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CY7C1061G30-10BVJXI

Infineon Technologies

CY7C1061G30-10BVJXI by Infineon Technologies

Infineon's CY7C1061G30-10BVJXI is a 1MX16 SRAM with 10ns access time, operating at 3V. It features a very thin profile grid array package and CMOS technology. Ideal for industrial applications requiring fast parallel memory operations.

Median Price

$21.520

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 480 parts In-Stock

1+ parts

$20.500

100+ parts

-

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-

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480

$20.500

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Arrow

USA . 380 parts In-Stock

1+ parts

$21.470

100+ parts

$17.260

1k+ parts

-

10k+ parts

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380

$21.470

$17.260

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-

Newark

USA . 455 parts In-Stock

1+ parts

$21.520

100+ parts

$18.330

1k+ parts

-

10k+ parts

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455

$21.520

$18.330

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-

Mouser Electronics

USA . 122 parts In-Stock

1+ parts

$27.040

100+ parts

$23.790

1k+ parts

$23.380

10k+ parts

-

122

$27.040

$23.790

$23.380

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Flip Electronics (Authorized)

USA . 42,581 parts In-Stock

1+ parts

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42,581

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DigiKey

USA . 22,005 parts In-Stock

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$23.800

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22,005

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$23.800

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Verical

USA . 21,896 parts In-Stock

1+ parts

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$25.410

10k+ parts

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21,896

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-

$25.410

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Rochester

USA . 1,128 parts In-Stock

1+ parts

-

100+ parts

$17.000

1k+ parts

$15.210

10k+ parts

$14.310

1,128

-

$17.000

$15.210

$14.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 235 parts In-Stock

1+ parts

$17.936

100+ parts

-

1k+ parts

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235

$17.936

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-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$23.782

100+ parts

-

1k+ parts

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100

$23.782

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-

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Flip Electronics

USA . 41,583 parts In-Stock

1+ parts

-

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41,583

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Vyrian

USA . 6,455 parts In-Stock

1+ parts

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6,455

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Bristol Electronics

USA . 2,818 parts In-Stock

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2,818

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IBS Electronics

USA . 480 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$26.633

10k+ parts

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480

-

-

$26.633

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 255 parts In-Stock

1+ parts

$2.390

100+ parts

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255

$2.390

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Semicontronic

India . 14,690 parts In-Stock

1+ parts

$16.050

100+ parts

$15.649

1k+ parts

$15.568

10k+ parts

-

14,690

$16.050

$15.649

$15.568

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Ampacity Inc.

Singapore . 7,325 parts In-Stock

1+ parts

$16.050

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7,325

$16.050

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Corphita

USA . 607 parts In-Stock

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$16.992

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607

$16.992

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Modulus Dynamics

Lithuania . 814 parts In-Stock

1+ parts

$20.388

100+ parts

$19.572

1k+ parts

$18.757

10k+ parts

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814

$20.388

$19.572

$18.757

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Corohmni

South Africa . 737 parts In-Stock

1+ parts

$20.388

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737

$20.388

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$23.307

100+ parts

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$22.375

10k+ parts

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50

$23.307

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$22.375

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Continental Prestige Electronics

USA . 2,070 parts In-Stock

1+ parts

$23.782

100+ parts

-

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$23.307

2,070

$23.782

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$23.307

Component Stockers USA

USA . 97 parts In-Stock

1+ parts

$24.400

100+ parts

$19.260

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97

$24.400

$19.260

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QUARKTWIN TECHNOLOGY LTD

USA . 17,645 parts In-Stock

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17,645

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iodParts Technologies Inc.

India . 5,415 parts In-Stock

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5,415

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Argo Parts USA

USA . 2,846 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock unparalleled performance and reliability with the CY7C1061G30-10BVJXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers cutting-edge SRAM technology that guarantees seamless operation in various applications. Experience lightning-fast access times, low power consumption, and exceptional data retention with this product. Elevate your projects with the superior quality and value that only Infineon can provide. Upgrade to the CY7C1061G30-10BVJXI and revolutionize your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the SRAM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and secure installation on printed circuit boards, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Enables efficient and independent operation of the SRAM, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage level for reliable and stable operation of the SRAM.

Technology: CMOS

Utilizes low power consumption and high noise immunity, making the SRAM energy-efficient and reliable.

Memory IC Type: STANDARD SRAM

Offers industry-standard memory technology for compatibility with various systems and applications.

Technical Specifications

SRAM CY7C1061G30-10BVJXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

CY7C1061G30-10BVJXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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