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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LCMXO3LF-6900C-5BG324C by Lattice Semiconductor

LCMXO3LF-6900C-5BG324C

Lattice Semiconductor

LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor

LCMXO3LF-6900C-5BG400C

Lattice Semiconductor

LCMXO3LF-6900C-5BG400C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 400 terminals. Ideal for applications requiring low profile, fine pitch grid arrays in electronics operating b/w 0-85°C.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900C-5BG400I by Lattice Semiconductor

LCMXO3LF-6900C-5BG400I

Lattice Semiconductor

LCMXO3LF-6900C-5BG400I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 6900 logic cells, 858 CLBs, and 335 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 3.465 V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor

LCMXO3LF-6900C-6BG400C

Lattice Semiconductor

LCMXO3LF-6900C-6BG400C by Lattice Semiconductor is a FPGA with 858 CLBs, operating voltage of 2.375V to 3.465V, and temp range of 0-85°C. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-6900C-6BG400I by Lattice Semiconductor

LCMXO3LF-6900C-6BG400I

Lattice Semiconductor

LCMXO3LF-6900C-6BG400I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 335 inputs/outputs. It operates b/w -40 to 100 °C and has a package style of GRID ARRAY for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

335

335

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LFE5U-12F-8MG285C by Lattice Semiconductor

LFE5U-12F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5U-12F-8MG285C is a FPGA with 1500 CLBs, 118 inputs/outputs, and operates at 1.045-1.155V. Ideal for applications requiring low profile, fine pitch grid arrays in electronics design for temperatures ranging from 0 to 85°C.

FPGA

118

118

1500

1500 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

BGA285,18X18,20

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM5G-25F-8MG285C by Lattice Semiconductor

LFE5UM5G-25F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5UM5G-25F-8MG285C is a 3000 CLBs FPGA with max supply voltage of 1.26V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array package style with 0.5mm terminal pitch.

FPGA

3000

3000 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM5G-45F-8MG285C by Lattice Semiconductor

LFE5UM5G-45F-8MG285C

Lattice Semiconductor

Lattice Semiconductor's LFE5UM5G-45F-8MG285C is a PLASTIC/EPOXY FPGA with 5500 CLBs. It operates at a voltage range of 1.14V to 1.26V and has a temperature range of 0°C to 85°C. This versatile device is suitable for various applications requiring high-performance programmable logic solutions.

FPGA

5500

5500 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM5G-45F-8MG285I by Lattice Semiconductor

LFE5UM5G-45F-8MG285I

Lattice Semiconductor

Lattice Semiconductor's LFE5UM5G-45F-8MG285I FPGA features 5500 CLBs, 1.2V nominal voltage, and -40 to 100°C operating temperature range. Ideal for industrial applications requiring high performance and low profile design with a grid array package style.

FPGA

5500

5500 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

LFE5UM5G-85F-8MG285C by Lattice Semiconductor

LFE5UM5G-85F-8MG285C

Lattice Semiconductor

LFE5UM5G-85F-8MG285C by Lattice Semiconductor is a 10500 CLB FPGA with max supply voltage of 1.26V, operating temp up to 85°C, and 0.5mm terminal pitch. Ideal for applications requiring high-performance computing in compact spaces like IoT devices and industrial automation systems.

FPGA

10500

10500 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.3 mm

Bottom

Ball

Tin Silver Copper

.5 mm

285

S-PBGA-B285

e1

XA7A50T-2CPG236I by Xilinx

XA7A50T-2CPG236I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

52160

106

106

4075

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

No

XA7A50T-1CSG325Q by Xilinx

XA7A50T-1CSG325Q

Xilinx

The Xilinx XA7A50T-1CSG325Q is a FPGA with 52160 logic cells, 4075 CLBs, and 150 inputs/outputs. It operates at max frequency of 1098 MHz and supports automotive applications due to AEC-Q100 screening level. With HKMG technology, it offers high performance in a compact package for various electronic systems.

FPGA

52160

150

150

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

AEC-Q100

XA7A35T-1CSG324Q by Xilinx

XA7A35T-1CSG324Q

Xilinx

The Xilinx XA7A35T-1CSG324Q is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to AEC-Q100 screening level and HKMG technology for high reliability in harsh environments. With a compact grid array package style, it offers low profile design suitable for space-constrained systems.

FPGA

33280

210

210

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A75T-1CSG324Q by Xilinx

XA7A75T-1CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

75520

210

210

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A35T-1CSG324I by Xilinx

XA7A35T-1CSG324I

Xilinx

The Xilinx XA7A35T-1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and 210 inputs/outputs. It operates at a max frequency of 1098 MHz and supports a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

33280

210

210

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A35T-1CSG325Q by Xilinx

XA7A35T-1CSG325Q

Xilinx

XA7A35T-1CSG325Q by Xilinx is a FPGA with 33280 logic cells, 2600 CLBs, and 150 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology.

FPGA

33280

150

150

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

AEC-Q100

XA7A35T-1CPG236Q by Xilinx

XA7A35T-1CPG236Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

33280

106

106

2600

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

No

AEC-Q100

XA7A50T-2CSG325I by Xilinx

XA7A50T-2CSG325I

Xilinx

The Xilinx XA7A50T-2CSG325I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor.

