This versatile consumer IC is designed for a range of applications, ensuring reliability in diverse environments while enhancing user experiences. With its robust performance across varying temperatures and surface mount capability, enjoy greater efficiency and longevity in your projects, delivering exceptional value and peace of mind.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact and densely populated circuit boards, making it suitable for modern electronic devices.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, this product is tailored for various consumer applications, ensuring reliability and performance in everyday electronic goods.

Package Style (Meter): UNCASED CHIP

The uncased chip package facilitates direct mounting on PCBs, reducing space requirements and potentially lowering manufacturing costs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can function effectively in a range of environments, suitable for consumer products that experience heat during use.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25 °C ensures that this product is resilient in colder conditions, expanding its application range.

Terminal Position: UPPER

The upper terminal position is ideal for mounting configurations, making assembly easier and enhancing the efficiency of the manufacturing process.

Terminal Form: NO LEAD

The no lead terminal form allows for a smaller footprint on the PCB, contributing to miniaturization and increased design flexibility in electronic products.

Technical Specifications

Other Function Consumer ICs MF1PLUS8031DUD/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MF1PLUS8031DUD/03 General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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