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MPF200TS-FCS325M

Microchip Technology

MPF200TS-FCS325M by Microchip Technology

MPF200TS-FCS325M by Microchip Technology is a CMOS-based FPGA with 192,000 logic cells. It operates at a supply voltage range of 0.97V to 1.03V and has a temperature range of -55°C to 125°C. This field programmable gate array is suitable for military-grade applications requiring high performance and compact size.

Median Price

$672.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 59 parts In-Stock

1+ parts

$672.760

100+ parts

$611.600

1k+ parts

$495.720

10k+ parts

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59

$672.760

$611.600

$495.720

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Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$509.660

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750

$509.660

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Digiode

USA . 193 parts In-Stock

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$639.122

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193

$639.122

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Vyrian

USA . 7,948 parts In-Stock

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Chip Stock

USA . 1,252 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 423 parts In-Stock

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$9.838

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423

$9.838

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Ampacity Inc.

Singapore . 1,582 parts In-Stock

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$17.000

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$17.000

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Corohmni

South Africa . 9 parts In-Stock

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$89.076

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9

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Aztec Data Supply Inc.

USA . 2,358 parts In-Stock

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$102.843

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2,358

$102.843

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Argo Parts USA

USA . 4,079 parts In-Stock

1+ parts

$509.660

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$504.563

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$499.467

10k+ parts

$494.370

4,079

$509.660

$504.563

$499.467

$494.370

Continental Prestige Electronics

USA . 3,809 parts In-Stock

1+ parts

$509.660

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$499.467

3,809

$509.660

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$499.467

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$509.660

100+ parts

$499.467

1k+ parts

$484.177

10k+ parts

$473.984

2,000

$509.660

$499.467

$484.177

$473.984

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$519.853

100+ parts

$519.853

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$519.853

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1,000

$519.853

$519.853

$519.853

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Semicontronic

India . 5 parts In-Stock

1+ parts

$571.850

100+ parts

$557.554

1k+ parts

$554.694

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5

$571.850

$557.554

$554.694

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Corphita

USA . 321 parts In-Stock

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$605.484

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321

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Marpe Global Electronics

Taiwan . 7,109 parts In-Stock

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QualityLine Systems

Poland . 7,109 parts In-Stock

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XL Components Corporation

Australia . 7,109 parts In-Stock

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Microchip USA

USA . 1,902 parts In-Stock

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1,902

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Overview

Discover the MPF200TS-FCS325M by Microchip Technology, a high-quality Field Programmable Gate Array (FPGA) that offers exceptional value and benefits. With 192000 logic cells and 170 inputs and outputs, this FPGA provides unparalleled flexibility for a wide range of applications. Its advanced CMOS technology ensures reliable performance, while its surface mount design and compact size make it easy to integrate into any system. Whether you're designing military-grade equipment or consumer electronics, the MPF200TS-FCS325M is the perfect choice for your next project. Trust Microchip Technology's expertise and unlock limitless possibilities with this powerful FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the FPGA, making it suitable for various environments.

No. of Logic Cells: 192000

With a high number of logic cells, this FPGA offers high processing power and flexibility for complex designs and applications.

Surface Mount: YES

Being surface mountable makes installation and assembly of this FPGA easier, saving time and effort during production.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03V ensures safe operation and power efficiency for the FPGA.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA reliable and energy-efficient.

No. of Inputs: 170

With 170 inputs, this FPGA can accommodate a wide range of input signals, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a convenient form factor for integration into electronic systems and PCBs.

Form Of Terminal: BALL

The ball terminals facilitate easy and secure connection of the FPGA to the circuit board, ensuring reliable performance.

No. of Terminals: 325

The high number of terminals allows for versatile connectivity options and interfaces, enhancing the functionality of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility and customization options for designing and implementing various logic functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables efficient use of PCB space and ensures high signal integrity in the system.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage of 0.97V allows for power-efficient operation and flexibility in power supply design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this FPGA can withstand harsh environmental conditions and high-performance requirements.

Pitch Of Terminal: 0.5 mm

The small terminal pitch of 0.5mm enables compact packaging and high-density integration of the FPGA into electronic systems.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 °C ensures reliable performance in extreme temperature environments and industrial applications.

Position Of Terminal: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the FPGA into electronic systems.

Maximum Seated Height: 1.45 mm

The low maximum seated height of 1.45mm allows for slim and compact design solutions with reduced space requirements.

Width: 11 mm

The compact width of 11mm enables easy integration of the FPGA into tight spaces and small form factor electronic devices.

No. of Outputs: 170

With 170 outputs, this FPGA can drive a variety of output signals, increasing its versatility and applicability in different systems.

Length: 14.5 mm

The moderate length of 14.5mm provides a balance between compactness and functionality for the FPGA, allowing for versatile deployment.

Grading Of Temperature: MILITARY

The military-grade temperature rating ensures robust performance and reliability in demanding applications and harsh operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF200TS-FCS325M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

192000

No. of Inputs:

170

No. of Outputs:

170

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14.5 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

Trade Compliance

MPF200TS-FCS325M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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