FPGA

52160

150

150

4075

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

XA7A35T-2CSG324I by Xilinx

XA7A35T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: 1.05 ns;

FPGA

33280

210

210

2600

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A50T-2CSG324I by Xilinx

XA7A50T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;

FPGA

52160

210

210

4075

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A50T-1CSG324Q by Xilinx

XA7A50T-1CSG324Q

Xilinx

The Xilinx XA7A50T-1CSG324Q is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for automotive applications due to AEC-Q100 screening level, HKMG technology, and low profile grid array package style.

FPGA

52160

210

210

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A75T-2CSG324I by Xilinx

XA7A75T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

75520

210

210

5900

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A50T-1CSG324I by Xilinx

XA7A50T-1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

52160

210

210

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A50T-1CPG236Q by Xilinx

XA7A50T-1CPG236Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

52160

106

106

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e8

No

AEC-Q100

XA7A35T-2CSG325I by Xilinx

XA7A35T-2CSG325I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

33280

210

210

2600

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

2600 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

XA7A50T-1CSG325I by Xilinx

XA7A50T-1CSG325I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

52160

150

150

4075

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

4075 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

No

XA7A100T-1CSG324I by Xilinx

XA7A100T-1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Length: 15 mm;

FPGA

101440

210

210

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A100T-1CSG324Q by Xilinx

XA7A100T-1CSG324Q

Xilinx

The Xilinx XA7A100T-1CSG324Q is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for automotive applications due to AEC-Q100 screening level and HKMG technology. It features a low profile grid array package with 324 terminals.

FPGA

101440

210

210

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA7A100T-2CSG324I by Xilinx

XA7A100T-2CSG324I

Xilinx

XA7A100T-2CSG324I by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

101440

210

210

7925

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XA7A15T-1CPG236Q by Xilinx

XA7A15T-1CPG236Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

210

210

1300

1098 MHz

1.27 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

AEC-Q100; TS 16949

XA7A15T-1CSG324I by Xilinx

XA7A15T-1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

16640

210

210

1300

1.27 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

XA7A15T-1CSG324Q by Xilinx

XA7A15T-1CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

210

210

1300

1.27 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

AEC-Q100

XA7A15T-1CSG325Q by Xilinx

XA7A15T-1CSG325Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

16640

210

210

1300

1098 MHz

1.27 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

AEC-Q100; TS 16949

XA7A15T-2CSG324I by Xilinx

XA7A15T-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;

FPGA

16640

210

210

1300

1.05 ns

HKMG

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

LCMXO3L-9400C-5BG256C by Lattice Semiconductor

LCMXO3L-9400C-5BG256C

Lattice Semiconductor

LCMXO3L-9400C-5BG256C by Lattice Semiconductor is a 1175 CLB FPGA with max supply voltage of 3.465V and operating temp up to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-9400C-5BG400C by Lattice Semiconductor

LCMXO3L-9400C-5BG400C

Lattice Semiconductor

LCMXO3L-9400C-5BG400C by Lattice Semiconductor is a FPGA with 1175 CLBs, operating voltage of 2.375V to 3.465V, and temp range of 0°C to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

400

S-PBGA-B400

e1

LCMXO3LF-9400C-5BG256I by Lattice Semiconductor

LCMXO3LF-9400C-5BG256I

Lattice Semiconductor

LCMXO3LF-9400C-5BG256I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 9400 logic cells, 1175 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 3.465 V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

9400

206

206

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-9400C-6BG256I by Lattice Semiconductor

LCMXO3LF-9400C-6BG256I

Lattice Semiconductor

LCMXO3LF-9400C-6BG256I by Lattice Semiconductor is a 9400 Logic Cells FPGA with 1175 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a GRID ARRAY package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

9400

206

206

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

XC7A12T-1CPG236C by Xilinx

XC7A12T-1CPG236C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-1CPG236I by Xilinx

XC7A12T-1CPG236I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-1CSG325C by Xilinx

XC7A12T-1CSG325C

Xilinx

The Xilinx XC7A12T-1CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A12T-2CPG236C by Xilinx

XC7A12T-2CPG236C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-2CPG236I by Xilinx

XC7A12T-2CPG236I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-2CSG325C by Xilinx

XC7A12T-2CSG325C

Xilinx

The Xilinx XC7A12T-2CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A12T-2CSG325I by Xilinx

XC7A12T-2CSG325I

Xilinx

XC7A12T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 12800 logic cells and a max clock frequency of 1286 MHz. It is commonly used in industrial applications for its high performance and programmability.

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A12T-3CPG236E by Xilinx

XC7A12T-3CPG236E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 236; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

12800

150

150

1000

1412 MHz

0.94 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1

XC7A12T-3CSG325E by Xilinx

XC7A12T-3CSG325E

Xilinx

Xilinx XC7A12T-3CSG325E is a 12800 logic cells FPGA with 1000 CLBs, operating at max frequency of 1412 MHz. Ideal for applications requiring high-speed processing and low power consumption in compact designs. Features HKMG technology, 0.8 mm terminal pitch, and MSL level 3 moisture sensitivity.

FPGA

12800

150

150

1000

1412 MHz

0.94 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA325,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

325

S-PBGA-B325

e1

XC7A12T-L1CPG236I by Xilinx

XC7A12T-L1CPG236I

Xilinx

The Xilinx XC7A12T-L1CPG236I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA236,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

236

S-PBGA-B236

e1