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MF1PLUS6011DUD/03

NXP Semiconductors

MF1PLUS6011DUD/03 by NXP Semiconductors

MF1PLUS6011DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for versatile applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals for compact integration. Ideal for various consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,467 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,467

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-

-

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Vyrian

USA . 3,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,353

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-

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Anansix

USA . 2,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,069

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,088 parts In-Stock

1+ parts

$9.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,088

$9.800

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UNI Independent Distributors

Spain . 6,378 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,378

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Corphita

USA . 3,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,026

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-

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Overview

Unlock seamless connectivity and enhanced consumer experiences with the MF1PLUS6011DUD/03 from NXP Semiconductors. Renowned for their innovation and reliability, NXP ensures this advanced consumer IC is built for performance, operating efficiently in diverse environments. Ideal for applications ranging from smart devices to interactive systems, its superior design delivers exceptional value, empowering customers to elevate product offerings and drive success.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, enabling efficient use of circuit board space.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC caters to various electronics, making it versatile for different projects.

Package Style (Meter): UNCASED CHIP

The unencased chip design provides flexibility in mounting options and can reduce overall project weight and size.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC ensures reliable performance in moderately hot environments, enhancing durability.

Minimum Operating Temperature: -25 °C

The capability to operate down to -25 °C makes this IC suitable for use in colder climates and outdoor applications.

Terminal Position: UPPER

Upper terminal positioning simplifies connections and assembly processes, speeding up the production pipeline.

Terminal Form: NO LEAD

No-lead terminals provide a compact and efficient design, improving the electrical performance and reducing signal interference.

Technical Specifications

Other Function Consumer ICs MF1PLUS6011DUD/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

MF1PLUS6011DUD/03 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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