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MAX9985ETX+T

Analog Devices

MAX9985ETX+T by Analog Devices

Analog Devices' MAX9985ETX+T is a Cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, BICMOS technology, and RF/baseband circuit make it ideal for telecom applications. With a low profile of 0.8mm and no-lead terminal form, it offers high performance in compact designs.

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1k+

MAX9985ETX+T by Analog Devices
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Vyrian

USA . 4,372 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,851 parts In-Stock

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Anansix

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Digiode

USA . 659 parts In-Stock

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AZTECH Wire

Italy . 496 parts In-Stock

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$9.131

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MARBEL Systems

Belgium . 1,778 parts In-Stock

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$14.875

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$14.280

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$13.834

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$13.090

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Kenton Components

USA . 4,273 parts In-Stock

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$17.850

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Qasali Group International

UK . 2,577 parts In-Stock

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Component Stockers USA

USA . 411 parts In-Stock

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Semicontronic

India . 940 parts In-Stock

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$385.000

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$375.375

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$373.450

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One Stop Electronics

USA . 1,946 parts In-Stock

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Ampacity Inc.

Singapore . 1,566 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Corphita

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Metaverse IC Inc.

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Kepictronics

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Overview

Unlock the potential of your cellphone with the MAX9985ETX+T from Analog Devices. Designed with precision and expertise, this Cellphone IC offers unparalleled performance and reliability. With a sleek SQUARE package shape and 36 terminals, this chip carrier is perfect for a wide range of applications in the telecom industry. Experience industrial-grade quality and innovation with the MAX9985ETX+T, providing customers with enhanced functionality and efficiency. Upgrade your devices today and discover the endless possibilities with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in the manufacturing process.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during assembly, ensuring proper alignment on the PCB.

No. of Terminals: 36

Higher number of terminals allows for increased connectivity options and functionality in the cellphone IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink, and very thin profile package styles offer efficient thermal management and compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extended temperature range, making the cellphone IC suitable for various applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish with annealing provides good solderability and durability for the terminals, enhancing the reliability of the cellphone IC.

Terminal Position: QUAD

Quad terminal position offers stable electrical connection and enables efficient routing of signals in the IC.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for compact and slim profile design of the cellphone IC.

Width: 6 mm

Narrow width facilitates space-saving integration of the IC in the overall design of the cellphone.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability during manufacturing process.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating environments.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption in the cellphone IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

RF and baseband circuit type in the cellphone IC enables seamless communication and processing of signals for enhanced cellular performance.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage enables compatibility with existing power sources in cellphone applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density packaging and efficient routing of signals in the cellphone IC.

Technical Specifications

Cellphone ICs MAX9985ETX+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX9985ETX+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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