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XA7A100T-1CSG324Q

Xilinx

XA7A100T-1CSG324Q by Xilinx

The Xilinx XA7A100T-1CSG324Q is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for automotive applications due to AEC-Q100 screening level and HKMG technology. It features a low profile grid array package with 324 terminals.

Median Price

$213.975

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Mouser Electronics

USA . 388 parts In-Stock

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DigiKey

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Digiode

USA . 375 parts In-Stock

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Next Level Components, LLC

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MARBEL Systems

Belgium . 300 parts In-Stock

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$47.447

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$45.549

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Texas Native Microelectronics

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Modulus Dynamics

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Vigor

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Corphita

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Microchip USA

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Qasali Group International

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Overview

Unlock the potential of your projects with the Xilinx XA7A100T-1CSG324Q Field Programmable Gate Array. Manufactured by Xilinx, a leader in FPGA technology, this versatile device offers a wide range of applications and benefits. Whether you're looking to optimize performance, enhance flexibility, or streamline development processes, the XA7A100T-1CSG324Q delivers superior quality and value. From automotive to industrial applications, this FPGA is the perfect solution for your next project. Experience the power of Xilinx today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the FPGA, making it suitable for various industrial applications.

No. of Logic Cells: 101440

With a high number of logic cells, this FPGA can handle complex logic designs efficiently.

Surface Mount: YES

Surface mount technology makes installation and assembly easier and more efficient.

Maximum Supply Voltage: 1.05 V

Low supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

No. of CLBs: 7925

Having a large number of Configurable Logic Blocks (CLBs) allows for flexible and versatile logic implementation.

Screening Level: AEC-Q100

Compliance with Automotive Electronics Council (AEC) standards ensures reliability and performance in automotive applications.

Technology Used: HKMG

High-K Metal Gate (HKMG) technology enables improved performance and energy efficiency in the FPGA.

No. of Inputs: 210

Sufficient input ports allow for connectivity to external devices and sensors for data processing.

Package Shape: SQUARE

Square package shape provides compactness and ease of integration into different system designs.

Form Of Terminal: BALL

Ball terminals offer reliable connection and soldering during installation.

No. of Terminals: 324

Adequate terminals enable versatile connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reconfigurability and flexibility in logic implementation.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers compactness, low profile design, and fine pitch for space-constrained applications.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage ensures compatibility with different power sources and energy-efficient operation.

Maximum Operating Temperature: 125 °C

High operating temperature range makes the FPGA suitable for industrial and automotive environments with varying temperature conditions.

Pitch Of Terminal: 0.8 mm

Fine pitch terminals enable high-density packaging and efficient signal routing.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay ensures fast data processing and response times in logic operations.

Organization: 7925 CLBS

Organized Configurable Logic Blocks allow for structured and efficient implementation of logic functions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality even in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with Tin, Silver, and Copper ensures good electrical conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom positioning of terminals facilitates better PCB layout and routing for optimized signal integrity.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates the level of protection against moisture-related damage during storage and handling.

Maximum Seated Height: 1.5 mm

Low seated height allows for compact and slim designs in space-constrained applications.

Width: 15 mm

Compact width dimension offers versatility in mounting options and system integration.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency enables fast and efficient data processing and logic operations.

No. of Outputs: 210

Sufficient output ports allow for data transmission to external devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a specified time, ensuring stability during reflow soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with lead-free soldering processes.

Length: 15 mm

Compact length dimension offers versatility in mounting options and system integration.

Grading Of Temperature: AUTOMOTIVE

Automotive-grade temperature grading ensures reliable operation in harsh automotive environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XA7A100T-1CSG324Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

101440

No. of Inputs:

210

No. of Outputs:

210

No. of CLBs:

7925

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

HKMG

Sub-Category:

Field Programmable Gate Arrays

Organization:

7925 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Screening Level:

AEC-Q100

Trade Compliance

XA7A100T-1CSG324Q Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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