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MAX9986AETP+T

Analog Devices

MAX9986AETP+T by Analog Devices

MAX9986AETP+T by Analog Devices is a cellphone IC with 1 function, surface mount capability, and a square package shape. It is used in telecom applications for RF and baseband circuits.

Median Price

$10.270

Lifecycle Status

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4

In-Stock Inventory

1k+

MAX9986AETP+T by Analog Devices
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 21 parts In-Stock

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$10.270

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Anansix

USA . 1,436 parts In-Stock

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Vyrian

USA . 1,363 parts In-Stock

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Digiode

USA . 1,129 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 100 parts In-Stock

1+ parts

$10.270

100+ parts

$10.065

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100

$10.270

$10.065

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MARBEL Systems

Belgium . 3,180 parts In-Stock

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$11.491

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Texas Native Microelectronics

USA . 1,137 parts In-Stock

1+ parts

$13.208

100+ parts

$12.680

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$12.283

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$11.623

1,137

$13.208

$12.680

$12.283

$11.623

Kenton Components

USA . 500 parts In-Stock

1+ parts

$15.850

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$13.948

500

$15.850

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$13.948

AZTECH Wire

Italy . 297 parts In-Stock

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$17.263

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Qasali Group International

UK . 3,046 parts In-Stock

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$35.662

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$33.165

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$31.382

3,046

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$31.382

One Stop Electronics

USA . 1,088 parts In-Stock

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$156.000

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Ampacity Inc.

Singapore . 289 parts In-Stock

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$388.000

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Semicontronic

India . 355 parts In-Stock

1+ parts

$494.000

100+ parts

$481.650

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$479.180

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355

$494.000

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$479.180

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Authorized Procurement Solutions

USA . 32,040 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,783 parts In-Stock

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Kepictronics

USA . 4,035 parts In-Stock

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Component Stockers USA

USA . 2,867 parts In-Stock

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Corphita

USA . 1,955 parts In-Stock

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Lixinc

USA . 1,419 parts In-Stock

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Metaverse IC Inc.

Canada . 687 parts In-Stock

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687

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Overview

Discover the MAX9986AETP+T by Analog Devices, a high-quality cellphone IC that offers exceptional value and benefits to customers. Manufactured by Analog Devices, a renowned industry leader, this surface mount IC is designed to deliver outstanding performance in RF and baseband circuit applications. With its compact square shape, very thin profile, and 20 terminals, this chip carrier with heat sink/slug package provides easy integration and efficient operation. Experience reliable and robust functionality with a wide operating temperature range of -40 to 85°C. Trust Analog Devices to deliver superior quality and cutting-edge technology with the MAX9986AETP+T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and labor costs.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where size is a constraint.

No. of Terminals: 20

Having 20 terminals allows for connectivity to multiple components or circuits, increasing the flexibility and functionality of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability even under extreme environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to be used in a wide range of environments, from cold to hot conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term performance and durability.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a slim and compact design, making it ideal for applications where space is limited.

Width: 5 mm

The compact width of 5 mm further contributes to the space-saving design of the product, making it suitable for small form factor devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering during assembly, leading to reliable connections and reduced risk of solder joint failure.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the product can withstand harsh conditions typically found in industrial environments, ensuring robust performance.

Nominal Supply Voltage: 5 V

The 5V supply voltage is commonly used in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Technical Specifications

Cellphone ICs MAX9986AETP+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX9986AETP+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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