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XC7A25T-2CPG238I

Xilinx

XC7A25T-2CPG238I by Xilinx

The Xilinx XC7A25T-2CPG238I is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex logic operations. With a package style of grid array and low profile, it offers versatile solutions in various electronic systems.

Median Price

$59.120

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Element14

Singapore . 164 parts In-Stock

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Nova Conductors

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Digiode

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AZTECH Wire

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Vigor

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 181 parts In-Stock

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Corphita

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Aranea Global

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Continental Prestige Electronics

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Aztec Data Supply Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Modulus Dynamics

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Kenton Components

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Supply Digital

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Argo Parts USA

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Qasali Group International

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Overview

Unleash the power of cutting-edge technology with the XC7A25T-2CPG238I FPGA by Xilinx. Crafted with precision and expertise, this field programmable gate array offers unparalleled performance and versatility for a wide range of applications. From advanced robotics to high-speed networking, this FPGA delivers seamless integration and exceptional speed, backed by Xilinx's reputation for quality and innovation. Elevate your projects to new heights with the XC7A25T-2CPG238I and experience the transformative benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat and chemicals, ensuring the reliability of the FPGA.

No. of Logic Cells: 23360

A high number of logic cells allows for complex programming and customization, making this FPGA suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology simplifies the assembly process, making it easier for manufacturers to integrate this FPGA into their designs.

Maximum Supply Voltage: 1.05 V

Operating at a low supply voltage helps reduce power consumption and heat generation, making the FPGA energy-efficient and suitable for portable devices.

No. of CLBs: 1825

A high number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions, enabling users to create complex circuits with ease.

Technology Used: HKMG

High-K Metal Gate (HKMG) technology improves transistor performance, enabling faster processing speeds and lower power consumption in the FPGA.

No. of Inputs: 150

Having a sufficient number of inputs allows for versatile input configurations, making this FPGA suitable for diverse signal processing tasks.

Package Shape: SQUARE

The square package shape offers a compact form factor, optimizing space utilization and enabling easier integration into electronic systems.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and facilitate easy soldering during the assembly process, ensuring a robust interconnection in the FPGA.

No. of Terminals: 238

A moderate number of terminals allows for versatile connectivity options, enabling designers to interface the FPGA with external components efficiently.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC offers reprogrammable logic resources, making it suitable for prototyping, testing, and rapid development of digital systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch enhances the FPGA's reliability, signal integrity, and thermal performance, making it ideal for demanding applications.

Minimum Supply Voltage: 0.95 V

Having a low minimum supply voltage allows for efficient operation at lower power levels, extending the battery life and reducing energy costs in devices utilizing this FPGA.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and operate reliably in industrial settings with elevated temperatures.

Pitch Of Terminal: 0.5 mm

The fine pitch of the terminals enables high-density mounting, allowing for more compact circuit designs and improved reliability in the FPGA assembly.

Maximum Combinatorial Delay of a CLB: 1.05 ns

Having a low maximum combinatorial delay in a Configurable Logic Block enhances the FPGA's performance by reducing the time needed for logic operations, enabling faster data processing.

Organization: 1825 CLBS

The arrangement of 1825 Configurable Logic Blocks provides a structured framework for implementing complex logic functions, making the FPGA suitable for diverse applications requiring custom logic design.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can function reliably in extreme cold environments, expanding its usability in a wide range of industrial and outdoor applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of Tin, Silver, and Copper as terminal finishes enhances the FPGA's corrosion resistance, solderability, and electrical conductivity, ensuring long-term reliability in various operating conditions.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies the PCB layout and assembly process, ensuring proper alignment and secure connections with other components in the system incorporating this FPGA.

Maximum Seated Height: 1.38 mm

The low maximum seated height of the FPGA package reduces the overall profile of the electronic system, contributing to compact designs and efficient space utilization in constrained applications.

Width: 10 mm

With a moderate width, this FPGA can be easily integrated into standard PCB layouts, providing compatibility with existing electronic designs and facilitating seamless adoption in new projects.

Maximum Clock Frequency: 1286 MHz

Operating at a high maximum clock frequency enables speedy data processing and efficient performance in real-time applications, making this FPGA suitable for demanding computational tasks.

No. of Outputs: 150

Having a sufficient number of outputs allows for flexible output configurations and signal routing options, enhancing the versatility and functionality of the FPGA in diverse digital systems.

Length: 10 mm

The moderate length of this FPGA package ensures compatibility with standard board dimensions and facilitates seamless integration into electronic assemblies, simplifying the design process.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating certifies the FPGA's reliability and performance in rugged environments, ensuring robust operation in commercial, industrial, and automotive applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A25T-2CPG238I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

23360

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1825

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Technology:

HKMG

Organization:

1825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

10 mm

Width:

10 mm

Maximum Seated Height:

1.38 mm

Package Equivalence Code:

BGA238,19X19,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

238

Standards

JESD-30 Code:

S-PBGA-B238

JESD-609 Code:

e1

Trade Compliance

XC7A25T-2CPG238I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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