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MF1PLUS6001DA4/03

NXP Semiconductors

MF1PLUS6001DA4/03 by NXP Semiconductors

MF1PLUS6001DA4/03 by NXP Semiconductors is a consumer circuit IC designed for surface mount applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form in a microelectronic assembly package. Ideal for various electronic devices, it ensures reliable performance in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,863 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,863

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Vyrian

USA . 3,633 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,633

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Anansix

USA . 1,253 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,253

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 366 parts In-Stock

1+ parts

$15.800

100+ parts

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1k+ parts

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10k+ parts

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366

$15.800

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AZTECH Wire

Italy . 947 parts In-Stock

1+ parts

$18.450

100+ parts

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1k+ parts

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10k+ parts

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947

$18.450

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Corphita

USA . 4,321 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,321

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UNI Independent Distributors

Spain . 3,242 parts In-Stock

1+ parts

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100+ parts

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3,242

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Overview

Experience seamless connectivity and enhanced performance with the MF1PLUS6001DA4/03 from NXP Semiconductors, a leader in innovative solutions. This versatile consumer IC excels in various applications, ensuring reliability in temperature extremes. With its compact design and efficient surface mount technology, it’s perfect for modern electronic devices. Trust NXP for quality and innovation that drive your projects forward while delivering exceptional value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body provides excellent durability and protection against environmental factors, making it a reliable choice for consumer applications.

Surface Mount: YES

Being surface mount compatible allows for a smaller footprint on PCBs, enabling compact designs and easier assembly in modern electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC ensures optimized performance for various everyday electronic devices, enhancing user experience.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly style supports advanced manufacturing techniques and offers higher integration, making it suitable for high-performance applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is well-suited for typical consumer environments, ensuring stable operation without overheating.

Minimum Operating Temperature: -25 °C

The capability to operate as low as -25 °C allows this IC to function effectively in colder climates, broadening its application range.

Terminal Form: NO LEAD

A no-lead design enhances the device's compatibility with lead-free assembly processes and reduces the risk of soldering defects, contributing to higher reliability.

Technical Specifications

Other Function Consumer ICs MF1PLUS6001DA4/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS6001DA4/03 General Purpose ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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