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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7A75T-2FTG256I by Xilinx

XC7A75T-2FTG256I

Xilinx

Xilinx XC7A75T-2FTG256I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

75520

300

300

5900

1286 MHz

1.05 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC7A75T-3CSG324E by Xilinx

XC7A75T-3CSG324E

Xilinx

Xilinx XC7A75T-3CSG324E FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1412 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities in a compact form factor.

FPGA

75520

300

300

5900

1412 MHz

0.94 ns

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

XC7A75T-L2CSG324E by Xilinx

XC7A75T-L2CSG324E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

75520

300

300

5900

1098 MHz

1.51 ns

Field Programmable Gate Arrays

5900 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

324

S-PBGA-B324

e1

No

LFE5U-25F-8MG285C by Lattice Semiconductor

LFE5U-25F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5U-25F-8MG285C is a PLASTIC/EPOXY FPGA with 3000 CLBs, 1.155V max supply voltage, and 0.5mm terminal pitch. Ideal for applications requiring low profile, fine pitch GRID ARRAY ICs operating b/w 0-85°C.

FPGA

3000

3000 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-25F-8MG285I by Lattice Semiconductor

LFE5U-25F-8MG285I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-25F-8MG285I FPGA features 3000 CLBs, operates at -40 to 100 °C, with a supply voltage range of 1.045V to 1.155V. Ideal for industrial applications requiring high-performance and low-profile grid array packaging with fine pitch terminals.

FPGA

3000

3000 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-45F-8MG285C by Lattice Semiconductor

LFE5U-45F-8MG285C

Lattice Semiconductor

LFE5U-45F-8MG285C by Lattice Semiconductor is a 44000 logic cell FPGA with 5500 CLBs and 118 inputs/outputs. Operating at 1.045V to 1.155V, it's ideal for applications requiring high-density programmable ICs in a compact grid array package with low profile and fine pitch terminals.

FPGA

44000

118

118

5500

5500 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

BGA285,18X18,20

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-85F-8MG285C by Lattice Semiconductor

LFE5U-85F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5U-85F-8MG285C FPGA features 10500 CLBs, 1.155V max supply voltage, and 0.5mm terminal pitch. Ideal for applications requiring high performance in a compact form factor, such as telecommunications equipment and industrial automation systems.

FPGA

10500

10500 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5U-85F-8MG285I by Lattice Semiconductor

LFE5U-85F-8MG285I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-85F-8MG285I FPGA features 10500 CLBs, 1.155V max supply voltage, and 0.5mm terminal pitch. Ideal for industrial applications requiring high performance and low power consumption in a compact form factor.

FPGA

10500

10500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM-85F-8MG285I by Lattice Semiconductor

LFE5UM-85F-8MG285I

Lattice Semiconductor

LFE5UM-85F-8MG285I by Lattice Semiconductor is a 10500 CLB FPGA with max supply voltage of 1.155V, operating temp up to 100°C, and 0.5mm terminal pitch. Ideal for industrial applications requiring high performance in compact spaces.

FPGA

10500

10500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LCMXO3L-2100C-5BG324C by Lattice Semiconductor

LCMXO3L-2100C-5BG324C

Lattice Semiconductor

LCMXO3L-2100C-5BG324C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3L-6900C-5BG400I by Lattice Semiconductor

LCMXO3L-6900C-5BG400I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LAMXO2280E-3FTN324E by Lattice Semiconductor

LAMXO2280E-3FTN324E

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

2280

271

271

285

Field Programmable Gate Arrays

285 CLBS

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

19 mm

19 mm

1.7 mm

Tray

BGA324,18X18,40

Bottom

Ball

Tin Silver Copper

1 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XC6SLX16-2CSG225C by Xilinx

XC6SLX16-2CSG225C

Xilinx

Xilinx XC6SLX16-2CSG225C FPGA features 14579 logic cells, 1139 CLBs, and 160 inputs/outputs. Operating at a max frequency of 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a low profile grid array package, it offers flexibility in design while maintaining high performance standards.

