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IGW40N65H5

Infineon Technologies

IGW40N65H5 by Infineon Technologies

IGW40N65H5 by Infineon Technologies is an N-CHANNEL IGBT transistor with a max VCEsat of 2.1V and a max IC of 74A, suitable for POWER CONTROL applications. It has a package style of FLANGE MOUNT, can handle up to 650V and dissipate 250W, with operating temperatures ranging from -40°C to 175°C.

Median Price

$5.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38,421 parts In-Stock

1+ parts

$2.150

100+ parts

$2.020

1k+ parts

$1.820

10k+ parts

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38,421

$2.150

$2.020

$1.820

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Mouser Electronics

USA . 752 parts In-Stock

1+ parts

$5.380

100+ parts

$2.750

1k+ parts

$2.290

10k+ parts

$2.000

752

$5.380

$2.750

$2.290

$2.000

Chip1Stop

Japan . 57 parts In-Stock

1+ parts

$7.290

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-

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-

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57

$7.290

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Distributors (In-Stock)

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Digiode

USA . 927 parts In-Stock

1+ parts

$2.042

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-

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927

$2.042

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Vyrian

USA . 932 parts In-Stock

1+ parts

$2.150

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932

$2.150

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ComSIT Distribution GmbH

Germany . 15,000 parts In-Stock

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15,000

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Bristol Electronics

USA . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 16,938 parts In-Stock

1+ parts

$1.198

100+ parts

$1.150

1k+ parts

$1.102

10k+ parts

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16,938

$1.198

$1.150

$1.102

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Corphita

USA . 103 parts In-Stock

1+ parts

$1.935

100+ parts

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103

$1.935

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Perfect Parts

USA . 736 parts In-Stock

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736

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Overview

Experience the next level of power control with Infineon Technologies' IGW40N65H5 Insulated Gate Bipolar Transistor. As a global leader in semiconductor solutions, Infineon ensures top-quality products that deliver unparalleled performance and reliability. The IGW40N65H5 is designed for a wide range of applications, offering efficient power management and high-speed switching capabilities. With a maximum collector-emitter voltage of 650V and a collector current of 74A, this N-channel transistor provides exceptional power dissipation and temperature resistance. Upgrade your power control systems with Infineon's IGW40N65H5 for superior efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and faster switching speeds compared to P-channel types, making them suitable for power control applications.

Configuration: SINGLE

Single configuration IGBTs simplify circuit design and reduce complexity, making them easier to implement and troubleshoot.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers efficient and reliable performance when handling high power levels.

Maximum VCEsat: 2.1 V

The low maximum VCEsat value indicates minimal voltage drop across the collector-emitter junction when conducting, leading to reduced power dissipation and higher efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier mounting and integration into circuit designs, enhancing overall versatility and usability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections to external circuitry, ensuring minimal signal loss and improved overall performance.

Nominal Turn Off Time (toff): 178 ns

The fast nominal turn-off time ensures quick switching between on and off states, reducing switching losses and improving efficiency in power control applications.

No. of Terminals: 3

Having 3 terminals allows for simplified connection and operation within a circuit, enhancing overall ease of use and integration.

Maximum Power Dissipation (Abs): 250 W

The high maximum power dissipation rating allows for reliable operation under high power conditions without the risk of overheating or performance degradation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure and stable mounting options, ensuring the IGBT remains firmly in place during operation for improved reliability.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance allows the IGBT to withstand elevated temperatures without compromising performance or reliability.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage rating makes this IGBT suitable for high voltage applications, providing a wide range of operational possibilities.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its reliability and performance, ensuring stable and consistent operation of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

The high maximum gate-emitter voltage rating allows for precise and reliable control over the switching behavior of the IGBT, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance enables the IGBT to function reliably in cold environments without the risk of performance degradation or failure.

Maximum Collector Current (IC): 74 A

The high maximum collector current rating allows the IGBT to handle large currents without the risk of overheating or damage, ensuring reliable operation.

Maximum Gate-Emitter Threshold Voltage: 4.8 V

The gate-emitter threshold voltage determines the minimum voltage required to turn the IGBT on, providing precise control over its operation for optimal performance.

Terminal Finish: TIN

The tin terminal finish offers good corrosion resistance and solderability, ensuring reliable and long-lasting connections in various operating environments.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and connectivity within a circuit, reducing the risk of errors and improving overall ease of use.

Case Connection: COLLECTOR

The case connection at the collector terminal provides a direct path for heat dissipation, ensuring efficient cooling and preventing thermal buildup during operation.

Nominal Turn On Time (ton): 34 ns

The fast nominal turn-on time enables quick switching from an off to on state, improving response times and efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IGW40N65H5 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

4.8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

178 ns

Nominal Turn On Time (ton):

34 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IGW40N65H5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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