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XC7S25-2CSGA225I

Xilinx

XC7S25-2CSGA225I by Xilinx

The Xilinx XC7S25-2CSGA225I is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1286 MHz. It operates b/w -40 to 100 °C and has a package style of GRID ARRAY for industrial applications.

Median Price

$52.160

Lifecycle Status

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DigiKey

USA . 166 parts In-Stock

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$52.150

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Mouser Electronics

USA . 78 parts In-Stock

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$52.170

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Digiode

USA . 210 parts In-Stock

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$49.533

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VNN

France . 788 parts In-Stock

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$52.140

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Nova Conductors

Japan . 30 parts In-Stock

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$52.145

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Cyclops Electronics Ltd

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Vyrian

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Vigor

Singapore . 951 parts In-Stock

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$40.250

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Semicontronic

India . 104 parts In-Stock

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$44.320

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$43.212

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$42.990

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Ampacity Inc.

Singapore . 50 parts In-Stock

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Corphita

USA . 288 parts In-Stock

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Continental Prestige Electronics

USA . 6,473 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Microchip USA

USA . 2,245 parts In-Stock

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$52.650

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$51.650

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$51.150

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$50.650

Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$71.060

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$64.665

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Corohmni

South Africa . 75 parts In-Stock

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One Stop Electronics

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$96.460

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Texas Native Microelectronics

USA . 870 parts In-Stock

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$110.389

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$105.973

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$102.662

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$97.142

870

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$97.142

Modulus Dynamics

Lithuania . 1,098 parts In-Stock

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$120.886

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Aztec Data Supply Inc.

USA . 121 parts In-Stock

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Kenton Components

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Argo Parts USA

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Lixinc

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MARBEL Systems

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Supply Digital

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RC Electronics

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Qasali Group International

UK . 100 parts In-Stock

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iodParts Technologies Inc.

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Overview

Unleash the power of innovation with the XC7S25-2CSGA225I by Xilinx. As a leader in Field Programmable Gate Arrays (FPGA), Xilinx delivers top-notch quality and reliability. This versatile FPGA boasts 23360 logic cells, making it ideal for a wide range of applications. From advanced signal processing to high-speed networking, this FPGA offers unmatched performance and flexibility. Experience seamless integration and accelerated development with the XC7S25-2CSGA225I, unlocking endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longer product lifespan.

No. of Logic Cells: 23360

High number of logic cells allows for complex logic operations to be implemented, making it suitable for advanced applications.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 1.05 V

Allows for efficient power consumption while providing enough voltage for optimal performance.

No. of CLBs: 1825

Large number of Configurable Logic Blocks (CLBs) offer flexibility in designing custom logic circuits.

No. of Inputs: 150

Sufficient number of input ports for connecting external devices and signals.

Package Shape: SQUARE

Square shape ensures uniformity and easier integration into PCB layouts.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and facilitate easy soldering.

No. of Terminals: 225

Sufficient number of terminals for connecting to external circuitry and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA design allows for reprogramming and customization of logic functions, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array style with low profile and fine pitch design offers high density and space-saving benefits.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 100 °C

Wide operating temperature range enables the FPGA to function reliably in various environmental conditions.

Pitch Of Terminal: 0.8 mm

Fine pitch terminals allow for closer placement of components on the PCB, increasing circuit density.

Maximum Combinatorial Delay of a CLB: 1.05 ns

Low delay in logic operations ensures fast and efficient processing of signals.

Organization: 1825 CLBS

Well-organized CLBs provide structured logic implementation and ease of design.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing on terminals offer good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom position of terminals facilitates easy PCB layout and component placement.

Maximum Seated Height: 1.4 mm

Low profile design reduces overall product height and allows for compact system integration.

Width: 13 mm

Standard width size for compatibility with common PCB layouts and mounting configurations.

Maximum Clock Frequency: 1286 MHz

High clock frequency capability enables rapid processing of data and signal operations.

No. of Outputs: 150

Adequate number of output ports for transmitting processed signals to external devices.

Length: 13 mm

Standard length size for easy integration into various electronic systems and designs.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S25-2CSGA225I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

23360

No. of Inputs:

150

No. of Outputs:

150

No. of CLBs:

1825

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Organization:

1825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.4 mm

Package Equivalence Code:

BGA225,15X15,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

225

Standards

JESD-30 Code:

S-PBGA-B225

JESD-609 Code:

e1

Trade Compliance

XC7S25-2CSGA225I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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