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MPFS250TLS-FCG1152I

Microchip Technology

MPFS250TLS-FCG1152I by Microchip Technology

MPFS250TLS-FCG1152I by Microchip Technology is a programmable SoC with 1152 terminals in a grid array package. It operates b/w -40 to 100°C, with supply voltage ranging from 0.97V to 1.03V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$552.260

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 26 parts In-Stock

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$552.260

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26

$552.260

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$605.701

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300

$605.701

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Vyrian

USA . 5,994 parts In-Stock

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5,994

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Distributors (Availability)

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AZTECH Wire

Italy . 229 parts In-Stock

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$16.682

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229

$16.682

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$566.330

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26

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Continental Prestige Electronics

USA . 4,761 parts In-Stock

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$605.701

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$593.587

4,761

$605.701

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$593.587

Argo Parts USA

USA . 2,333 parts In-Stock

1+ parts

$605.701

100+ parts

$599.644

1k+ parts

$593.587

10k+ parts

$587.530

2,333

$605.701

$599.644

$593.587

$587.530

Netroflash

USA . 50 parts In-Stock

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$605.701

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50

$605.701

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Microchip USA

USA . 2,501 parts In-Stock

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$732.886

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2,501

$732.886

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Montano Global Distributors

Canada . 7,577 parts In-Stock

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7,577

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NIA Electronics

USA . 7,499 parts In-Stock

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7,499

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Ledger Components

France . 7,499 parts In-Stock

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7,499

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LOOK Integrated Logistics

Peru . 1,346 parts In-Stock

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1,346

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LMD Electronica

Estonia . 418 parts In-Stock

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418

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Overview

Elevate your device’s performance with the MPFS250TLS-FCG1152I from Microchip Technology. Known for their superior quality and reliability, Microchip offers cutting-edge solutions in the category of Other Function uPs,uCs & Peripheral ICs. This innovative product boasts a range of applications, providing unmatched value to customers seeking top-notch performance and efficiency. Experience the benefits of seamless integration, advanced technology, and unparalleled versatility with the MPFS250TLS-FCG1152I. Upgrade your system today and unlock a new world of possibilities with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology enables easy and quick installation of the product onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 1.03 V

High maximum supply voltage allows for versatile power input options, accommodating various system requirements.

Package Shape: SQUARE

Square package shape helps in efficient use of PCB space, optimizing layout and design for better integration.

No. of Terminals: 1152

Large number of terminals offer extensive connectivity options, making the product suitable for complex circuit configurations.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates secure and precise soldering connections, ensuring reliability in electrical connections.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage allows for energy-efficient operation, reducing power consumption and overall costs.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliable performance in demanding environmental conditions, enhancing product durability.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in both extreme hot and cold environments, increasing product versatility.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, enabling easier integration into compact electronic devices.

Maximum Seated Height: 2.99 mm

Low seated height helps in achieving a slim profile for the product, ideal for space-constrained applications.

Width: 35 mm

Compact width dimension allows for efficient use of PCB space, enabling dense packing of components for optimized system performance.

Length: 35 mm

Square package shape with equal length and width dimensions facilitates uniform placement on the PCB, improving overall circuit layout symmetry.

Peripheral IC Type: PROGRAMMABLE SoC

Programmable system-on-chip design provides flexibility and customization options, allowing for tailored solutions to specific application requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable signal processing.

Terminal Form: BALL

Ball terminal form enables secure electrical connections and easy reworkability during assembly, enhancing product reliability and manufacturability.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, improving overall system reliability.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density packaging, enabling more components to be placed in a limited PCB area for enhanced functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS250TLS-FCG1152I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B1152

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1152,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.99 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

MPFS250TLS-FCG1152I Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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