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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7A12T-L1CSG325I by Xilinx

XC7A12T-L1CSG325I

Xilinx

XC7A12T-L1CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 12800 logic cells and 1000 CLBs. It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications requiring high-speed processing.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A12T-L2CPG236E by Xilinx

XC7A12T-L2CPG236E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1098 MHz

1.51 ns

HKMG

1000 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A25T-1CSG325C by Xilinx

XC7A25T-1CSG325C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A25T-1CSG325I by Xilinx

XC7A25T-1CSG325I

Xilinx

Xilinx XC7A25T-1CSG325I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A25T-2CSG325C by Xilinx

XC7A25T-2CSG325C

Xilinx

The Xilinx XC7A25T-2CSG325C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various industries. With a package style of grid array and low profile, it offers flexibility in design while maintaining high performance standards.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A25T-2CSG325I by Xilinx

XC7A25T-2CSG325I

Xilinx

Xilinx XC7A25T-2CSG325I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A25T-L2CSG325E by Xilinx

XC7A25T-L2CSG325E

Xilinx

Xilinx XC7A25T-L2CSG325E FPGA features 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. Ideal for high-performance applications requiring low power consumption and advanced programmability in a compact form factor.

FPGA

23360

150

150

1825

1098 MHz

1.51 ns

HKMG

1825 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7S15-1CSGA225C by Xilinx

XC7S15-1CSGA225C

Xilinx

Xilinx XC7S15-1CSGA225C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-1CSGA225I by Xilinx

XC7S15-1CSGA225I

Xilinx

Xilinx XC7S15-1CSGA225I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-2CSGA225C by Xilinx

XC7S15-2CSGA225C

Xilinx

The Xilinx XC7S15-2CSGA225C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-2CSGA225I by Xilinx

XC7S15-2CSGA225I

Xilinx

Xilinx XC7S15-2CSGA225I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Suitable for surface mount designs with a package style of grid array and fine pitch terminals.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-L1CSGA225I by Xilinx

XC7S15-L1CSGA225I

Xilinx

Xilinx XC7S15-L1CSGA225I FPGA offers 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-1CSGA225C by Xilinx

XC7S25-1CSGA225C

Xilinx

The Xilinx XC7S25-1CSGA225C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. The package style is grid array, low profile, fine pitch with PLASTIC/EPOXY material.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-1CSGA225I by Xilinx

XC7S25-1CSGA225I

Xilinx

XC7S25-1CSGA225I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-1CSGA324C by Xilinx

XC7S25-1CSGA324C

Xilinx

The Xilinx XC7S25-1CSGA324C is a FPGA with 23360 logic cells, 1825 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-2CSGA225I by Xilinx

XC7S25-2CSGA225I

Xilinx

The Xilinx XC7S25-2CSGA225I is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It operates b/w -40 to 100 °C and has a package style of GRID ARRAY for industrial applications.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-2CSGA324C by Xilinx

XC7S25-2CSGA324C

Xilinx

Xilinx XC7S25-2CSGA324C FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-2CSGA324I by Xilinx

XC7S25-2CSGA324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-L1CSGA225I by Xilinx

XC7S25-L1CSGA225I

Xilinx

Xilinx XC7S25-L1CSGA225I FPGA offers 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a wide operating temperature range from -40 to 100 °C.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-L1CSGA324I by Xilinx

XC7S25-L1CSGA324I

Xilinx

Xilinx XC7S25-L1CSGA324I FPGA offers 23360 logic cells, 1825 CLBs, and 1098 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with -40 to 100 °C operating temp range. Features low profile grid array package with 0.8 mm terminal pitch.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S50-2CSGA324C by Xilinx

XC7S50-2CSGA324C

Xilinx

The Xilinx XC7S50-2CSGA324C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S50-2CSGA324I by Xilinx

XC7S50-2CSGA324I

Xilinx

The Xilinx XC7S50-2CSGA324I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications for high-speed data processing due to its low profile package style and fine pitch grid array design.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S50-L1CSGA324I by Xilinx

XC7S50-L1CSGA324I

Xilinx

Xilinx XC7S50-L1CSGA324I FPGA has 52160 logic cells, 4075 CLBs, and operates at max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array with fine pitch terminals suitable for surface mount assembly.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S6-1CSGA225C by Xilinx

XC7S6-1CSGA225C

Xilinx

The Xilinx XC7S6-1CSGA225C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of grid array and low profile, it offers flexibility in design while maintaining a compact form factor.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S6-1CSGA225I by Xilinx

XC7S6-1CSGA225I

Xilinx

Xilinx XC7S6-1CSGA225I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S6-2CSGA225C by Xilinx

XC7S6-2CSGA225C

Xilinx

The Xilinx XC7S6-2CSGA225C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S6-2CSGA225I by Xilinx

