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MF1PLUS6011DA4/03

NXP Semiconductors

MF1PLUS6011DA4/03 by NXP Semiconductors

MF1PLUS6011DA4/03 by NXP Semiconductors is a surface-mount consumer IC designed for microelectronic assemblies. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form. Ideal for various applications in consumer electronics, it ensures reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,464

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-

-

-

Digiode

USA . 1,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,909

-

-

-

-

Anansix

USA . 652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

652

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,120 parts In-Stock

1+ parts

$7.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

$7.800

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Corphita

USA . 2,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,579

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UNI Independent Distributors

Spain . 2,566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,566

-

-

-

-

Overview

Unlock seamless connectivity and superior performance with the MF1PLUS6011DA4/03 by NXP Semiconductors. Renowned for their innovation and reliability, NXP empowers your applications—from consumer electronics to IoT solutions—with cutting-edge features that enhance efficiency and user experience. Enjoy robust design, exceptional durability, and versatile integration, making this IC an invaluable asset for modern technology ventures. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, ensuring long-term reliability in various applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into compact designs, facilitating efficient production and saving board space.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, this product is well-suited for a variety of electronic devices, making it versatile for consumer electronics applications.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style supports the efficient manufacturing processes, which can reduce cost and improve performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can operate in a reasonably warm environment, ensuring performance stability under usual consumer conditions.

Minimum Operating Temperature: -25 °C

The capability to operate at a minimum temperature of -25 °C expands the range of applications, making it suitable for usage in colder climates.

Terminal Form: NO LEAD

The no-lead terminal form facilitates better thermal performance and allows for a more compact design compared to traditional leaded components.

Technical Specifications

Other Function Consumer ICs MF1PLUS6011DA4/03 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

X-PXMA-N

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

MF1PLUS6011DA4/03 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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