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IGW40N120H3XK

Infineon Technologies

IGW40N120H3XK by Infineon Technologies

IGW40N120H3XK by Infineon Technologies is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 80A max collector current, and 414ns turn-off time. Ideal for power control applications, this single configuration transistor operates at a max temperature of 175°C in a rectangular package style.

Median Price

$5.520

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$5.520

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$5.520

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Digiode

USA . 638 parts In-Stock

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638

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Vyrian

USA . 426 parts In-Stock

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426

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 961 parts In-Stock

1+ parts

$1.170

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961

$1.170

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Corohmni

South Africa . 403 parts In-Stock

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$1.339

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403

$1.339

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Modulus Dynamics

Lithuania . 14,152 parts In-Stock

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$1.654

100+ parts

$1.588

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$1.522

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14,152

$1.654

$1.588

$1.522

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Aranea Global

USA . 100 parts In-Stock

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$5.409

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$5.193

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100

$5.409

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Continental Prestige Electronics

USA . 6,437 parts In-Stock

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$5.520

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$5.409

6,437

$5.520

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$5.409

AZTECH Wire

Italy . 450 parts In-Stock

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$16.334

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$16.334

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Ampacity Inc.

Singapore . 542 parts In-Stock

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$65.050

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542

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Argo Parts USA

USA . 3,004 parts In-Stock

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Corphita

USA . 740 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Enhance your power control applications with the IGW40N120H3XK from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that offer unmatched performance and reliability. This N-CHANNEL transistor boasts a fast turn-on time of 78 ns and a maximum collector-emitter voltage of 1200 V, making it ideal for various power control needs. With Infineon's commitment to excellence, you can trust that this product will provide the value, benefits, and advantages you're looking for in your projects. Elevate your designs with the IGW40N120H3XK and experience the difference Infineon can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the transistor, ensuring durability and reliability in different operating conditions.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower resistance and faster switching speeds compared to P-CHANNEL types, making them suitable for high-power applications such as power control.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum voltage rating allows this IGBT to handle high voltage applications, providing safety and reliability in power control systems.

Maximum Collector Current (IC): 80 A

With a high maximum collector current rating, this IGBT can handle high power loads, making it suitable for power control applications requiring high current handling capacity.

Nominal Turn On Time (ton): 78 ns

The fast nominal turn on time of 78 ns ensures quick switching speeds, allowing for efficient power control and performance in various applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IGW40N120H3XK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

414 ns

Nominal Turn On Time (ton):

78 ns

Trade Compliance

IGW40N120H3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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