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MPF200TLS-FCSG325I

Microchip Technology

MPF200TLS-FCSG325I by Microchip Technology

MPF200TLS-FCSG325I by Microchip Tech is a CMOS FPGA with 192K logic cells, 170 inputs/outputs. It operates b/w -40 to 100°C and has a low profile grid array package. Ideal for applications requiring high-density programmable logic in compact spaces.

Median Price

$478.215

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 485 parts In-Stock

1+ parts

$348.000

100+ parts

$316.370

1k+ parts

$219.790

10k+ parts

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485

$348.000

$316.370

$219.790

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DigiKey

USA . 4 parts In-Stock

1+ parts

$608.430

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4

$608.430

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Distributors (In-Stock)

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Digiode

USA . 381 parts In-Stock

1+ parts

$578.008

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381

$578.008

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Vyrian

USA . 438 parts In-Stock

1+ parts

$608.430

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438

$608.430

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,578 parts In-Stock

1+ parts

$401.890

100+ parts

$401.230

1k+ parts

$400.900

10k+ parts

$400.570

2,578

$401.890

$401.230

$400.900

$400.570

Ampacity Inc.

Singapore . 133 parts In-Stock

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$441.660

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133

$441.660

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Semicontronic

India . 91 parts In-Stock

1+ parts

$466.800

100+ parts

$455.130

1k+ parts

$452.796

10k+ parts

-

91

$466.800

$455.130

$452.796

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Corphita

USA . 488 parts In-Stock

1+ parts

$547.587

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488

$547.587

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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LOOK Integrated Logistics

Peru . 4,501 parts In-Stock

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NIA Electronics

USA . 1,937 parts In-Stock

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1,937

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Ledger Components

France . 1,937 parts In-Stock

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1,937

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Montano Global Distributors

Canada . 457 parts In-Stock

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457

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LMD Electronica

Estonia . 261 parts In-Stock

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Overview

Unlock unparalleled performance and versatility with the MPF200TLS-FCSG325I by Microchip Technology. As a leader in Field Programmable Gate Arrays (FPGA), Microchip guarantees top-notch quality and reliability. This FPGA offers 192,000 logic cells, 170 inputs and outputs, and cutting-edge CMOS technology. Whether you're in telecommunications, automotive, or aerospace, this product provides endless possibilities for your projects. Experience seamless integration, enhanced speed, and superior functionality with the MPF200TLS-FCSG325I. Elevate your designs and stay ahead of the competition with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides durability and protection to the FPGA, making it suitable for a variety of environmental conditions.

No. of Logic Cells: 192000

Having a high number of logic cells allows for complex programmable logic designs and higher processing capabilities in the FPGA.

Surface Mount: YES

Surface mount compatibility makes it easier to integrate the FPGA onto circuit boards and reduces assembly time and costs.

Maximum Supply Voltage: 1.03 V

A maximum supply voltage of 1.03 V ensures efficient power consumption and reliable operation of the FPGA.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.

No. of Inputs: 170

Having a high number of inputs allows for more data to be processed simultaneously, increasing the versatility of the FPGA.

Package Shape: RECTANGULAR

A rectangular package shape makes the FPGA easy to handle and integrate into circuit designs with standard dimensions.

Form Of Terminal: BALL

Ball terminals provide reliable connections and easy soldering during the assembly process.

No. of Terminals: 325

A higher number of terminals allow for more I/O connections and flexibility in system integration with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for customization and adaptability in hardware design without the need for redesigning the entire circuit.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

A grid array package style with low profile and fine pitch terminals enables high density integration and efficient routing on circuit boards.

Minimum Supply Voltage: 0.97 V

Having a low minimum supply voltage ensures stable operation even at lower power levels, improving energy efficiency.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the FPGA can withstand harsh environmental conditions and maintain performance in demanding applications.

Pitch Of Terminal: 0.5 mm

A small pitch of terminals allows for compact design and efficient use of space on the circuit board.

Minimum Operating Temperature: -40 °C

A wide operating temperature range from -40 to 100°C ensures reliable performance in various temperature conditions.

Position Of Terminal: BOTTOM

Having terminals at the bottom of the FPGA simplifies the routing of connections and allows for better thermal management.

Maximum Seated Height: 1.45 mm

A low maximum seated height minimizes the overall profile of the FPGA on the circuit board, saving space and enabling compact designs.

Width: 11 mm

With a width of 11 mm, the FPGA can fit within standard dimensions of circuit layouts and provide compatibility with common design practices.

No. of Outputs: 170

A high number of outputs allows for multiple signals to be generated simultaneously, enhancing the functionality and performance of the FPGA.

Length: 14.5 mm

With a length of 14.5 mm, the FPGA can be accommodated within compact system layouts while still offering a high level of programmable logic.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF200TLS-FCSG325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

192000

No. of Inputs:

170

No. of Outputs:

170

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14.5 mm

Width:

11 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

Trade Compliance

MPF200TLS-FCSG325I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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