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XC7A75T-2FTG256I

Xilinx

XC7A75T-2FTG256I by Xilinx

Xilinx XC7A75T-2FTG256I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

Median Price

$157.525

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Mouser Electronics

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DigiKey

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 818 parts In-Stock

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Modulus Dynamics

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Vigor

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Netroflash

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Aztec Data Supply Inc.

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Futuretech Components

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Overview

Unlock endless possibilities with the XC7A75T-2FTG256I from Xilinx, a leading manufacturer in the field of Field Programmable Gate Arrays. Boasting 75520 logic cells and 5900 CLBs, this FPGA offers unparalleled flexibility and efficiency for a wide range of applications. From telecommunications to automotive systems, this product delivers high performance and reliability. Experience seamless integration and rapid development with the XC7A75T-2FTG256I, providing you with the tools to bring your designs to life. Elevate your projects with Xilinx's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of the internal components.

No. of Logic Cells: 75520

High number of logic cells allows for complex programmable configurations and functions.

Surface Mount: YES

Easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

Efficient power consumption and compatibility with low voltage systems.

No. of CLBs: 5900

Abundance of Configurable Logic Blocks for versatile programming options.

No. of Inputs: 300

High number of inputs for handling multiple signals and data streams.

Package Shape: SQUARE

Uniform shape for easy placement and alignment on PCBs.

Form Of Terminal: BALL

Ball terminal design for efficient soldering and reliable connections.

No. of Terminals: 256

A sufficient number of terminals for connectivity and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Versatile programmability for custom logic functions and signal processing.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Compact package design for space-saving applications and high-density integration.

Minimum Supply Voltage: 0.95 V

Support for low voltage operation while maintaining performance and stability.

Maximum Operating Temperature: 100 °C

Wide operating temperature range for extended usage in various environments.

Pitch Of Terminal: 1 mm

Fine pitch spacing for efficient routing and signal integrity.

Maximum Combinatorial Delay of a CLB: 1.05 ns

Low delay for fast processing of logic operations and data throughput.

Organization: 5900 CLBS

Organized CLBs for easy configuration and management of logic functions.

Minimum Operating Temperature: -40 °C

Wide temperature range support for operation in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

High-quality terminal finishing for reliable solder joints and signal conductivity.

Position Of Terminal: BOTTOM

Bottom terminal placement for easy PCB mounting and signal routing.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling and storage precautions.

Maximum Seated Height: 1.55 mm

Low profile design for space-constrained applications and compact PCB layouts.

Width: 17 mm

Compact width dimension for flexible PCB layout and space optimization.

Maximum Clock Frequency: 1286 MHz

High clock frequency support for fast operation and real-time processing.

No. of Outputs: 300

Abundance of output options for versatile signal routing and data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Support for efficient and controlled reflow soldering processes for assembly.

Peak Reflow Temperature °C: 260

High-temperature tolerance for reflow soldering without compromising component integrity.

Length: 17 mm

Compact length dimension for space-saving PCB designs and layout flexibility.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A75T-2FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

75520

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

5900

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

5900 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A75T-2FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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