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CY7C1069DV33-10ZSXIT

Cypress Semiconductor

CY7C1069DV33-10ZSXIT by Cypress Semiconductor

CY7C1069DV33-10ZSXIT by Cypress Semiconductor is a 3.3V SRAM with 2Mx8 organization, operating at -40 to 85°C. It features a fast access time of 10ns, ideal for industrial applications requiring high-speed memory solutions in a compact thin profile package.

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Overview

Experience unparalleled speed, reliability, and performance with the CY7C1069DV33-10ZSXIT by Cypress Semiconductor. As a leading manufacturer in the industry, Cypress Semiconductor delivers top-quality SRAM products that excel in applications requiring fast and efficient data storage. With a wide range of benefits including a high memory density of 16Mbit, low power consumption, and industrial-grade temperature tolerance, this product is a must-have for customers looking to enhance their systems' capabilities. Trust Cypress Semiconductor to provide you with cutting-edge technology that ensures seamless operation and superior results. Elevate your projects with the CY7C1069DV33-10ZSXIT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the SRAM, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during production.

Operating Mode: ASYNCHRONOUS

Enables faster data transfer and processing without the need for synchronization signals, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient operation while maintaining power efficiency.

No. of Terminals: 54

Provides multiple connection points for interface with other components, increasing versatility.

Memory Width: 8

8-bit memory width allows for efficient data storage and retrieval, enhancing system performance.

Maximum Access Time: 10 ns

Quick access time ensures fast read and write operations, improving overall processing speed.

Technical Specifications

SRAM CY7C1069DV33-10ZSXIT attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.415 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

54

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.025 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

175 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY7C1069DV33-10ZSXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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