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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
10CL006YU256A7G by Intel

10CL006YU256A7G

Intel

The Intel 10CL006YU256A7G is a FPGA with 392 CLBs, operating voltage of 1.15-1.25V, and temp range -40 to 125°C. Ideal for automotive applications due to its low profile grid array package style and fine pitch terminals.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL006YU256C6G by Intel

10CL006YU256C6G

Intel

The Intel 10CL006YU256C6G is a field programmable gate array (FPGA) with 392 configurable logic blocks (CLBs). It operates at a nominal voltage of 1.2V and has a max operating temperature of 85°C. This FPGA is commonly used in applications that require high-performance and flexible digital circuitry design.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL006YU256I7G by Intel

10CL006YU256I7G

Intel

The Intel 10CL006YU256I7G is a FPGA with 392 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of -40°C to 100°C. It is used in industrial applications requiring high performance computing and programmable logic capabilities.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL006ZU256I8G by Intel

10CL006ZU256I8G

Intel

Intel's 10CL006ZU256I8G FPGA features 6272 logic cells, 392 CLBs, and 176 inputs/outputs. With a package style of grid array and low profile, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.

FPGA

6272

176

176

392

392 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

BGA256,16X16,32

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256A7G by Intel

10CL010YU256A7G

Intel

The Intel 10CL010YU256A7G is a Field Programmable Gate Array (FPGA) with 645 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V, making it suitable for automotive applications due to its low profile and fine pitch package style.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256C6G by Intel

10CL010YU256C6G

Intel

Intel's 10CL010YU256C6G FPGA features 645 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256C8G by Intel

10CL010YU256C8G

Intel

Intel's 10CL010YU256C8G FPGA features 645 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high performance and flexibility in electronic circuit design with its grid array package style and low profile design.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256I7G by Intel

10CL010YU256I7G

Intel

The Intel 10CL010YU256I7G is a field programmable gate array (FPGA) with 645 CLBs. It has a max supply voltage of 1.25V and operates in temperatures ranging from -40 to 100°C. This FPGA is commonly used in industrial applications for its versatility and compact size (14mm x 14mm).

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010ZU256I8G by Intel

10CL010ZU256I8G

Intel

Intel's 10CL010ZU256I8G FPGA features 10320 logic cells, 645 CLBs, and 176 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor.

FPGA

10320

176

176

645

645 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

BGA256,16X16,32

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256A7G by Intel

10CL016YU256A7G

Intel

Intel's 10CL016YU256A7G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of -40 to 125°C. Ideal for automotive applications due to its low profile grid array package style and fine pitch terminals.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256C6G by Intel

10CL016YU256C6G

Intel

The Intel 10CL016YU256C6G is a Field Programmable Gate Array with 963 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of 0°C to 85°C. It is suitable for applications requiring high-density programmable logic solutions in a compact form factor with a grid array package style.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256C8G by Intel

10CL016YU256C8G

Intel

Intel's 10CL016YU256C8G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a package style of GRID ARRAY. Ideal for applications requiring low profile, fine pitch components in a square shape with bottom terminal position.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256I7G by Intel

10CL016YU256I7G

Intel

The Intel 10CL016YU256I7G is a Field Programmable Gate Array with 963 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of -40°C to 100°C. It features a grid array package style with low profile and fine pitch terminals, suitable for industrial applications requiring high performance and flexibility in electronic circuit design.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL025YU256A7G by Intel

10CL025YU256A7G

Intel

The Intel 10CL025YU256A7G is a Field Programmable Gate Array (FPGA) with 1539 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V, making it suitable for automotive applications due to its low profile and fine pitch package style.

FPGA

1539

1539 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL025YU256C6G by Intel

10CL025YU256C6G

Intel

Intel 10CL025YU256C6G is a FPGA with 1539 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of 0°C to 85°C. It's used in applications requiring high flexibility and customization like telecommunications, automotive electronics, and industrial control systems.

FPGA

1539

1539 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL025YU256C8G by Intel

10CL025YU256C8G

Intel

Intel's 10CL025YU256C8G FPGA features 1539 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

1539

1539 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL025ZU256I8G by Intel

10CL025ZU256I8G

Intel

Intel's 10CL025ZU256I8G FPGA features 24624 logic cells, 1539 CLBs, and 150 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor.

FPGA

24624

150

150

1539

1539 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

BGA256,16X16,32

Bottom

Ball

.8 mm

256

S-PBGA-B256

XA7S25-1CSGA324Q by Xilinx

XA7S25-1CSGA324Q

Xilinx

XA7S25-1CSGA324Q by Xilinx is a FPGA with 1825 CLBs, operating at max 1098 MHz. It has a low profile grid array package and can withstand automotive-grade temperatures. Ideal for applications requiring high-speed processing in harsh environments like automotive electronics.

