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IGW40N60H3FKSA1

Infineon Technologies

IGW40N60H3FKSA1 by Infineon Technologies

N-CHANNEL; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): 80 A; JESD-30 Code: R-PSFM-T3; Nominal Turn On Time (ton): 48 ns;

Median Price

$3.686

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 61 parts In-Stock

1+ parts

$0.808

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$0.808

-

-

-

Chip1Stop

Japan . 180 parts In-Stock

1+ parts

$2.330

100+ parts

$2.120

1k+ parts

$2.110

10k+ parts

$1.860

180

$2.330

$2.120

$2.110

$1.860

RS (Exports)

UK . 240 parts In-Stock

1+ parts

$3.686

100+ parts

$3.076

1k+ parts

$2.842

10k+ parts

-

240

$3.686

$3.076

$2.842

-

Element14

Singapore . 59 parts In-Stock

1+ parts

$4.524

100+ parts

$2.869

1k+ parts

$2.437

10k+ parts

-

59

$4.524

$2.869

$2.437

-

Farnell

UK . 58 parts In-Stock

1+ parts

$4.932

100+ parts

$2.790

1k+ parts

$2.453

10k+ parts

-

58

$4.932

$2.790

$2.453

-

DigiKey

USA . 186 parts In-Stock

1+ parts

$5.040

100+ parts

$2.823

1k+ parts

$1.974

10k+ parts

$1.853

186

$5.040

$2.823

$1.974

$1.853

Newark

USA . 382 parts In-Stock

1+ parts

$6.680

100+ parts

$5.160

1k+ parts

$4.380

10k+ parts

-

382

$6.680

$5.160

$4.380

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Verical

USA . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.075

10k+ parts

$1.950

390

-

-

$2.075

$1.950

Rochester

USA . 390 parts In-Stock

1+ parts

-

100+ parts

$1.850

1k+ parts

$1.660

10k+ parts

$1.560

390

-

$1.850

$1.660

$1.560

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 307 parts In-Stock

1+ parts

$3.025

100+ parts

-

1k+ parts

-

10k+ parts

-

307

$3.025

-

-

-

Schukat

Germany . 88 parts In-Stock

1+ parts

$4.051

100+ parts

$2.839

1k+ parts

-

10k+ parts

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88

$4.051

$2.839

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-

Vyrian

USA . 4,283 parts In-Stock

1+ parts

-

100+ parts

-

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4,283

-

-

-

-

NAC Semi

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.490

10k+ parts

$3.220

1,680

-

-

$3.490

$3.220

Rutronik

Germany . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 23,080 parts In-Stock

1+ parts

$0.522

100+ parts

$0.501

1k+ parts

$0.480

10k+ parts

-

23,080

$0.522

$0.501

$0.480

-

Corphita

USA . 997 parts In-Stock

1+ parts

$2.866

100+ parts

-

1k+ parts

-

10k+ parts

-

997

$2.866

-

-

-

Continental Prestige Electronics

USA . 236 parts In-Stock

1+ parts

$5.040

100+ parts

$2.670

1k+ parts

$2.560

10k+ parts

-

236

$5.040

$2.670

$2.560

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Microchip USA

USA . 4,938 parts In-Stock

1+ parts

$16.156

100+ parts

-

1k+ parts

-

10k+ parts

-

4,938

$16.156

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

-

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Perfect Parts

USA . 1,512 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

1,512

-

-

-

-

Eastek

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

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960

-

-

-

-

GreenTree Electronics

Israel . 240 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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240

-

-

-

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iodParts Technologies Inc.

India . 208 parts In-Stock

1+ parts

-

100+ parts

$4.556

1k+ parts

-

10k+ parts

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208

-

$4.556

-

-

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IGW40N60H3FKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

249 ns

Nominal Turn On Time (ton):

48 ns

Trade Compliance

IGW40N60H3FKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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