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MAX9989ETP+

Analog Devices

MAX9989ETP+ by Analog Devices

MAX9989ETP+ by Analog Devices is a 20-terminal cellphone IC with BICMOS technology. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit in a square chip carrier package is surface mountable and has a terminal pitch of 0.65mm.

Median Price

$4.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MAX9989ETP+ by Analog Devices
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 936 parts In-Stock

1+ parts

-

100+ parts

$4.260

1k+ parts

$3.810

10k+ parts

$3.580

936

-

$4.260

$3.810

$3.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 194 parts In-Stock

1+ parts

$4.494

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$4.494

-

-

-

Vyrian

USA . 1,423 parts In-Stock

1+ parts

$4.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$4.730

-

-

-

Anansix

USA . 591 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

591

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,248 parts In-Stock

1+ parts

$4.020

100+ parts

$3.920

1k+ parts

$3.899

10k+ parts

-

1,248

$4.020

$3.920

$3.899

-

Corphita

USA . 2,018 parts In-Stock

1+ parts

$4.257

100+ parts

-

1k+ parts

-

10k+ parts

-

2,018

$4.257

-

-

-

MARBEL Systems

Belgium . 4,842 parts In-Stock

1+ parts

$9.120

100+ parts

-

1k+ parts

-

10k+ parts

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4,842

$9.120

-

-

-

Texas Native Microelectronics

USA . 75 parts In-Stock

1+ parts

$10.483

100+ parts

$10.064

1k+ parts

$9.749

10k+ parts

$9.225

75

$10.483

$10.064

$9.749

$9.225

Kenton Components

USA . 10 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

-

10k+ parts

$11.070

10

$12.580

-

-

$11.070

Qasali Group International

UK . 120 parts In-Stock

1+ parts

$28.304

100+ parts

-

1k+ parts

$26.323

10k+ parts

$24.908

120

$28.304

-

$26.323

$24.908

QUARKTWIN TECHNOLOGY LTD

USA . 9,255 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,255

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,500

-

-

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Overview

Upgrade your cellphone's performance with the MAX9989ETP+ by Analog Devices. This cutting-edge Cellphone IC boasts unmatched quality and reliability, thanks to its reputable manufacturer. With its surface mount design and compact square package shape, this IC is perfect for a wide range of applications. Experience unparalleled value and benefits with this telecom IC, offering enhanced RF and baseband circuit capabilities. Trust Analog Devices to deliver top-notch technology that exceeds expectations. Elevate your cellphone experience with the MAX9989ETP+.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient assembly onto a PCB, reducing manufacturing costs and saving space on the circuit board.

Package Shape: SQUARE

The square shape of the package provides a stable and secure mounting option, minimizing the risk of damage during handling or operation.

No. of Terminals: 20

The higher number of terminals allows for more connections and functionality within the IC, making it versatile and adaptable to various circuit designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is reliable and can withstand challenging environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function even in extremely cold environments, providing consistent performance in diverse settings.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and conductivity, ensuring reliable connections and signal transmission throughout the IC.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption, making it an efficient choice for cellphone applications.

Nominal Supply Voltage: 5 V

With a standard supply voltage of 5V, this IC is compatible with common power sources, simplifying integration into existing cellphone designs.

Technical Specifications

Cellphone ICs MAX9989ETP+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX9989ETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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