FPGA

1825

1098 MHz

1.27 ns

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

Bottom

Ball

.8 mm

324

S-PBGA-B324

AEC-Q100; TS 16949

XC7A25T-2CPG238C by Xilinx

XC7A25T-2CPG238C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 238; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

EP2AGX45CU17I5G by Intel

EP2AGX45CU17I5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 358; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

42959

156

156

1805

1805 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.7 mm

BGA358,20X20,32

Bottom

Ball

.8 mm

358

S-PBGA-B358

XC7A100T-1CS324I by Xilinx

XC7A100T-1CS324I

Xilinx

The Xilinx XC7A100T-1CS324I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package. Operating temperatures range from -40 to 100°C, making it suitable for various environments.

FPGA

101440

210

210

7925

1098 MHz

1.27 ns

HKMG

7925 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

LFD2NX-40-9BG256I by Lattice Semiconductor

LFD2NX-40-9BG256I

Lattice Semiconductor

LFD2NX-40-9BG256I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 111 inputs/outputs, and uses a grid array package. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-9BG256C by Lattice Semiconductor

LFD2NX-40-9BG256C

Lattice Semiconductor

LFD2NX-40-9BG256C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, 111 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-density programmable ICs in a compact grid array package.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-7BG256C by Lattice Semiconductor

LFD2NX-40-7BG256C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-7BG256C FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. Ideal for applications requiring high performance with 111 inputs/outputs, low profile grid array package style, and operating temperatures from 0 to 85°C.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-8BG256I by Lattice Semiconductor

LFD2NX-40-8BG256I

Lattice Semiconductor

LFD2NX-40-8BG256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 39,000 logic cells and 9,750 CLBs. It uses FDSOI technology and has a max supply voltage of 1.05V. This FPGA is suitable for industrial applications requiring high-performance programmable ICs.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-8BG256C by Lattice Semiconductor

LFD2NX-40-8BG256C

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-8BG256C FPGA boasts 39000 logic cells, 9750 CLBs, and 111 inputs/outputs. Utilizes FDSOI technology for applications requiring low power consumption and high performance in a compact form factor. Ideal for use in various electronic systems where programmable ICs are needed.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LFD2NX-40-7BG256I by Lattice Semiconductor

LFD2NX-40-7BG256I

Lattice Semiconductor

Lattice Semiconductor's LFD2NX-40-7BG256I FPGA features 39000 logic cells, FDSOI technology, and 9750 CLBs. With a max supply voltage of 1.05 V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with low profile and fine pitch terminals for efficient surface mounting.

FPGA

39000

111

111

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

XC7A25T-L2CPG238E by Xilinx

XC7A25T-L2CPG238E

Xilinx

The Xilinx XC7A25T-L2CPG238E is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It uses HKMG technology and is ideal for applications requiring high-speed processing and programmable ICs in a compact form factor.

FPGA

23360

150

150

1825

1098 MHz

1.51 ns

HKMG

1825 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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XC7A25T-1CPG238C by Xilinx

XC7A25T-1CPG238C

Xilinx

The Xilinx XC7A25T-1CPG238C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A25T-3CPG238E by Xilinx

XC7A25T-3CPG238E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 238; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

23360

150

150

1825

1412 MHz

0.94 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

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XC7A12T-1CPG238C by Xilinx

XC7A12T-1CPG238C

Xilinx

Xilinx XC7A12T-1CPG238C FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A25T-2CPG238I by Xilinx

XC7A25T-2CPG238I

Xilinx

The Xilinx XC7A25T-2CPG238I is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex logic operations. With a package style of grid array and low profile, it offers versatile solutions in various electronic systems.

FPGA

23360

150

150

1825

1286 MHz

1.05 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-1CPG238I by Xilinx

XC7A12T-1CPG238I

Xilinx

Xilinx XC7A12T-1CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a low profile grid array package style.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-L1CPG238I by Xilinx

XC7A12T-L1CPG238I

Xilinx

The Xilinx XC7A12T-L1CPG238I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for various functions. With a package style of grid array and low profile, it offers flexibility in design while maintaining reliability.

FPGA

12800

150

150

1000

1098 MHz

1.27 ns

HKMG

1000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A75T-1CS324I by Xilinx

XC7A75T-1CS324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

75520

300

300

5900

1098 MHz

1.27 ns

5900 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

.8 mm

324

S-PBGA-B324

XC7A25T-1CPG238I by Xilinx

XC7A25T-1CPG238I

Xilinx

Xilinx XC7A25T-1CPG238I FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing with a temperature range of -40 to 100 °C. Package style is grid array, low profile, fine pitch.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-2CPG238C by Xilinx

XC7A12T-2CPG238C

Xilinx

The Xilinx XC7A12T-2CPG238C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-2CPG238I by Xilinx

XC7A12T-2CPG238I

Xilinx

Xilinx XC7A12T-2CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.

