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MT29F8G08ABBCAH4-IT:C

Micron Technology

MT29F8G08ABBCAH4-IT:C by Micron Technology

MT29F8G08ABBCAH4-IT:C by Micron Technology is a 1.8V SLC NAND flash memory with 1GX8 organization, 4K sectors, and 256K sector size. It operates in industrial temperatures (-40 to 85 °C) with parallel interface and 0.8mm terminal pitch. Ideal for applications requiring high memory density and fast access times.

Median Price

$6.830

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,069 parts In-Stock

1+ parts

$5.973

100+ parts

$4.938

1k+ parts

$4.449

10k+ parts

-

1,069

$5.973

$4.938

$4.449

-

Newark

USA . 789 parts In-Stock

1+ parts

$6.830

100+ parts

$5.550

1k+ parts

$5.170

10k+ parts

-

789

$6.830

$5.550

$5.170

-

Mouser Electronics

USA . 193 parts In-Stock

1+ parts

$6.830

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

-

193

$6.830

$5.550

$4.960

-

Farnell

UK . 513 parts In-Stock

1+ parts

$15.250

100+ parts

-

1k+ parts

-

10k+ parts

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513

$15.250

-

-

-

Element14

Singapore . 513 parts In-Stock

1+ parts

$27.490

100+ parts

-

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-

10k+ parts

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513

$27.490

-

-

-

Future Electronics

Canada . 2,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.670

10k+ parts

$3.630

2,520

-

-

$3.670

$3.630

Verical

USA . 1,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,069

-

-

-

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Avnet

USA . 239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$9.827

239

-

-

-

$9.827

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.809

100+ parts

-

1k+ parts

-

10k+ parts

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100

$2.809

-

-

-

Digiode

USA . 992 parts In-Stock

1+ parts

$6.052

100+ parts

-

1k+ parts

-

10k+ parts

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992

$6.052

-

-

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NAC Semi

USA . 6,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.450

6,300

-

-

-

$4.450

Cyclops Electronics Ltd

UK . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,000

-

-

-

-

Chip Stock

USA . 4,674 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,674

-

-

-

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Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

-

-

-

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Vyrian

USA . 3,974 parts In-Stock

1+ parts

-

100+ parts

-

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3,974

-

-

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PC Components Company LLC

USA . 3 parts In-Stock

1+ parts

-

100+ parts

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3

-

-

-

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Bristol Electronics

USA . 3 parts In-Stock

1+ parts

-

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-

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3

-

-

-

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NexGen Digital

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,795 parts In-Stock

1+ parts

$2.200

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

$2.200

-

-

-

Component Stockers USA

USA . 14,953 parts In-Stock

1+ parts

$3.980

100+ parts

$3.980

1k+ parts

$3.980

10k+ parts

-

14,953

$3.980

$3.980

$3.980

-

Ampacity Inc.

Singapore . 2,664 parts In-Stock

1+ parts

$4.180

100+ parts

-

1k+ parts

-

10k+ parts

-

2,664

$4.180

-

-

-

Corohmni

South Africa . 917 parts In-Stock

1+ parts

$5.018

100+ parts

-

1k+ parts

-

10k+ parts

-

917

$5.018

-

-

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Corphita

USA . 1,576 parts In-Stock

1+ parts

$5.733

100+ parts

-

1k+ parts

-

10k+ parts

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1,576

$5.733

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$7.764

100+ parts

-

1k+ parts

-

10k+ parts

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500

$7.764

-

-

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Continental Prestige Electronics

USA . 1,022 parts In-Stock

1+ parts

$9.270

100+ parts

$7.030

1k+ parts

-

10k+ parts

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1,022

$9.270

$7.030

-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,673 parts In-Stock

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20,673

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-

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A-Z Elektronik GmbH

Germany . 4,524 parts In-Stock

1+ parts

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4,524

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-

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Microchip USA

USA . 4,127 parts In-Stock

1+ parts

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4,127

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-

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Argo Parts USA

USA . 3,176 parts In-Stock

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3,176

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Authorized Procurement Solutions

USA . 3,096 parts In-Stock

1+ parts

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3,096

-

-

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Perfect Parts

USA . 2,845 parts In-Stock

1+ parts

-

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2,845

-

-

-

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Formix International (Excess)

India . 1,390 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,390

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-

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Infinite Electronics LLP (Excess)

. 899 parts In-Stock

1+ parts

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899

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-

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Futuretech Components

Singapore . 800 parts In-Stock

1+ parts

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100+ parts

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800

-

-

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Kepictronics

USA . 290 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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290

-

-

-

-

Overview

Discover the cutting-edge MT29F8G08ABBCAH4-IT:C by Micron Technology, a top-tier flash memory solution that guarantees exceptional quality and reliability. Perfect for industrial applications, this product offers seamless integration and outstanding performance. With a focus on innovation and advanced technology, Micron Technology provides a superior product that exceeds industry standards. Elevate your projects with the MT29F8G08ABBCAH4-IT:C and experience unparalleled speed, efficiency, and durability. Choose Micron Technology for excellence in flash memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material helps in providing durability and reliability to the flash memory product.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this flash memory product energy-efficient and suitable for power-sensitive applications.

No. of Terminals: 63

Having 63 terminals allows for efficient data transfer and connectivity, enhancing the performance of the flash memory product.

Organization: 1GX8

The organization of 1GX8 indicates a high-density and efficient memory storage system, making this flash memory product a great choice for data-intensive applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grade ensures that this flash memory product can withstand harsh environmental conditions, making it suitable for industrial applications.

Memory IC Type: FLASH

The use of flash memory IC provides fast read and write speeds, high reliability, and data retention, making this product a reliable choice for data storage.

Technical Specifications

Flash Memory MT29F8G08ABBCAH4-IT:C attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Access Time:

30 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B63

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

8

No. of Sectors/Size:

4K

No. of Terminals:

63

No. of Words:

1073741824 words

No. of Words Code:

1G

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA63,10X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Page Size (words):

4K

Parallel or Serial:

PARALLEL

Power Supplies (V):

1.8

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Ready or Busy:

YES

Sector Size (Words):

256K

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Type:

SLC NAND TYPE

Trade Compliance

MT29F8G08ABBCAH4-IT:C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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