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MAX9986AETP

Analog Devices

MAX9986AETP by Analog Devices

MAX9986AETP by Analog Devices is a cellphone IC with 20 terminals in a square package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, with a nominal voltage of 5V for telecom applications.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,677 parts In-Stock

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Anansix

USA . 1,624 parts In-Stock

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Digiode

USA . 1,229 parts In-Stock

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MARBEL Systems

Belgium . 3,598 parts In-Stock

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$6.191

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Texas Native Microelectronics

USA . 451 parts In-Stock

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$7.116

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$6.831

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$6.618

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$6.262

451

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$6.831

$6.618

$6.262

Kenton Components

USA . 382 parts In-Stock

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$8.539

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$7.514

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AZTECH Wire

Italy . 547 parts In-Stock

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$16.280

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Qasali Group International

UK . 58 parts In-Stock

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$19.213

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$17.868

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$16.908

58

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One Stop Electronics

USA . 1,179 parts In-Stock

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$135.000

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Semicontronic

India . 1,083 parts In-Stock

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$986.000

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$961.350

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$956.420

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Corphita

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Overview

Experience the cutting-edge technology of Analog Devices with the MAX9986AETP, a top-tier Cellphone IC for your electronic needs. Designed with precision and quality in mind, this product offers exceptional performance and reliability. With a sleek square package style and industrial-grade temperature grade, the MAX9986AETP is perfect for telecommunications applications. Trust Analog Devices to deliver excellence in every product, providing you with the value, benefits, and advantages you deserve. Elevate your projects with the MAX9986AETP today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product, as components can be directly mounted onto the surface of the PCB.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the PCB and allowing for easier integration into smaller devices.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and functionalities in the product, making it versatile for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation, compact size, and optimal performance in a variety of operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that the product can withstand and perform reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function effectively in cold environments without any performance issues.

Terminal Finish: TIN LEAD

The terminal finish of tin lead provides good solderability, ensuring reliable electrical connections and easy assembly of the product.

Terminal Position: QUAD

The quad terminal position allows for efficient placement and connection of the product within the PCB, enhancing overall performance and reliability.

Maximum Seated Height: 0.8 mm

The maximum seated height of 0.8 mm enables a low-profile design, making it suitable for compact and slim devices.

Width: 5 mm

The width of 5 mm provides a compact form factor, allowing for easy integration into various electronic devices.

Length: 5 mm

The length of 5 mm contributes to the overall compact size of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in a wide range of temperature conditions typically found in industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form minimizes the risk of lead contamination and complies with environmental regulations, making it a more sustainable option.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit type enables the product to efficiently handle wireless communication signals, ensuring reliable connectivity and network performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides compatibility with a wide range of electronic systems and power sources, making it versatile for different applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for dense packing of terminals on the PCB, maximizing the functionality and performance of the product.

Technical Specifications

Cellphone ICs MAX9986AETP attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MAX9986AETP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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