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MPF050T-FCSG325E

Microchip Technology

MPF050T-FCSG325E by Microchip Technology

MPF050T-FCSG325E by Microchip Tech is a 48000 logic cell FPGA with CMOS tech. It has 164 inputs/outputs, operates b/w 0-100°C, and uses 0.97-1.03 V supply voltage. Ideal for applications requiring high-density programmable ICs in compact form factors.

Median Price

$91.090

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 20 parts In-Stock

1+ parts

$86.900

100+ parts

-

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20

$86.900

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DigiKey

USA . 14 parts In-Stock

1+ parts

$88.440

100+ parts

$71.850

1k+ parts

-

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14

$88.440

$71.850

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Newark

USA . 9 parts In-Stock

1+ parts

$91.090

100+ parts

$75.900

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-

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9

$91.090

$75.900

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Verical

USA . 5 parts In-Stock

1+ parts

$134.489

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5

$134.489

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Element14

Singapore . 20 parts In-Stock

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$150.340

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20

$150.340

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Distributors (In-Stock)

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Digiode

USA . 298 parts In-Stock

1+ parts

$69.521

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298

$69.521

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Nova Conductors

Japan . 22 parts In-Stock

1+ parts

$125.423

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22

$125.423

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Vyrian

USA . 7,672 parts In-Stock

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7,672

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Chip Stock

USA . 1,388 parts In-Stock

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1,388

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Distributors (Availability)

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AZTECH Wire

Italy . 646 parts In-Stock

1+ parts

$8.725

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-

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646

$8.725

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Aztec Data Supply Inc.

USA . 2,220 parts In-Stock

1+ parts

$25.385

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-

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2,220

$25.385

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Ampacity Inc.

Singapore . 22 parts In-Stock

1+ parts

$62.200

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22

$62.200

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Corphita

USA . 122 parts In-Stock

1+ parts

$65.862

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122

$65.862

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Continental Prestige Electronics

USA . 40 parts In-Stock

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$99.400

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40

$99.400

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Netroflash

USA . 500 parts In-Stock

1+ parts

$125.423

100+ parts

-

1k+ parts

$119.152

10k+ parts

$116.643

500

$125.423

-

$119.152

$116.643

Semicontronic

India . 22 parts In-Stock

1+ parts

$135.380

100+ parts

$131.996

1k+ parts

$131.319

10k+ parts

-

22

$135.380

$131.996

$131.319

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Corohmni

South Africa . 95 parts In-Stock

1+ parts

$180.107

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95

$180.107

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Montano Global Distributors

Canada . 7,573 parts In-Stock

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7,573

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Argo Parts USA

USA . 4,160 parts In-Stock

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4,160

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LOOK Integrated Logistics

Peru . 3,949 parts In-Stock

1+ parts

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3,949

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NIA Electronics

USA . 3,348 parts In-Stock

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3,348

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Ledger Components

France . 3,348 parts In-Stock

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3,348

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LMD Electronica

Estonia . 330 parts In-Stock

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330

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Overview

Unlock the power of cutting-edge technology with the MPF050T-FCSG325E by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-quality Field Programmable Gate Arrays (FPGA) that offer unparalleled performance and reliability. With 48,000 logic cells and 164 inputs and outputs, this FPGA is perfect for a wide range of applications. Experience seamless integration, advanced features, and exceptional value with the MPF050T-FCSG325E. Elevate your projects to new heights with Microchip's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 48000

With a large number of logic cells, this FPGA offers high processing power and flexibility for complex designs.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.03 V

Operates efficiently at a low maximum supply voltage, reducing power consumption and heat generation.

Technology Used: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed performance.

No. of Inputs: 164

With a generous number of inputs, this FPGA can accommodate a wide range of input signals for versatile applications.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for applications with space constraints.

Form Of Terminal: BALL

The ball terminal design simplifies soldering during assembly, ensuring reliable connections.

No. of Terminals: 325

With a high number of terminals, this FPGA offers ample connectivity options for varied system requirements.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a programmable FPGA allows for customization and adaptability to different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and reliability in a compact form factor.

Minimum Supply Voltage: 0.97 V

A low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for high-density mounting, saving PCB space.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments, making it suitable for various applications.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies routing and reduces interference with other components.

Maximum Seated Height: 1.45 mm

The low maximum seated height enables compact and slim designs for space-constrained applications.

Width: 11 mm

The compact width makes this FPGA suitable for applications where space is limited.

No. of Outputs: 164

A high number of outputs enables the FPGA to drive multiple external devices and interfaces simultaneously.

Length: 11 mm

With a short length, this FPGA can fit into tight spaces without compromising performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF050T-FCSG325E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

48000

No. of Inputs:

164

No. of Outputs:

164

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

11 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

Trade Compliance

MPF050T-FCSG325E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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