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Texas Instruments Other Function Telecom Interface ICs 306

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
CC1121RHBT by Texas Instruments

CC1121RHBT

Texas Instruments

CC1121RHBT by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a supply voltage of 3V and data rate of 0.2 Mbps. Ideal for telecom circuits, this IC is surface mountable and suitable for industrial applications.

.2 Mbps

S-PQCC-N32

e4

5 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

5 mm

BQ51013BYFPT by Texas Instruments

BQ51013BYFPT

Texas Instruments

BQ51013BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5 V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.

.002 Mbps

R-XBGA-B28

e1

3 mm

1

1

28

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

LMV1099TLX/NOPB by Texas Instruments

LMV1099TLX/NOPB

Texas Instruments

LMV1099TLX/NOPB by Texas Instruments is a telecom interface IC with 25 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it features very thin profile and fine pitch terminals ideal for telecom circuit applications.

S-XBGA-B25

e1

2.764 mm

1

1

25

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

2.64 mm

DS100BR111ASQ/NOPB by Texas Instruments

DS100BR111ASQ/NOPB

Texas Instruments

DS100BR111ASQ/NOPB by Texas Instruments is a telecom IC with 2 channels, operating at 10300 Mbps data rate. It has a package style of CHIP CARRIER and can withstand industrial temperature range from -40 to 85 °C. Suitable for telecom circuits requiring high-speed data transmission in compact form factor.

10300 Mbps

S-PQCC-N24

e3

4 mm

3

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

DS100BR111ASQE/NOPB by Texas Instruments

DS100BR111ASQE/NOPB

Texas Instruments

DS100BR111ASQE/NOPB by Texas Instruments is a telecom IC with 2 channels, operating at 10300 Mbps data rate. It has a package style of CHIP CARRIER and operates in industrial temperature range from -40 to 85 °C. Suitable for telecom circuits requiring high-speed data transmission.

10300 Mbps

S-PQCC-N24

e3

4 mm

3

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

RF430CL330HTB by Texas Instruments

RF430CL330HTB

Texas Instruments

Texas Instruments RF430CL330HTB is a CMOS telecom IC with 14 terminals, operating at 0-70°C. It has a supply voltage of 3.3V and is surface mountable in a small outline package. Ideal for telecom circuits, it offers dual terminal position and commercial temperature grade suitability.

R-PDSO-G14

1

14

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

DUAL

CC2564NSRVMR by Texas Instruments

CC2564NSRVMR

Texas Instruments

CC2564NSRVMR by Texas Instruments is a telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features matte tin terminal finish and very thin profile design.

S-PQCC-N40

e3

8 mm

3

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

8 mm

CC2564NSYFVR by Texas Instruments

CC2564NSYFVR

Texas Instruments

The Texas Instruments CC2564NSYFVR is a telecom IC with 54 terminals in a grid array package. It operates b/w -40°C to 85°C, with peak reflow temperature of 260°C. Suitable for industrial applications, it has a nominal voltage of 3.6V and features tin silver copper terminal finish.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564NYFVR by Texas Instruments

CC2564NYFVR

Texas Instruments

Texas Instruments CC2564NYFVR is a 54-terminal IC with industrial temperature grade. It operates at -40 to 85°C, with a peak reflow temp of 260°C. Ideal for telecom circuits, it has a nominal voltage of 3.6V and features surface mount packaging in plastic/epoxy material.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVR by Texas Instruments

CC2564YFVR

Texas Instruments

Texas Instruments CC2564YFVR is a telecom IC with 54 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. Ideal for industrial applications requiring reliable telecom circuit interfaces in a surface-mount grid array package.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVT by Texas Instruments

CC2564YFVT

Texas Instruments

The Texas Instruments CC2564YFVT is a telecom IC with 54 terminals, operating from -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. This rectangular grid array package is ideal for industrial telecom applications.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PGA5807RGCR by Texas Instruments

PGA5807RGCR

Texas Instruments

PGA5807RGCR by Texas Instruments is a 64-terminal telecom IC with a 3.3V supply voltage, operating from -40 to 85°C. It features a nickel palladium gold finish, no-lead terminal form, and quad position for industrial applications requiring very thin profile chip carriers in surface-mount packages.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