FPGA

14579

160

160

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-2CSG225I by Xilinx

XC6SLX16-2CSG225I

Xilinx

Xilinx XC6SLX16-2CSG225I FPGA features 14579 logic cells, 1139 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

14579

160

160

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-2CSG324C by Xilinx

XC6SLX16-2CSG324C

Xilinx

Xilinx XC6SLX16-2CSG324C FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Ideal for applications requiring a max clock frequency of 667 MHz, such as high-speed data processing in telecommunications or industrial automation systems. Operating temperature range from 0 to 85°C with a low profile grid array package style.

FPGA

14579

232

232

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-2CSG324I by Xilinx

XC6SLX16-2CSG324I

Xilinx

Xilinx XC6SLX16-2CSG324I FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide supply voltage range and low combinatorial delay, this FPGA offers versatile programmability for various electronic systems.

FPGA

14579

232

232

1139

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-3CSG225C by Xilinx

XC6SLX16-3CSG225C

Xilinx

Xilinx XC6SLX16-3CSG225C FPGA features 14579 logic cells, 1139 CLBs, and 160 inputs/outputs. It operates at a max frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in various industries.

FPGA

14579

160

160

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-3CSG225I by Xilinx

XC6SLX16-3CSG225I

Xilinx

XC6SLX16-3CSG225I by Xilinx is a CMOS-based FPGA with 14579 logic cells and 1139 CLBs. It operates at a max clock frequency of 862 MHz and is commonly used in industrial applications requiring high-performance programmable ICs.

FPGA

14579

160

160

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-3CSG324C by Xilinx

XC6SLX16-3CSG324C

Xilinx

The Xilinx XC6SLX16-3CSG324C is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.

FPGA

14579

232

232

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-3CSG324I by Xilinx

XC6SLX16-3CSG324I

Xilinx

The Xilinx XC6SLX16-3CSG324I is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at a max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its low profile grid array package style.

FPGA

14579

232

232

1139

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-L1CSG225I by Xilinx

XC6SLX16-L1CSG225I

Xilinx

XC6SLX16-L1CSG225I by Xilinx is a FPGA with 14579 logic cells, 1139 CLBs, and 160 inputs/outputs. Operating at 1.05V, it uses CMOS technology and has a max combinatorial delay of 0.46ns. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

14579

160

160

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX16-L1CSG324C by Xilinx

XC6SLX16-L1CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

232

232

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX16-L1CSG324I by Xilinx

XC6SLX16-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

14579

232

232

1139

0.46 ns

CMOS

Field Programmable Gate Arrays

1139 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-2CSG324C by Xilinx

XC6SLX25-2CSG324C

Xilinx

Xilinx XC6SLX25-2CSG324C FPGA features 24051 logic cells, 1879 CLBs, and 226 inputs/outputs. Utilized in applications requiring high-speed processing such as telecommunications, networking, and industrial automation due to its max clock frequency of 667 MHz and low profile grid array package style.

FPGA

24051

226

226

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-2CSG324I by Xilinx

XC6SLX25-2CSG324I

Xilinx

Xilinx XC6SLX25-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

24051

226

226

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-3CSG324C by Xilinx

XC6SLX25-3CSG324C

Xilinx

The Xilinx XC6SLX25-3CSG324C is a FPGA with 24051 logic cells, 1879 CLBs, and 226 inputs/outputs. It operates at max clock frequency of 862 MHz and uses CMOS technology. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

24051

226

226

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-3CSG324I by Xilinx

XC6SLX25-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25-L1CSG324I by Xilinx

XC6SLX25-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

24051

226

226

1879

0.46 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-2CSG324C by Xilinx

XC6SLX25T-2CSG324C

Xilinx

XC6SLX25T-2CSG324C by Xilinx is a FPGA with 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Operating at 667 MHz max clock frequency, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

24051

190

190

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-2CSG324I by Xilinx

XC6SLX25T-2CSG324I

Xilinx

Xilinx XC6SLX25T-2CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Utilized in industrial applications, it operates at a max frequency of 667 MHz with a combinatorial delay of 0.26 ns per CLB. The package style is grid array with low profile and fine pitch terminals.