FPGA

12800

150

150

1000

1286 MHz

1.05 ns

HKMG

1000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A25T-L1CPG238I by Xilinx

XC7A25T-L1CPG238I

Xilinx

XC7A25T-L1CPG238I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1098 MHz and is commonly used in industrial applications.

FPGA

23360

150

150

1825

1098 MHz

1.27 ns

HKMG

1825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

XC7A12T-L2CPG238E by Xilinx

XC7A12T-L2CPG238E

Xilinx

The Xilinx XC7A12T-L2CPG238E is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It uses HKMG technology and has a package style of GRID ARRAY. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

12800

150

150

1000

1098 MHz

1.51 ns

HKMG

1000 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

10 mm

10 mm

1.38 mm

BGA238,19X19,20

Bottom

Ball

Tin Silver Copper

.5 mm

238

S-PBGA-B238

e1

LIFCL-40-7BG256A by Lattice Semiconductor

LIFCL-40-7BG256A

Lattice Semiconductor

LIFCL-40-7BG256A by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 125 °C, has 9750 CLBs, and supports automotive applications. The package is a low profile grid array with 0.8mm terminal pitch, suitable for surface mount assembly.

FPGA

39000

74

74

9750

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

.8 mm

256

S-PBGA-B256

MPF200TS-FCS325M by Microchip Technology

MPF200TS-FCS325M

Microchip Technology

MPF200TS-FCS325M by Microchip Technology is a CMOS-based FPGA with 192,000 logic cells. It operates at a supply voltage range of 0.97V to 1.03V and has a temperature range of -55°C to 125°C. This field programmable gate array is suitable for military-grade applications requiring high performance and compact size.

FPGA

192000

170

170

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Rectangular

14.5 mm

11 mm

1.45 mm

BGA325,21X21,20

Bottom

Ball

.5 mm

325

R-PBGA-B325

MPF300TS-FCS536M by Microchip Technology

MPF300TS-FCS536M

Microchip Technology

MPF300TS-FCS536M by Microchip Tech is a 300K logic cell FPGA with CMOS tech, 300 inputs, and 300 outputs. It operates b/w -55 to 125°C, has a low profile grid array package style, and is suitable for military-grade applications.

FPGA

300000

300

300

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

16 mm

16 mm

1.45 mm

BGA536,30X30,20

Bottom

Ball

.5 mm

536

S-PBGA-B536

MPF100T-FCSG325E by Microchip Technology

MPF100T-FCSG325E

Microchip Technology

MPF100T-FCSG325E by Microchip Technology is a CMOS FPGA with 170 inputs/outputs. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03 V. This low-profile, fine-pitch GRID ARRAY package is ideal for high-density applications requiring precise signal processing.

FPGA

170

170

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

11 mm

11 mm

1.45 mm

BGA325,21X21,20

Bottom

Ball

.5 mm

325

S-PBGA-B325

MPF050T-1FCSG325E by Microchip Technology

MPF050T-1FCSG325E

Microchip Technology

MPF050T-1FCSG325E by Microchip Tech is a FPGA with 48000 logic cells, 164 inputs/outputs, CMOS tech, 0.97V to 1.03V supply voltage range, and operates b/w 0-100°C. It comes in a square grid array package with 0.5mm terminal pitch and low profile design. Ideal for applications requiring high-density programmable logic solutions.

FPGA

48000

164

164

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

11 mm

11 mm

1.45 mm

BGA325,21X21,20

Bottom

Ball

.5 mm

325

S-PBGA-B325

MPF050T-FCSG325E by Microchip Technology

MPF050T-FCSG325E

Microchip Technology

MPF050T-FCSG325E by Microchip Tech is a 48000 logic cell FPGA with CMOS tech. It has 164 inputs/outputs, operates b/w 0-100°C, and uses 0.97-1.03 V supply voltage. Ideal for applications requiring high-density programmable ICs in compact form factors.

FPGA

48000

164

164

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

11 mm

11 mm

1.45 mm

BGA325,21X21,20

Bottom

Ball

.5 mm

325

S-PBGA-B325

LFMXO5-25-8BBG256C by Lattice Semiconductor

LFMXO5-25-8BBG256C

Lattice Semiconductor

LFMXO5-25-8BBG256C by Lattice Semiconductor is a 25000 logic cells FPGA with FDSOI technology. It has 160 inputs/outputs, operates at 0-85°C, and uses a low profile grid array package. Ideal for applications requiring high-performance programmable ICs in compact designs.

FPGA

25000

160

160

3125

FDSOI

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

LFMXO5-25-9BBG256I by Lattice Semiconductor

LFMXO5-25-9BBG256I

Lattice Semiconductor

LFMXO5-25-9BBG256I by Lattice Semiconductor is a 25000 logic cell FPGA with FDSOI technology. Featuring 160 inputs and outputs, it operates b/w -40 to 100 °C. Its low profile grid array package makes it suitable for various applications in electronics design.

FPGA

25000

160

160

3125

FDSOI

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256