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BFG21W,115

NXP Semiconductors

BFG21W,115 by NXP Semiconductors

NXP Semiconductors BFG21W,115 is an NPN RF BJT transistor with 18000 MHz fT. It has a max power dissipation of 0.67 W and operates at up to 150 °C. Ideal for amplifier applications in the ultra-high frequency band, this transistor features a small outline package with GULL WING terminals.

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7

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Vyrian

USA . 11,945 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,974 parts In-Stock

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France . 2,162 parts In-Stock

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Anansix

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Digiode

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Nova Conductors

Japan . 52 parts In-Stock

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Cogito LLC

Ukraine . 19 parts In-Stock

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Corohmni

South Africa . 266 parts In-Stock

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$0.467

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One Stop Electronics

USA . 1,110 parts In-Stock

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AZTECH Wire

Italy . 935 parts In-Stock

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Ampacity Inc.

Singapore . 906 parts In-Stock

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$43.050

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Argo Parts USA

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Corphita

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UNI Independent Distributors

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Continental Prestige Electronics

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Perfect Parts

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Aranea Global

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Microchip USA

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$1.985

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$1.838

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$1.838

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Overview

Unleash the power of innovation with the BFG21W,115 by NXP Semiconductors. This RF Small Signal Bipolar Junction Transistor offers exceptional quality and performance, making it a top choice for amplifier applications in the ultra-high-frequency band. Its small outline package and gull wing terminals ensure easy installation, while its maximum collector current of 0.5 A and transition frequency of 18000 MHz guarantee superior functionality. Trust in NXP Semiconductors for cutting-edge technology that delivers unmatched value and reliability to your projects. Elevate your designs with the BFG21W,115 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and is cost-effective, making the product suitable for a wide range of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product ideal for amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and makes the product easy to integrate into various electronic systems.

Maximum Power Dissipation: 0.67 W

With a relatively high power dissipation capability, this transistor can handle moderate power levels without overheating.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this product a dependable choice for amplifier applications.

Nominal Transition Frequency: 18000 MHz

The high transition frequency indicates that this transistor can operate at ultra-high frequencies, making it suitable for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFG21W,115 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

EMITTER

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3 pF

Maximum Collector-Emitter Voltage:

4.5 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFG21W,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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