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XC6SLX25T-4CSG324C

Xilinx

XC6SLX25T-4CSG324C by Xilinx

Xilinx XC6SLX25T-4CSG324C FPGA features 24051 logic cells, 190 inputs/outputs, and CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor. Package style includes grid array with low profile and fine pitch terminals for efficient PCB integration.

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Overview

Unlock limitless possibilities with the XC6SLX25T-4CSG324C by Xilinx. As a leader in Field Programmable Gate Arrays (FPGA), Xilinx delivers unmatched quality and reliability in every product. With 24051 logic cells and 190 inputs/outputs, this FPGA offers unparalleled flexibility for a wide range of applications. Whether you're designing cutting-edge technology or pushing the boundaries of innovation, the XC6SLX25T-4CSG324C provides the power and performance you need to succeed. Trust Xilinx to bring your ideas to life with superior technology and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy materials are lightweight and cost-effective, making this FPGA easy to handle and affordable.

No. of Logic Cells: 24051

With a large number of logic cells, this FPGA can accommodate complex designs and functionalities.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and simplifying assembly.

Technology Used: CMOS

CMOS technology provides low power consumption and high noise immunity, improving the overall performance of the FPGA.

No. of Inputs: 190

Having a high number of inputs allows for versatile connectivity and input options in the FPGA design.

Package Shape: SQUARE

A square package shape provides uniformity and simplicity in design integration.

Form Of Terminal: BALL

The use of ball terminals enables efficient and reliable connections during installation and operation.

Power Supplies (V): 1.2,2.5/3.3

Multiple power supply options allow for flexibility in voltage requirements, catering to different design needs.

No. of Terminals: 324

A high number of terminals facilitate connections and signal routing in the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array makes this device reconfigurable and adaptable to varying design requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The specific package style enhances the overall reliability, performance, and ease of use of the FPGA.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures stable performance even in demanding environmental conditions.

Pitch Of Terminal: 0.8 mm

A fine terminal pitch allows for precise connections and layout design, optimizing signal integrity.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature range ensures functionality in various climates and operating environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple materials for terminal finishing enhances conductivity and durability of the connections.

Position Of Terminal: BOTTOM

Bottom terminals enable convenient and efficient PCB mounting and connection arrangements.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures adequate protection against moisture-related damage, improving the reliability and longevity of the FPGA.

Maximum Seated Height: 1.5 mm

A low seated height allows for compact system design and efficient component layout within limited space.

Width: 15 mm

A moderate width makes the FPGA compatible with standard board sizes and layouts, facilitating integration.

No. of Outputs: 190

A high number of outputs enables versatile signal routing and connectivity options in the FPGA design.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and connection integrity during assembly, enhancing reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering and component durability during assembly processes.

Length: 15 mm

A moderate length ensures compatibility with standard PCB layouts and sizes, facilitating design integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX25T-4CSG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

24051

No. of Inputs:

190

No. of Outputs:

190

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX25T-4CSG324C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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