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IGW40T120FKSA1

Infineon Technologies

IGW40T120FKSA1 by Infineon Technologies

IGW40T120FKSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 75A. It is designed for power control applications and has a nominal turn-off time of 700ns.

Median Price

$5.740

Lifecycle Status

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Chip1Stop

Japan . 240 parts In-Stock

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$3.550

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$3.180

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$3.070

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$3.020

240

$3.550

$3.180

$3.070

$3.020

Farnell

UK . 405 parts In-Stock

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$4.640

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$3.240

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405

$4.640

$3.240

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Bürklin Elektronik

Germany . 6 parts In-Stock

1+ parts

$6.440

100+ parts

$5.670

1k+ parts

$5.170

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$4.880

6

$6.440

$5.670

$5.170

$4.880

Element14

Singapore . 415 parts In-Stock

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$6.816

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$4.626

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$4.551

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415

$6.816

$4.626

$4.551

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Distrelec

Netherlands . 20 parts In-Stock

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$7.339

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20

$7.339

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DigiKey

USA . 405 parts In-Stock

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$7.830

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$4.536

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$3.813

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405

$7.830

$4.536

$3.813

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RS (Exports)

UK . 207 parts In-Stock

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-

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$5.039

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$4.826

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-

207

-

$5.039

$4.826

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Rochester

USA . 88 parts In-Stock

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-

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$3.320

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$2.970

10k+ parts

$2.790

88

-

$3.320

$2.970

$2.790

Arrow

USA . 60 parts In-Stock

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-

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$4.524

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$3.779

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60

-

$4.524

$3.779

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Verical

USA . 15 parts In-Stock

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$448.048

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$448.048

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Digiode

USA . 206 parts In-Stock

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$2.774

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$2.774

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Nova Conductors

Japan . 400 parts In-Stock

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$4.823

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400

$4.823

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TME

Poland . 23 parts In-Stock

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$7.650

100+ parts

$6.070

1k+ parts

$5.660

10k+ parts

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23

$7.650

$6.070

$5.660

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Vyrian

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Chip Stock

USA . 4,640 parts In-Stock

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4,640

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RLX Solution Inc.

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Rutronik

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240

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Corohmni

South Africa . 19 parts In-Stock

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$0.866

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19

$0.866

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

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$1.261

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120

$1.261

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Modulus Dynamics

Lithuania . 7,315 parts In-Stock

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$1.485

100+ parts

$1.426

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$1.366

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7,315

$1.485

$1.426

$1.366

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Corphita

USA . 61 parts In-Stock

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$2.628

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61

$2.628

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Netroflash

USA . 50 parts In-Stock

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$4.823

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$4.581

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$4.485

50

$4.823

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$4.581

$4.485

Continental Prestige Electronics

USA . 234 parts In-Stock

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$6.510

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$4.040

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Ampacity Inc.

Singapore . 209 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Perfect Parts

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Argo Parts USA

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 240 parts In-Stock

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Glotronic Ltd.

UK . 84 parts In-Stock

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Overview

Discover the powerful IGW40T120FKSA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor (IGBT) that revolutionizes power control applications. With its N-CHANNEL configuration and single element design, this rectangular-shaped transistor offers unrivaled performance and reliability. Whether you need to control power in industrial machinery, renewable energy systems, or electric vehicles, the IGW40T120FKSA1 delivers exceptional functionality. Experience the value of this product with its fast turn-on time, low turn-off time, and maximum collector-emitter voltage of 1200V. Trust in Infineon Technologies for cutting-edge solutions that enhance your operations and drive your success forward.

Feature Benefit Bullets

Insulated Gate Bipolar Transistor (IGBT) Technology

Utilizes advanced IGBT technology for efficient power control applications, ensuring optimal performance and reliability.

N-Channel Polarity

The N-channel design provides improved conductivity and higher current-handling capability, enhancing overall power efficiency.

Single Configuration

Features a single IGBT element, simplifying circuit design and reducing complexity for enhanced ease of use.

Rectangular Package Shape

Designed in a rectangular shape for convenient installation and space-saving integration into various electronic systems.

Through-Hole Terminal Form

Equipped with through-hole terminals for secure and reliable connections, ensuring stability even in rugged environments.

Power Control Applications

Ideal for various power control applications, including motor drives, inverters, and power supplies, enabling efficient and reliable power management.

Flange Mount Package Style

Offers a flange mount package style for easy mounting and secure attachment, enabling hassle-free installation.

High Maximum Operating Temperature

Withstand temperatures up to 150°C, allowing the IGBT to operate reliably under demanding conditions.

High Maximum Collector-Emitter Voltage

Withstands voltages up to 1200 V, ensuring stable operation and versatility in different voltage applications.

Silicon Transistor Element Material

Utilizes silicon as the transistor element material, offering excellent performance, durability, and thermal conductivity.

High Maximum Collector Current

Capable of handling up to 75 A of collector current, enabling efficient power flow and managing high-output systems.

Fast Nominal Turn Off and Turn On Times

Provides precise control with a nominal turn off time of 700 ns and a nominal turn on time of 92 ns, facilitating rapid switching and reducing power loss for efficient operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IGW40T120FKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

700 ns

Nominal Turn On Time (ton):

92 ns

Trade Compliance

IGW40T120FKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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