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MPF200TS-FCG484I

Microchip Technology

MPF200TS-FCG484I by Microchip Technology

MPF200TS-FCG484I by Microchip Tech is a 192K logic cell FPGA with CMOS tech. It has 244 inputs/outputs, operates b/w -40 to 100°C, and uses a grid array package. Ideal for industrial applications requiring high-density programmable ICs in compact form factors.

Median Price

$381.008

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 381 parts In-Stock

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$360.800

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381

$360.800

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Nova Conductors

Japan . 10 parts In-Stock

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$401.216

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10

$401.216

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Vyrian

USA . 5,502 parts In-Stock

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5,502

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Chip Stock

USA . 1,351 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$7.816

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228

$7.816

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Vigor

Singapore . 461 parts In-Stock

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$304.970

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461

$304.970

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$326.370

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3

$326.370

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Semicontronic

India . 3 parts In-Stock

1+ parts

$326.370

100+ parts

$318.211

1k+ parts

$316.579

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3

$326.370

$318.211

$316.579

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Corphita

USA . 201 parts In-Stock

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$341.811

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201

$341.811

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Netroflash

USA . 100 parts In-Stock

1+ parts

$401.216

100+ parts

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$381.155

10k+ parts

$373.131

100

$401.216

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$381.155

$373.131

Microchip USA

USA . 1,708 parts In-Stock

1+ parts

$403.060

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$403.060

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LMD Electronica

Estonia . 6,896 parts In-Stock

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Montano Global Distributors

Canada . 4,697 parts In-Stock

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4,697

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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NIA Electronics

USA . 1,897 parts In-Stock

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Ledger Components

France . 1,897 parts In-Stock

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LOOK Integrated Logistics

Peru . 464 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MPF200TS-FCG484I by Microchip Technology. This Field Programmable Gate Array boasts 192000 logic cells and 244 inputs, making it a versatile solution for a wide range of applications. With its CMOS technology and industrial-grade temperature grading, this FPGA delivers unparalleled performance and reliability. Experience seamless integration with its surface mount design and square package shape, providing customers with a hassle-free installation process. Elevate your projects to new heights with the MPF200TS-FCG484I and unlock endless possibilities in the world of electronic design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, ensuring reliable performance over an extended period of time.

No. of Logic Cells: 192000

With a large number of logic cells, this FPGA can handle complex calculations and processing tasks efficiently.

Surface Mount: YES

Being surface mountable makes it easy to integrate this FPGA into various electronic systems, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.03 V

Operating within a specific voltage range ensures optimal performance and protects the FPGA from potential damage due to voltage spikes.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA suitable for a wide range of applications.

No. of Inputs: 244

Having a large number of inputs allows for versatile connectivity options, enabling the FPGA to interface with various external devices and sensors.

Package Shape: SQUARE

The square shape of the package provides a uniform footprint, making it easier to design and layout the FPGA on a circuit board.

Form Of Terminal: BALL

Ball terminals offer efficient heat dissipation and reliable electrical connections, improving the overall performance and longevity of the FPGA.

No. of Terminals: 484

Having a high number of terminals allows for increased connectivity options and flexibility in circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA can be customized and reconfigured as needed, offering flexibility and adaptability in various applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved signal integrity and thermal performance, enhancing the overall reliability of the FPGA.

Minimum Supply Voltage: 0.97 V

Operating within a specific voltage range ensures optimal performance and protects the FPGA from potential damage due to voltage drops.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and operate reliably in extreme heat.

Pitch Of Terminal: 1 mm

The tight pitch of the terminals allows for efficient routing of signals and minimizes signal interference, improving the overall performance of the FPGA.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can function in cold environments without sacrificing performance or reliability.

Position Of Terminal: BOTTOM

Bottom-mounted terminals make it easier to solder and connect the FPGA to a circuit board, ensuring secure and reliable connections.

Moisture Sensitivity Level (MSL): 4

Having a low moisture sensitivity level indicates that this FPGA is less susceptible to moisture damage, making it suitable for a variety of operating environments.

Maximum Seated Height: 2.87 mm

With a low seated height, this FPGA can be easily integrated into space-constrained designs without compromising performance or reliability.

Width: 23 mm

The compact width of the FPGA makes it suitable for applications where space is limited, offering flexibility in design and layout.

No. of Outputs: 244

Having a large number of outputs allows for versatile connectivity options, enabling the FPGA to drive multiple external devices and components.

Length: 23 mm

The compact length of the FPGA makes it suitable for applications where space is limited, offering flexibility in design and layout.

Grading Of Temperature: INDUSTRIAL

Being rated for industrial temperature range ensures that this FPGA can operate reliably in harsh industrial environments without compromising performance or longevity.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF200TS-FCG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

192000

No. of Inputs:

244

No. of Outputs:

244

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF200TS-FCG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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