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MPF200T-1FCG484I

Microchip Technology

MPF200T-1FCG484I by Microchip Technology

MPF200T-1FCG484I by Microchip Tech is a 192K logic cell FPGA with CMOS tech. Features 244 inputs/outputs, operates from -40 to 100°C, and has a grid array package. Ideal for applications requiring high-density programmable logic in compact form factors.

Median Price

$334.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Microchip Technology

USA . 142 parts In-Stock

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$334.630

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$304.210

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$211.340

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DigiKey

USA . 2 parts In-Stock

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$334.630

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NAC Semi

USA . 148 parts In-Stock

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$286.830

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$264.180

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$244.850

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148

$286.830

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$244.850

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Digiode

USA . 192 parts In-Stock

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$352.250

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Vyrian

USA . 5,543 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 25 parts In-Stock

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AZTECH Wire

Italy . 663 parts In-Stock

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$6.034

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Aztec Data Supply Inc.

USA . 276 parts In-Stock

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$103.550

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Corohmni

South Africa . 280 parts In-Stock

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$149.269

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Vigor

Singapore . 348 parts In-Stock

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$304.970

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Ampacity Inc.

Singapore . 74 parts In-Stock

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$315.170

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Corphita

USA . 443 parts In-Stock

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$333.711

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Microchip USA

USA . 3,741 parts In-Stock

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$403.060

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Semicontronic

India . 60 parts In-Stock

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$685.960

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$668.811

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$665.381

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$665.381

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LOOK Integrated Logistics

Peru . 8,321 parts In-Stock

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Montano Global Distributors

Canada . 4,315 parts In-Stock

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Continental Prestige Electronics

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NIA Electronics

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Ledger Components

France . 3,487 parts In-Stock

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LMD Electronica

Estonia . 3,083 parts In-Stock

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Argo Parts USA

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Aranea Global

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology MPF200T-1FCG484I FPGA. Designed for versatility and performance, this field programmable gate array boasts 192,000 logic cells and 244 inputs and outputs, making it ideal for a wide range of applications. With its advanced CMOS technology and high-quality construction, this FPGA delivers unparalleled reliability and precision. Whether you're designing complex circuits or optimizing data processing, the MPF200T-1FCG484I offers unmatched value, flexibility, and performance for all your engineering needs. Upgrade your projects today and experience the difference with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness.

No. of Logic Cells: 192000

With a large number of logic cells, this FPGA offers high performance and flexibility.

Surface Mount: YES

This feature allows for easy and secure installation on PCBs.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures compatibility with various power sources.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 244

The ample number of inputs allows for versatile connectivity options.

Package Shape: SQUARE

The square shape makes this FPGA easy to integrate into various designs.

Form Of Terminal: BALL

Ball terminals provide reliable connectivity and easy soldering.

No. of Terminals: 484

Numerous terminals allow for complex connections and configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA type offers reconfigurability for a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient use of PCB space.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage helps optimize power consumption.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environments.

Pitch Of Terminal: 1 mm

A small pitch terminal spacing allows for compact PCB designs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables operation in extreme conditions.

Position Of Terminal: BOTTOM

Bottom terminal placement facilitates easy PCB layout and routing.

Maximum Seated Height: 2.87 mm

The low seated height saves space in compact designs.

Width: 23 mm

A moderate width makes this FPGA suitable for various board sizes.

No. of Outputs: 244

The ample number of outputs enables multi-functional capabilities.

Length: 23 mm

The moderate length makes this FPGA suitable for a range of applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF200T-1FCG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

192000

No. of Inputs:

244

No. of Outputs:

244

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF200T-1FCG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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