PGA5807RGCT by Texas Instruments

PGA5807RGCT

Texas Instruments

PGA5807RGCT by Texas Instruments is a 64-terminal telecom IC with a 3.3V supply voltage, operating b/w -40 to 85°C. It features a square chip carrier package style, nickel palladium gold terminal finish, and no-lead terminal form. Ideal for industrial applications requiring very thin profile packages in surface mount configurations.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

LMX5251SQX/NOPB by Texas Instruments

LMX5251SQX/NOPB

Texas Instruments

LMX5251SQX/NOPB by Texas Instruments is a 48-terminal IC with 3/3.3V power supplies, operating from -40 to 85°C. It features CMOS technology, matte tin finish, and 0.078mA max supply current. Ideal for telecom circuits, it comes in a square chip carrier package with a very thin profile for industrial applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3/3.3

Not Qualified

.8 mm

Other Telecom ICs

.078 mA

3.3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

LMX5252LQX/NOPB by Texas Instruments

LMX5252LQX/NOPB

Texas Instruments

LMX5252LQX/NOPB by Texas Instruments is a CMOS telecom IC with 36 terminals in a square chip carrier package. Operating b/w -40 to 85 °C, it requires 2.75V supply voltage and draws 0.055mA current. Ideal for telecom circuits, this IC has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.

S-XQCC-N36

e3

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.75

Not Qualified

.8 mm

Other Telecom ICs

.055 mA

2.75 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

6 mm

TCA5013ZAHR by Texas Instruments

TCA5013ZAHR

Texas Instruments

TCA5013ZAHR by Texas Instruments is a 48-terminal, telecom interface IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This square-shaped IC is designed for telecom circuits, featuring a thin profile package body suitable for surface mount applications.

S-PBGA-B48

e1

5 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

BQ500212ARGZT by Texas Instruments

BQ500212ARGZT

Texas Instruments

Texas Instruments BQ500212ARGZT is a telecom interface IC with 48 terminals in a square chip carrier package. Operating b/w -40 to 110°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for industrial applications requiring no-lead terminal form and MSL level 3 moisture sensitivity.

S-PQCC-N48

e4

7 mm

3

1

48

110 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

HPA02286ARLL by Texas Instruments

HPA02286ARLL

Texas Instruments

Texas Instruments' HPA02286ARLL is a 24-terminal telecom interface IC in a square chip carrier package. With a supply voltage of 3.3V, it operates b/w 0-85°C and has a terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface-mountable and features nickel palladium gold terminal finish.

S-PQCC-N24

e4

3 mm

2

1

24

85 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

WL1801MODGBMOCR by Texas Instruments

WL1801MODGBMOCR

Texas Instruments

WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCR by Texas Instruments

WL1805MODGBMOCR

Texas Instruments

Texas Instruments' WL1805MODGBMOCR is a Telecom Interface IC with 100 terminals in a grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for telecom circuits, this surface-mount IC has a compact rectangular shape and nickel palladium gold finish.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCT by Texas Instruments

WL1805MODGBMOCT

Texas Instruments

WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1831MODGBMOCT by Texas Instruments

WL1831MODGBMOCT

Texas Instruments

WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

XWL1801MODGAMOCT by Texas Instruments

XWL1801MODGAMOCT

Texas Instruments

XWL1801MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm x 13.4mm and terminal pitch of 0.7mm. Ideal for telecom interface applications requiring surface mount technology.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1805MODGAMOCT by Texas Instruments

XWL1805MODGAMOCT

Texas Instruments

XWL1805MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm width and 13.4mm length. Ideal for telecom circuits, this IC is surface mountable and has a terminal pitch of 0.7mm for various applications.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1831MODGAMOCT by Texas Instruments

XWL1831MODGAMOCT

Texas Instruments

XWL1831MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a grid array package. It operates b/w -20°C to 70°C, making it suitable for various telecom circuit applications. The compact rectangular design with bottom terminals and no-lead form factor ensures easy surface mount installation.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

XWL1835MODGAMOCT by Texas Instruments

XWL1835MODGAMOCT

Texas Instruments

XWL1835MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a nominal voltage of 3.7V. This IC is designed for telecom circuit applications requiring surface mount installation and has a compact size of 13.3mm x 13.4mm x 2mm.

