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MPFS095TS-FCSG536I

Microchip Technology

MPFS095TS-FCSG536I by Microchip Technology

MPFS095TS-FCSG536I by Microchip: 536-terminal IC with 1V nominal supply, 0.5mm terminal pitch, and programmable SoC technology. Ideal for applications requiring low profile, fine pitch grid array packages in a square shape. Operates b/w -40 to 100 °C with bottom terminal position.

Median Price

$215.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

1+ parts

$215.550

100+ parts

$175.125

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3

$215.550

$175.125

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Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$292.046

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550

$292.046

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Vyrian

USA . 4,596 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 793 parts In-Stock

1+ parts

$6.422

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793

$6.422

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$269.020

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$269.020

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Continental Prestige Electronics

USA . 6,895 parts In-Stock

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$292.046

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$286.205

6,895

$292.046

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$286.205

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$292.046

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$286.205

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1,000

$292.046

$286.205

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Microchip USA

USA . 2,421 parts In-Stock

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$474.750

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2,421

$474.750

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NIA Electronics

USA . 7,998 parts In-Stock

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Ledger Components

France . 7,998 parts In-Stock

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Montano Global Distributors

Canada . 6,855 parts In-Stock

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LMD Electronica

Estonia . 4,627 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,482 parts In-Stock

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Argo Parts USA

USA . 4,059 parts In-Stock

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Overview

Unlock limitless possibilities with the MPFS095TS-FCSG536I by Microchip Technology. Crafted with precision and expertise, this cutting-edge product is designed to elevate your projects to new heights. Ideal for a wide range of applications in the category of Other Function uPs, uCs & Peripheral ICs, this innovative solution offers unrivaled quality, reliability, and performance. Experience seamless integration, enhanced efficiency, and unmatched value with this exceptional offering. Embrace the future of technology with Microchip Technology's MPFS095TS-FCSG536I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.03 V

Supports higher voltage requirements, making it versatile for a variety of applications.

Package Shape: SQUARE

Helps optimize space on the circuit board, allowing for more efficient layout and design.

No. of Terminals: 536

Offers a large number of connection points for versatile connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact and efficient design, ideal for applications where space is limited.

Minimum Supply Voltage: 0.97 V

Supports lower voltage requirements, helping to reduce power consumption and energy costs.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures, ensuring reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

Facilitates easy connections and installation onto the circuit board.

Maximum Seated Height: 1.4 mm

Low profile design helps save space and allows for a more compact overall system.

Width: 16 mm

Compact size enables easy integration into a variety of electronic devices.

Length: 16 mm

Compact size enables easy integration into a variety of electronic devices.

Peripheral IC Type: PROGRAMMABLE SoC

Allows for customization and flexibility in functionality, making it suitable for a wide range of applications.

Technology: CMOS

Provides low power consumption and high noise immunity, ensuring efficient and reliable operation.

Terminal Form: BALL

Facilitates reliable and secure connections to the circuit board, reducing the risk of signal loss or disconnection.

Nominal Supply Voltage: 1 V

Supports standard voltage requirements, making it compatible with a wide range of electronic systems.

Terminal Pitch: 0.5 mm

Offers precise and compact connections, enabling high-density integration in complex electronic systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS095TS-FCSG536I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B536

Length:

16 mm

No. of Terminals:

536

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA536,30X30,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

MPFS095TS-FCSG536I Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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