FPGA

24051

190

190

1879

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-3CSG324C by Xilinx

XC6SLX25T-3CSG324C

Xilinx

Xilinx XC6SLX25T-3CSG324C FPGA features 24051 logic cells, 1879 CLBs, and 862 MHz max clock frequency. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation. Package style: Grid Array, low profile with 0.8mm terminal pitch.

FPGA

24051

190

190

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-3CSG324I by Xilinx

XC6SLX25T-3CSG324I

Xilinx

Xilinx XC6SLX25T-3CSG324I FPGA features 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages ranging from 1.14V to 2.5/3.3V, making it versatile for various electronic designs.

FPGA

24051

190

190

1879

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX25T-4CSG324C by Xilinx

XC6SLX25T-4CSG324C

Xilinx

Xilinx XC6SLX25T-4CSG324C FPGA features 24051 logic cells, 190 inputs/outputs, and CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor. Package style includes grid array with low profile and fine pitch terminals for efficient PCB integration.

FPGA

24051

190

190

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX4-2CSG225C by Xilinx

XC6SLX4-2CSG225C

Xilinx

Xilinx XC6SLX4-2CSG225C FPGA features 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Utilized in applications requiring high clock frequencies up to 667 MHz, such as telecommunications and networking equipment due to its low profile grid array package style. Operating temperature ranges from 0°C to 85°C with a max supply voltage of 1.26 V.

FPGA

3840

120

120

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-2CSG225I by Xilinx

XC6SLX4-2CSG225I

Xilinx

Xilinx XC6SLX4-2CSG225I is a FPGA with 3840 logic cells, 300 CLBs, and 120 inputs/outputs. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range from -40 to 100°C.

FPGA

3840

120

120

300

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-3CSG225C by Xilinx

XC6SLX4-3CSG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

120

120

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-3CSG225I by Xilinx

XC6SLX4-3CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

132

132

300

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-L1CSG225C by Xilinx

XC6SLX4-L1CSG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

132

132

300

0.46 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX4-L1CSG225I by Xilinx

XC6SLX4-L1CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

3840

120

120

300

0.46 ns

CMOS

Field Programmable Gate Arrays

300 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX45-3CSG324C by Xilinx

XC6SLX45-3CSG324C

Xilinx

The Xilinx XC6SLX45-3CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at a max frequency of 862 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability under varying operating conditions.

FPGA

43661

218

218

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-3CSG324I by Xilinx

XC6SLX45-3CSG324I

Xilinx

Xilinx XC6SLX45-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.

FPGA

43661

218

218

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-L1CSG324C by Xilinx

XC6SLX45-L1CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

218

218

3411

0.46 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45-L1CSG324I by Xilinx

XC6SLX45-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

218

218

3411

0.46 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-2CSG324C by Xilinx

XC6SLX45T-2CSG324C

Xilinx

Xilinx XC6SLX45T-2CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and networking.

FPGA

43661

190

190

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-2CSG324I by Xilinx

XC6SLX45T-2CSG324I

Xilinx

Xilinx XC6SLX45T-2CSG324I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at -40 to 100°C, suitable for industrial applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

43661

190

190

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-3CSG324C by Xilinx

XC6SLX45T-3CSG324C

Xilinx

Xilinx XC6SLX45T-3CSG324C FPGA features 43661 logic cells, 3411 CLBs, and 190 inputs/outputs. It operates at a max frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in electronics design.

FPGA

43661

190

190

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-3CSG324I by Xilinx

XC6SLX45T-3CSG324I

Xilinx

Xilinx XC6SLX45T-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 862 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temperature of 100°C.

FPGA

43661

190

190

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX45T-4CSG324C by Xilinx

XC6SLX45T-4CSG324C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

43661

190

190

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No