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BFR93AT/R

NXP Semiconductors

BFR93AT/R by NXP Semiconductors

NXP Semiconductors' BFR93AT/R is a NPN RF BJT transistor with 3 terminals, ideal for L Band applications. It has a max power dissipation of 0.35W, fT of 6000MHz, and hFE of 40. This small outline package transistor operates at up to 150°C and can handle a max collector-emitter voltage of 12V.

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Electronic Expediters

USA . 2,990 parts In-Stock

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Digiode

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Diverse Electronics

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VNN

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PC Components Company LLC

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Bristol Electronics

USA . 1,200 parts In-Stock

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Odi Ramu Company

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Anansix

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Nova Conductors

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Vyrian

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Prism Electronics

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Semicontronic

India . 269 parts In-Stock

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Aztec Data Supply Inc.

USA . 328 parts In-Stock

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Corohmni

South Africa . 209 parts In-Stock

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AZTECH Wire

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One Stop Electronics

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Glotronic Ltd.

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Overview

Elevate your RF signal amplification with the BFR93AT/R by NXP Semiconductors. This high-quality NPN transistor is a powerhouse in the world of small signal amplification, perfect for applications in the L Band frequency range. With a maximum power dissipation of 0.35W and a minimum DC current gain of 40, this transistor delivers reliable performance and efficiency. Trust in NXP Semiconductors' reputation for excellence and innovation, and experience the value and benefits that the BFR93AT/R brings to your projects. Elevate your RF signal amplification with the BFR93AT/R!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and cost-effective, ideal for compact and budget-friendly designs.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications, offering high efficiency and good performance.

Configuration: SINGLE

The single configuration simplifies circuit design and ensures easy integration into various electronic projects.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring reliable and high-quality signal amplification capabilities.

Surface Mount: YES

Surface-mount technology allows for easy and automated assembly, making it suitable for mass production and compact designs.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of PCB space and facilitates proper placement and orientation during assembly.

Terminal Form: GULL WING

Gull wing terminals offer secure solder joints and easy surface-mounting capabilities, enhancing the overall reliability of the transistor.

Highest Frequency Band: L BAND

Operates in the L band frequency range, making it suitable for a wide range of RF applications including communication and radar systems.

Maximum Power Dissipation (Abs): 0.35 W

Capable of handling up to 0.35 Watts of power dissipation, ensuring robust performance under varying load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for efficient heat dissipation, contributing to the overall reliability of the transistor.

Maximum Power Dissipation Ambient: 0.3 W

Safely dissipate up to 0.3 Watts of power in ambient conditions, ensuring stable operation even in challenging environmental conditions.

Minimum DC Current Gain (hFE): 40

With a minimum DC current gain of 40, this transistor provides consistent amplification and ensures reliable performance in various applications.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150°C, suitable for applications requiring high temperature tolerance.

Maximum Collector-Emitter Voltage: 12 V

Supports a maximum collector-emitter voltage of 12 volts, making it suitable for low to medium voltage applications.

Transistor Element Material: SILICON

The silicon material of the transistor element offers excellent reliability, efficiency, and performance, making it a preferred choice for many applications.

Maximum Collector Current (IC): 0.035 A

Can handle a maximum collector current of 0.035 Amperes, suitable for low-power amplification and switching applications.

Terminal Finish: Tin (Sn)

The tin finish provides corrosion resistance and ensures a reliable electrical connection, improving the overall longevity and performance of the transistor.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and facilitates easy integration into various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for up to 40 seconds, ensuring proper soldering and assembly without compromising performance.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C, ensuring reliable solder joints and robust assembly.

Reference Standard: CECC

Complies with CECC standards, ensuring high quality, performance, and reliability in electronic applications.

Nominal Transition Frequency (fT): 6000 MHz

With a nominal transition frequency of 6000 MHz, this transistor offers high-speed performance, making it suitable for RF applications requiring fast signal processing.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR93AT/R attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

40

Highest Frequency Band:

L BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.3 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

CECC

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR93AT/R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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