R-PBGA-N100

13.4 mm

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

RECTANGULAR

GRID ARRAY

2 mm

3.7 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.7 mm

BOTTOM

13.3 mm

CC2538NF11RTQT by Texas Instruments

CC2538NF11RTQT

Texas Instruments

CC2538NF11RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable and features nickel palladium gold terminal finish.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538NF23RTQT by Texas Instruments

CC2538NF23RTQT

Texas Instruments

CC2538NF23RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates b/w -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable with nickel palladium gold finish and very thin profile.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538NF53RTQT by Texas Instruments

CC2538NF53RTQT

Texas Instruments

CC2538NF53RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates b/w -40 to 125°C, has 56 terminals in a square chip carrier package, and supports a 3V supply voltage. The IC is surface mountable and features nickel palladium gold terminal finish.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2538SF23RTQT by Texas Instruments

CC2538SF23RTQT

Texas Instruments

CC2538SF23RTQT by Texas Instruments is a telecom IC with 12 Mbps data rate, suitable for automotive applications. It operates at -40 to 125°C, has 56 terminals in a square package style, and supports a nominal voltage of 3V. This surface-mount IC features nickel palladium gold terminal finish and very thin profile packaging.

12 Mbps

S-PQCC-N56

e4

8 mm

3

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

CC2560BRVMR by Texas Instruments

CC2560BRVMR

Texas Instruments

CC2560BRVMR by Texas Instruments is a telecom IC with 76 terminals, operating at -40 to 85°C. It has a data rate of 4 Mbps and nominal voltage of 3.6V, suitable for telecom circuit applications. The package style is chip carrier with matte tin finish, measuring 7.73mm in width and 8mm in length.

4 Mbps

R-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

7.73 mm

CC2560BRVMT by Texas Instruments

CC2560BRVMT

Texas Instruments

Texas Instruments CC2560BRVMT is a 76-terminal telecom IC with matte tin finish. Operating b/w -40 to 85°C, it has a nominal voltage of 3.6V and terminal pitch of 0.6mm. Ideal for telecom circuits, this chip carrier is surface mountable and features an industrial temperature grade.

S-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

8 mm

CC2564BRVMT by Texas Instruments

CC2564BRVMT

Texas Instruments

Texas Instruments CC2564BRVMT is a 76-terminal telecom IC with a 3.6V supply voltage, operating b/w -40 to 85°C. It features matte tin finish, quad terminal position, and chip carrier package style for industrial applications requiring thin profile and surface mount compatibility.

R-PQCC-N76

e3

8 mm

3

1

76

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.6 mm

QUAD

30

7.73 mm

SN65DSI86ZQER by Texas Instruments

SN65DSI86ZQER

Texas Instruments

SN65DSI86ZQER by Texas Instruments is a 64-terminal, telecom interface IC with a data rate of 5400 Mbps. It operates b/w -40 to 85°C and has a supply voltage of 1.2V, making it suitable for industrial applications requiring high-speed data transmission in compact spaces. The package style is grid array with very thin profile and fine pitch, ideal for surface mount assembly processes.

5400 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

PGA5807ARGCR by Texas Instruments

PGA5807ARGCR

Texas Instruments

PGA5807ARGCR by Texas Instruments is a 64-terminal telecom IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a package style of chip carrier. Suitable for telecom circuits, it features nickel palladium gold terminal finish and is surface mountable.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

PGA5807ARGCT by Texas Instruments

PGA5807ARGCT

Texas Instruments

PGA5807ARGCT by Texas Instruments is a 64-terminal telecom interface IC in a square chip carrier package. With a supply voltage of 3.3V, it operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. Ideal for industrial applications requiring very thin profile components.

S-PQCC-N64

e4

9 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

9 mm

TLK10022CTR by Texas Instruments

TLK10022CTR

Texas Instruments

TLK10022CTR by Texas Instruments is a 144-terminal, telecom interface IC with data rate of 10 Gbps. It operates b/w -40 to 85°C and has a supply voltage of 1V. Ideal for industrial applications requiring high-speed telecommunications circuitry in compact form factor.

10000 Mbps

S-PBGA-B144

e1

13.05 mm

4

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

3.25 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.05 mm

TLK2711HFG/EM by Texas Instruments

TLK2711HFG/EM

Texas Instruments

TLK2711HFG/EM by Texas Instruments is a telecom IC with 68 terminals in a square package. It operates at 2.5V and has a terminal pitch of 0.64mm. This IC is suitable for telecom circuit applications due to its compact flatpack design and metal-sealed co-fired body material.

