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IGW40T120

Infineon Technologies

IGW40T120 by Infineon Technologies

IGW40T120 by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 1200V and a max collector current of 75A. It is designed for power control applications, featuring a nominal turn-off time of 700ns and a max power dissipation of 270W. The transistor has a package style of FLANGE MOUNT and operates at temperatures up to 150°C.

Median Price

$5.890

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 244 parts In-Stock

1+ parts

$6.400

100+ parts

$4.480

1k+ parts

$4.320

10k+ parts

$4.300

244

$6.400

$4.480

$4.320

$4.300

RS (Exports)

UK . 207 parts In-Stock

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$5.381

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207

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$5.381

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Vyrian

USA . 164 parts In-Stock

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$5.381

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164

$5.381

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Digiode

USA . 378 parts In-Stock

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$6.080

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378

$6.080

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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Sogenti Electronics

Canada . 10 parts In-Stock

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10

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 23,828 parts In-Stock

1+ parts

$1.161

100+ parts

$1.115

1k+ parts

$1.068

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-

23,828

$1.161

$1.115

$1.068

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Corphita

USA . 687 parts In-Stock

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$5.760

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687

$5.760

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Andel Nordic

Denmark . 405 parts In-Stock

1+ parts

$55.190

100+ parts

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1k+ parts

$38.635

10k+ parts

$38.635

405

$55.190

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$38.635

$38.635

Lixinc

USA . 9,039 parts In-Stock

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Metaverse IC Inc.

Canada . 3,564 parts In-Stock

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Perfect Parts

USA . 1,296 parts In-Stock

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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Overview

Upgrade your power control systems with the IGW40T120 by Infineon Technologies. This N-CHANNEL Insulated Gate Bipolar Transistor offers unmatched quality and reliability, making it the perfect choice for a wide range of applications. With a maximum collector-emitter voltage of 1200V and a nominal turn off time of 700 ns, this single-configured transistor delivers exceptional performance and efficiency. Trust Infineon Technologies to provide you with top-of-the-line components that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, leading to better durability and reliability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and switching capabilities in electronic circuits.

Configuration: SINGLE

Simplifies circuit design and implementation, making it easier to integrate into various applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in high-power systems.

Package Shape: RECTANGULAR

A common and versatile shape that makes it easy to mount and incorporate into different types of circuit boards.

Nominal Turn Off Time (toff): 700 ns

Fast turn-off time helps in quickly controlling the power flow, improving efficiency and reducing heat generation.

Maximum Power Dissipation (Abs): 270 W

Can handle high power levels without being damaged, suitable for demanding applications.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, making it suitable for industrial and automotive applications.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating allows for the control of high-power circuits, suitable for industrial and power electronics applications.

Maximum Gate-Emitter Voltage: 20 V

Adequate voltage rating for gate control, ensuring proper operation and protection of the transistor.

Maximum Collector Current (IC): 75 A

High current handling capability enables it to control large loads and power systems effectively.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable connections.

Nominal Turn On Time (ton): 92 ns

Fast turn-on time allows for quick response and switching of the transistor, improving overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IGW40T120 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

700 ns

Nominal Turn On Time (ton):

92 ns

Trade Compliance

IGW40T120 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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