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CY7C1020DV33-10ZSXI

Infineon Technologies

CY7C1020DV33-10ZSXI by Infineon Technologies

Infineon's CY7C1020DV33-10ZSXI is a 32Kx16 SRAM with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, 10ns access time, and 44 terminals in a small outline package. Ideal for industrial applications requiring fast and reliable memory storage.

Median Price

$4.823

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 39 parts In-Stock

1+ parts

$4.823

100+ parts

$4.057

1k+ parts

$3.579

10k+ parts

$3.579

39

$4.823

$4.057

$3.579

$3.579

Farnell

UK . 496 parts In-Stock

1+ parts

$5.010

100+ parts

$3.900

1k+ parts

$3.390

10k+ parts

-

496

$5.010

$3.900

$3.390

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Chip1Stop

Japan . 273 parts In-Stock

1+ parts

$6.160

100+ parts

-

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273

$6.160

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Mouser Electronics

USA . 58 parts In-Stock

1+ parts

$6.630

100+ parts

$5.940

1k+ parts

$4.350

10k+ parts

-

58

$6.630

$5.940

$4.350

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Newark

USA . 540 parts In-Stock

1+ parts

$7.050

100+ parts

$4.690

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-

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540

$7.050

$4.690

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Flip Electronics (Authorized)

USA . 22,712 parts In-Stock

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22,712

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Verical

USA . 17,550 parts In-Stock

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$1.106

17,550

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$1.106

DigiKey

USA . 17,532 parts In-Stock

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-

100+ parts

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1k+ parts

$3.910

10k+ parts

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17,532

-

-

$3.910

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Rochester

USA . 1,636 parts In-Stock

1+ parts

-

100+ parts

$4.210

1k+ parts

$3.770

10k+ parts

$3.540

1,636

-

$4.210

$3.770

$3.540

RS (Exports)

UK . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.979

10k+ parts

-

440

-

-

$2.979

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 317 parts In-Stock

1+ parts

$3.544

100+ parts

-

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317

$3.544

-

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Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$4.779

100+ parts

-

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-

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83

$4.779

-

-

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Bristol Electronics

USA . 85 parts In-Stock

1+ parts

$8.960

100+ parts

$3.882

1k+ parts

-

10k+ parts

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85

$8.960

$3.882

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Flip Electronics

USA . 12,912 parts In-Stock

1+ parts

-

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12,912

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Vyrian

USA . 4,319 parts In-Stock

1+ parts

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4,319

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DigiKey Marketplace

USA . 478 parts In-Stock

1+ parts

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478

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NAC Semi

USA . 270 parts In-Stock

1+ parts

-

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$5.500

10k+ parts

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270

-

-

$5.500

-

EZ Electronic Parts

Israel . 233 parts In-Stock

1+ parts

-

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233

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J2 Sourcing AB

Sweden . 51 parts In-Stock

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51

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Cyclops Electronics Ltd

UK . 43 parts In-Stock

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43

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Semi Source

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,122 parts In-Stock

1+ parts

$1.430

100+ parts

$1.373

1k+ parts

$1.316

10k+ parts

-

4,122

$1.430

$1.373

$1.316

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Ampacity Inc.

Singapore . 4,101 parts In-Stock

1+ parts

$2.530

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4,101

$2.530

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Semicontronic

India . 3,955 parts In-Stock

1+ parts

$2.530

100+ parts

$2.467

1k+ parts

$2.454

10k+ parts

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3,955

$2.530

$2.467

$2.454

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Corphita

USA . 472 parts In-Stock

1+ parts

$3.357

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472

$3.357

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Component Stockers USA

USA . 3,525 parts In-Stock

1+ parts

$4.360

100+ parts

$3.030

1k+ parts

$4.310

10k+ parts

-

3,525

$4.360

$3.030

$4.310

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Continental Prestige Electronics

USA . 1,226 parts In-Stock

1+ parts

$4.779

100+ parts

-

1k+ parts

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10k+ parts

$4.684

1,226

$4.779

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-

$4.684

A-Z Elektronik GmbH

Germany . 5,439 parts In-Stock

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5,439

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Argo Parts USA

USA . 4,419 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,626 parts In-Stock

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3,626

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Perfect Parts

USA . 3,258 parts In-Stock

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3,258

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 548 parts In-Stock

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548

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock the power of reliable and high-performance memory with the CY7C1020DV33-10ZSXI by Infineon Technologies. This top-notch SRAM chip boasts unparalleled quality, thanks to Infineon's expertise in semiconductor manufacturing. Ideal for a wide range of applications, this memory module offers customers a seamless and efficient solution for their data storage needs. Experience the value and benefits of Infineon's cutting-edge technology with the CY7C1020DV33-10ZSXI - a game-changer in the world of memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, providing protection for the internal components.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Memory Density: 524288 bit

High memory density for storing a large amount of data.

Maximum Access Time: 10 ns

Fast access time for quick retrieval of data.

Technical Specifications

SRAM CY7C1020DV33-10ZSXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.003 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

CY7C1020DV33-10ZSXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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