S-CQFP-F68

13.97 mm

1

68

CERAMIC, METAL-SEALED COFIRED

GQFF

SQUARE

FLATPACK, GUARD RING

NOT SPECIFIED

2.68 mm

2.5 V

YES

TELECOM CIRCUIT

FLAT

.64 mm

QUAD

NOT SPECIFIED

13.97 mm

RI-STU-MRD1-30 by Texas Instruments

RI-STU-MRD1-30

Texas Instruments

RI-STU-MRD1-30 by Texas Instruments is a 30-terminal RECTANGULAR package MICROELECTRONIC ASSEMBLY with -20 to 50 °C operating temp range. It features DUAL terminals, TELECOM CIRCUIT type, and 5V supply voltage. Ideal for telecom interface applications requiring reliable performance in various temperature conditions.

R-XDMA-T30

1

30

50 Cel

-20 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

5 V

NO

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

DUAL

CC2595RGTT by Texas Instruments

CC2595RGTT

Texas Instruments

CC2595RGTT by Texas Instruments is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include 3V supply voltage, surface mount design, and nickel palladium gold terminal finish.

S-PQCC-N16

e4

3 mm

2

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

3 mm

TLK2541PFPG4 by Texas Instruments

TLK2541PFPG4

Texas Instruments

TLK2541PFPG4 by Texas Instruments is a telecom IC with 80 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. Ideal for telecom circuits, it comes in a square package style with Gull Wing terminals and Nickel Palladium Gold finish.

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

TQFP80,.55SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1.2 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

SN75FC1000PJD by Texas Instruments

SN75FC1000PJD

Texas Instruments

SN75FC1000PJD by Texas Instruments is a telecom interface IC with 64 terminals, operating at 3.3V. It features BICMOS technology, GULL WING terminal form, and 0.5mm pitch. Ideal for telecom circuits, it has a temperature range of 0-70°C and low supply current of 0.25mA.

S-PQFP-G64

10 mm

1

64

70 Cel

0 Cel

PLASTIC/EPOXY

HTFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

NOT SPECIFIED

3.3

Not Qualified

1.2 mm

Other Telecom ICs

.25 mA

3.3 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

10 mm

CC2430F64RTCRG3 by Texas Instruments

CC2430F64RTCRG3

Texas Instruments

The Texas Instruments CC2430F64RTCRG3 is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, with a supply voltage of 3V. This CMOS technology IC is ideal for telecom circuit applications due to its compact size and industrial temperature grade suitability.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2430ZF128RTCG3 by Texas Instruments

CC2430ZF128RTCG3

Texas Instruments

Texas Instruments CC2430ZF128RTCG3 is a telecom IC with CMOS tech. It operates b/w -40 to 85°C, has 48 terminals in a square chip carrier package style. With a nominal voltage of 3V, it's ideal for telecom circuit applications requiring surface mount compatibility and a low profile design.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2430ZF128RTCRG3 by Texas Instruments

CC2430ZF128RTCRG3

Texas Instruments

Texas Instruments CC2430ZF128RTCRG3 is a 48-terminal IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it's ideal for compact designs requiring low power consumption.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

LM3290TME/NOPB by Texas Instruments

LM3290TME/NOPB

Texas Instruments

LM3290TME/NOPB by Texas Instruments is a 30-terminal GRID ARRAY IC with TIN SILVER COPPER finish. It operates b/w -30 to 85 °C, with peak reflow temp of 260C for telecom circuits. Its 0.4mm pitch and 0.675mm height make it suitable for compact telecom interface applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3290TMX/NOPB by Texas Instruments

LM3290TMX/NOPB

Texas Instruments

LM3290TMX/NOPB by Texas Instruments is a telecom IC with 30 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30 seconds. With a very thin profile and fine pitch, it's ideal for telecom circuit applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TME/NOPB by Texas Instruments

LM3291TME/NOPB

Texas Instruments

LM3291TME/NOPB by Texas Instruments is a 12-terminal IC with a rectangular package style. It operates b/w -30 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for telecom circuits due to its thin profile and fine pitch grid array package design.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30