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MPF200T-1FCG784I

Microchip Technology

MPF200T-1FCG784I by Microchip Technology

MPF200T-1FCG784I by Microchip Tech is a 192K logic cell FPGA with CMOS tech. It has 364 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for SMT applications.

Median Price

$411.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 322 parts In-Stock

1+ parts

$411.950

100+ parts

$374.500

1k+ parts

$260.180

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322

$411.950

$374.500

$260.180

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DigiKey

USA . 4 parts In-Stock

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$411.950

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4

$411.950

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Distributors (In-Stock)

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Digiode

USA . 251 parts In-Stock

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$391.372

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251

$391.372

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Nova Conductors

Japan . 700 parts In-Stock

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$474.135

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700

$474.135

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Vyrian

USA . 7,683 parts In-Stock

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7,683

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Chip Stock

USA . 721 parts In-Stock

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721

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Distributors (Availability)

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AZTECH Wire

Italy . 465 parts In-Stock

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$6.959

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465

$6.959

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Vigor

Singapore . 193 parts In-Stock

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$338.860

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193

$338.860

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Semicontronic

India . 96 parts In-Stock

1+ parts

$350.170

100+ parts

$341.416

1k+ parts

$339.665

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96

$350.170

$341.416

$339.665

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Ampacity Inc.

Singapore . 5 parts In-Stock

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$350.170

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5

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Corphita

USA . 368 parts In-Stock

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$370.773

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368

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Microchip USA

USA . 2,190 parts In-Stock

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$447.800

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$447.800

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Argo Parts USA

USA . 2,784 parts In-Stock

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$474.135

100+ parts

$469.394

1k+ parts

$464.652

10k+ parts

$459.911

2,784

$474.135

$469.394

$464.652

$459.911

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$474.135

100+ parts

$464.652

1k+ parts

$450.428

10k+ parts

$440.946

2,000

$474.135

$464.652

$450.428

$440.946

Continental Prestige Electronics

USA . 1,105 parts In-Stock

1+ parts

$474.135

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$464.652

1,105

$474.135

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$464.652

NIA Electronics

USA . 5,215 parts In-Stock

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5,215

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Ledger Components

France . 5,215 parts In-Stock

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Montano Global Distributors

Canada . 4,685 parts In-Stock

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4,685

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LMD Electronica

Estonia . 3,315 parts In-Stock

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LOOK Integrated Logistics

Peru . 1,387 parts In-Stock

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1,387

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Overview

Experience unparalleled performance and reliability with the MPF200T-1FCG784I FPGA by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and cutting-edge technology in all their products. Whether you're looking to enhance your data processing capabilities or improve your system's efficiency, this FPGA is the perfect solution. With 192000 logic cells and 364 inputs/outputs, the possibilities are endless. Trust in Microchip Technology to deliver the value and benefits you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and heat resistance, making the product suitable for a variety of environments.

No. of Logic Cells: 192000

High number of logic cells allows for complex programmable logic designs and applications.

Surface Mount: YES

Surface mount capability makes installation and integration easier and more efficient.

Maximum Supply Voltage: 1.03 V

Low maximum supply voltage reduces power consumption and heat generation, increasing energy efficiency.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

No. of Inputs: 364

Large number of inputs allows for versatile and configurable input options for various applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy integration into circuit designs.

Form Of Terminal: BALL

Ball terminals provide secure connections and ease of installation, ensuring reliable performance.

No. of Terminals: 784

High number of terminals allows for flexible connectivity and integration options for different systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field programmable gate array technology offers customizable logic and functionality, making the product versatile and adaptable to various applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides a compact and organized layout for efficient circuit design and assembly.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage ensures reliable operation and stability of the product under various operating conditions.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows the product to withstand elevated temperatures without sacrificing performance.

Pitch Of Terminal: 1 mm

The small pitch of terminals enables high-density mounting and space-saving design possibilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in cold environments or during temperature fluctuations.

Position Of Terminal: BOTTOM

Terminal positioning at the bottom provides easy accessibility and secure connections for efficient installation and maintenance.

Maximum Seated Height: 3.47 mm

Low maximum seated height allows for slim and compact device designs, ideal for space-constrained applications.

Width: 29 mm

Compact width dimension allows for easy integration into various circuit layouts and space-saving designs.

No. of Outputs: 364

Large number of outputs offers flexibility and versatility in output configurations for diverse applications.

Length: 29 mm

Compact length dimension provides flexibility in device placement and integration in different system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF200T-1FCG784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

192000

No. of Inputs:

364

No. of Outputs:

364

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF200T-1FCG784I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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