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MAX9994ETP+T

Analog Devices

MAX9994ETP+T by Analog Devices

MAX9994ETP+T by Analog Devices is a cellphone IC with BICMOS technology. It operates b/w -40 to 85 °C, has 20 terminals in a square package, and requires a nominal voltage of 5V. This RF and baseband circuit is ideal for telecom applications due to its compact size and industrial temperature grade suitability.

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Vyrian

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Digiode

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Anansix

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AZTECH Wire

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MARBEL Systems

Belgium . 586 parts In-Stock

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$10.546

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Texas Native Microelectronics

USA . 562 parts In-Stock

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Kenton Components

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Qasali Group International

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$32.729

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Component Stockers USA

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One Stop Electronics

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Semicontronic

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Kepictronics

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Overview

Unlock the full potential of your cellphone with the MAX9994ETP+T by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch quality and reliability. Designed for cellphone ICs, this surface mount chip carrier offers a compact and efficient solution for RF and baseband circuit applications. With a wide operating temperature range and industrial-grade technology, this product ensures optimal performance in any environment. Elevate your mobile device experience with the MAX9994ETP+T and enjoy seamless connectivity and enhanced functionality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and lightweight design, making the product suitable for modern slim cellphones.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the PCB, enabling better placement and routing of other components.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for various functions and interfaces in the cellphone IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability even in demanding usage conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the IC to function in extreme cold environments without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish with annealing enhances solderability and durability of terminals, ensuring a robust connection during assembly and operation.

Terminal Position: QUAD

Quad terminal position enables easy mounting and alignment on the PCB, simplifying the manufacturing process.

Width: 5 mm

Compact width of 5 mm makes the IC suitable for small form factor devices like cellphones without compromising on functionality.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds ensures quick and efficient soldering process during manufacturing, saving time and production costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures proper bonding of components during assembly, leading to reliable operation of the IC.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh industrial environments, making it suitable for rugged cellphone applications.

Technology: BICMOS

BiCMOS technology combines the benefits of both bipolar and CMOS technologies, providing high speed and low power consumption for efficient cellphone operations.

Nominal Supply Voltage: 5 V

5V supply voltage is a common standard in cellphones, ensuring compatibility with existing power sources and electronic systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for high-density integration of components on the PCB, enabling efficient use of space in compact cellphones.

Technical Specifications

Cellphone ICs MAX9994ETP+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX9994ETP+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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