Loading...

EC3H02BA

Onsemi

EC3H02BA by Onsemi

The Onsemi EC3H02BA is an NPN RF BJT with a single configuration, suitable for surface mount applications. It features a max power dissipation of 0.1W, min DC current gain of 120, and max operating temp of 150 °C. Ideal for high-frequency circuits up to 5000MHz requiring low collector current at 0.07A.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

-

-

-

-

Vyrian

USA . 402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

402

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 997 parts In-Stock

1+ parts

$0.548

100+ parts

-

1k+ parts

-

10k+ parts

-

997

$0.548

-

-

-

Northwest PG Solutions

USA . 1,728 parts In-Stock

1+ parts

$0.602

100+ parts

-

1k+ parts

-

10k+ parts

-

1,728

$0.602

-

-

-

Problanco Electronics

Mexico . 5,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,638

-

-

-

-

SupplyDigital Components

Austria . 3,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,683

-

-

-

-

Kulean Microsystems

USA . 3,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,477

-

-

-

-

Corphita

USA . 1,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,309

-

-

-

-

UHIMA Technologies

Türkiye . 664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

664

-

-

-

-

TANS Electronics

Latvia . 317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

317

-

-

-

-

Corohmni

South Africa . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Overview

Experience exceptional performance with the EC3H02BA by Onsemi, a top-quality RF Small Signal Bipolar Junction Transistor (BJT) that delivers superior functionality in a compact package. As a trusted manufacturer, Onsemi ensures reliability and precision in every product they create. The EC3H02BA is perfect for a wide range of applications, offering unparalleled value and efficiency. Elevate your projects with this NPN transistor that boasts a high DC current gain and impressive transition frequency, making it ideal for various electronics applications. Choose Onsemi for innovation, quality, and unmatched performance.

Feature Benefit Bullets

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product versatile and suitable for a wide range of applications.

Configuration: SINGLE

Single configuration simplifies circuit design and makes it easier to use in various electronic projects.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Power Dissipation: 0.1 W

With a maximum power dissipation of 0.1W, this transistor can withstand high power levels, ensuring reliable performance.

Minimum DC Current Gain (hFE): 120

A high minimum DC current gain of 120 ensures efficient amplification of signals with minimal input current.

Maximum Operating Temperature: 150 °C

Operating at temperatures up to 150 °C allows this transistor to function reliably in a variety of environments.

Maximum Collector Current (IC): 0.07 A

With a maximum collector current of 0.07A, this transistor can handle moderate current loads efficiently.

Nominal Transition Frequency (fT): 5000 MHz

A high nominal transition frequency of 5000MHz indicates that this transistor can operate at high frequencies, making it suitable for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) EC3H02BA attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

120

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Nominal Transition Frequency (fT):

Trade Compliance

EC3H02BA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16