XC7S6-2CSGA225I

Xilinx

Xilinx XC7S6-2CSGA225I FPGA offers 6000 logic cells, 469 CLBs, and 1286 MHz clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S6-L1CSGA225I by Xilinx

XC7S6-L1CSGA225I

Xilinx

Xilinx XC7S6-L1CSGA225I FPGA offers 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-1CSGA225Q by Xilinx

XC7S15-1CSGA225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S15-1FTGB196C by Xilinx

XC7S15-1FTGB196C

Xilinx

The Xilinx XC7S15-1FTGB196C is a 12800 logic cell FPGA with 1000 CLBs and 100 inputs/outputs. Operating at up to 1098 MHz, it has a combinatorial delay of 1.27 ns and supports a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-1FTGB196Q by Xilinx

XC7S15-1FTGB196Q

Xilinx

The Xilinx XC7S15-1FTGB196Q is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and wide operating temperature range from -40°C to 125°C.

FPGA

12800

100

100

1000

1098 MHz

1.27 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-2FTGB196C by Xilinx

XC7S15-2FTGB196C

Xilinx

Xilinx XC7S15-2FTGB196C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. Package style: GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S15-2FTGB196I by Xilinx

XC7S15-2FTGB196I

Xilinx

The Xilinx XC7S15-2FTGB196I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing for optimal performance.

FPGA

12800

100

100

1000

1286 MHz

1.05 ns

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-1CSGA225Q by Xilinx

XC7S25-1CSGA225Q

Xilinx

The Xilinx XC7S25-1CSGA225Q is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and fine pitch terminals. Operating temperature ranges from -40°C to 125°C.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

XC7S25-1CSGA324Q by Xilinx

XC7S25-1CSGA324Q

Xilinx

XC7S25-1CSGA324Q by Xilinx is a PLASTIC/EPOXY FPGA with 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. It is commonly used in automotive applications due to its AUTOMOTIVE temperature grading.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S25-1FTGB196C by Xilinx

XC7S25-1FTGB196C

Xilinx

Xilinx XC7S25-1FTGB196C is a 23360 logic cell FPGA with 1825 CLBs, 150 inputs/outputs, and max clock freq of 1098 MHz. Ideal for high-speed applications requiring low power consumption and compact design. Package style: grid array, low profile, fine pitch.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-1FTGB196Q by Xilinx

XC7S25-1FTGB196Q

Xilinx

Xilinx XC7S25-1FTGB196Q is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. Ideal for automotive applications due to its low profile grid array package and wide temperature range (-40 to 125 °C).

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-2FTGB196I by Xilinx

XC7S25-2FTGB196I

Xilinx

Xilinx XC7S25-2FTGB196I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S25-L1FTGB196I by Xilinx

XC7S25-L1FTGB196I

Xilinx

The Xilinx XC7S25-L1FTGB196I is a FPGA with 23360 logic cells, 1825 CLBs, and operates at a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package style.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1CSGA324Q by Xilinx

XC7S50-1CSGA324Q

Xilinx

The Xilinx XC7S50-1CSGA324Q is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and wide operating temperature range (-40 to 125 °C).

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XC7S50-1FTGB196C by Xilinx

XC7S50-1FTGB196C

Xilinx

Xilinx XC7S50-1FTGB196C FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1FTGB196I by Xilinx

XC7S50-1FTGB196I

Xilinx

XC7S50-1FTGB196I by Xilinx is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing, it operates b/w -40 to 100 °C with low profile grid array packaging.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-1FTGB196Q by Xilinx

XC7S50-1FTGB196Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-2FTGB196C by Xilinx

XC7S50-2FTGB196C

Xilinx

Xilinx XC7S50-2FTGB196C FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, networking devices, and industrial automation systems.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S50-2FTGB196I by Xilinx

XC7S50-2FTGB196I

Xilinx

Xilinx XC7S50-2FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 1mm pitch terminals.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-1FTGB196Q by Xilinx

XC7S6-1FTGB196Q

Xilinx

The Xilinx XC7S6-1FTGB196Q is a FPGA with 6000 logic cells, 469 CLBs, and operates at a max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and wide temperature range from -40°C to 125°C.

FPGA

6000

100

100

469

1098 MHz

1.27 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-2FTGB196C by Xilinx

XC7S6-2FTGB196C

Xilinx

The Xilinx XC7S6-2FTGB196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3

XC7S6-2FTGB196I by Xilinx

XC7S6-2FTGB196I

Xilinx

Xilinx XC7S6-2FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array, low profile, fine pitch.

FPGA

6000

100

100

469

1286 MHz

1.05 ns

469 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.55 mm

BGA196,14X14,40

Bottom

Ball

Matte Tin

1 mm

196

S-PBGA-B196

e3