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MPF200TS-1FCSG536I

Microchip Technology

MPF200TS-1FCSG536I by Microchip Technology

MPF200TS-1FCSG536I by Microchip Technology is a CMOS FPGA with 192K logic cells, 300 inputs/outputs. It operates b/w -40 to 100°C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density programmable logic in a compact grid array package.

Median Price

$429.640

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 5 parts In-Stock

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$146.490

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Verical

USA . 5 parts In-Stock

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$352.720

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$352.720

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DigiKey

USA . 10 parts In-Stock

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$429.640

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10

$429.640

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Microchip Technology

USA . 5 parts In-Stock

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$429.640

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$390.580

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$271.350

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5

$429.640

$390.580

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Mouser Electronics

USA . 2 parts In-Stock

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$429.640

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Distributors (In-Stock)

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NAC Semi

USA . 888 parts In-Stock

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$368.260

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$339.180

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$314.370

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$368.260

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$314.370

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Digiode

USA . 410 parts In-Stock

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$624.558

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$624.558

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Nova Conductors

Japan . 600 parts In-Stock

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$741.685

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$741.685

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Vyrian

USA . 7,252 parts In-Stock

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Chip Stock

USA . 1,086 parts In-Stock

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Andel Nordic

Denmark . 2,007 parts In-Stock

1+ parts

$4.545

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$4.364

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$4.364

2,007

$4.545

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$4.364

$4.364

AZTECH Wire

Italy . 348 parts In-Stock

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$12.028

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348

$12.028

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Aztec Data Supply Inc.

USA . 2,909 parts In-Stock

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$87.974

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Corohmni

South Africa . 4 parts In-Stock

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$127.487

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Vigor

Singapore . 130 parts In-Stock

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$530.070

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$558.820

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Semicontronic

India . 6 parts In-Stock

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$558.820

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$544.850

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$542.055

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$558.820

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$542.055

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Corphita

USA . 412 parts In-Stock

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$591.687

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Microchip USA

USA . 1,196 parts In-Stock

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$700.205

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Argo Parts USA

USA . 4,937 parts In-Stock

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$741.685

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$734.268

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$726.851

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$719.434

4,937

$741.685

$734.268

$726.851

$719.434

Netroflash

USA . 1,000 parts In-Stock

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$741.685

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$741.685

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Continental Prestige Electronics

USA . 769 parts In-Stock

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$741.685

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$726.851

769

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Advanced Electronics

New Zealand . 750 parts In-Stock

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$756.519

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$756.519

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$756.519

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$756.519

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LOOK Integrated Logistics

Peru . 8,179 parts In-Stock

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Montano Global Distributors

Canada . 4,347 parts In-Stock

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LMD Electronica

Estonia . 4,307 parts In-Stock

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NIA Electronics

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Ledger Components

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Overview

Unlock limitless possibilities with the MPF200TS-1FCSG536I by Microchip Technology. As a leading manufacturer in the Field Programmable Gate Arrays (FPGA) category, Microchip Technology delivers unparalleled quality and innovation. This cutting-edge product boasts a staggering 192,000 logic cells and 300 inputs/outputs, offering unmatched flexibility for your projects. With a low profile, fine pitch package style and advanced CMOS technology, the MPF200TS-1FCSG536I is the ideal choice for high-performance applications. Experience the power of Microchip Technology and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the FPGA, making it suitable for various environmental conditions.

No. of Logic Cells: 192000

With a large number of logic cells, this FPGA offers high levels of functionality and flexibility for designing complex digital circuits.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V ensures efficient power usage while maintaining optimal performance.

Technology Used: CMOS

CMOS technology provides low power consumption and high noise immunity, making the FPGA energy-efficient and reliable.

No. of Inputs: 300

A high number of inputs allows for more input signals to be processed simultaneously, increasing the versatility and complexity of the design.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where size constraints are a concern.

Form Of Terminal: BALL

The use of ball terminals simplifies the connection process and ensures secure and reliable connections with other components.

No. of Terminals: 536

The high number of terminals offers flexibility in interfacing with external components, making it a versatile solution for diverse applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this product allows for reconfiguration and customization of logic functions, providing adaptability for different design requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high-density mounting and efficient signal routing, enhancing overall performance and reliability.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures power efficiency and helps in reducing power consumption, making it suitable for battery-operated devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range of 100°C allows reliable operation in a wide range of environments and applications.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for high-density mounting and space-efficient design, making it suitable for compact devices and layouts.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Position Of Terminal: BOTTOM

The bottom-positioned terminals facilitate easy assembly and connection with other components, making installation and maintenance hassle-free.

Maximum Seated Height: 1.45 mm

The low maximum seated height allows for thin and compact designs, making it suitable for space-constrained applications.

Width: 16 mm

The compact width of 16 mm enables easy integration into various electronic designs, providing flexibility and adaptability in layout and placement.

No. of Outputs: 300

A high number of outputs allows for multiple output signals to be generated simultaneously, enhancing the functionality and performance of the FPGA.

Length: 16 mm

The compact length of 16 mm provides a space-saving design, making it suitable for applications where size constraints are a consideration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF200TS-1FCSG536I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

192000

No. of Inputs:

300

No. of Outputs:

300

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

16 mm

Width:

16 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA536,30X30,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

536

Standards

JESD-30 Code:

S-PBGA-B536

Trade Compliance

MPF200TS-1FCSG536I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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