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XC7S50-1FTGB196I

Xilinx

XC7S50-1FTGB196I by Xilinx

XC7S50-1FTGB196I by Xilinx is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing, it operates b/w -40 to 100 °C with low profile grid array packaging.

Median Price

$79.160

Lifecycle Status

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Farnell

UK . 50 parts In-Stock

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Mouser Electronics

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DigiKey

USA . 126 parts In-Stock

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Newark

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Element14

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Digiode

USA . 268 parts In-Stock

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$68.352

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VNN

France . 157 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Vyrian

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Bristol Electronics

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AZTECH Wire

Italy . 436 parts In-Stock

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Vigor

Singapore . 343 parts In-Stock

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Ampacity Inc.

Singapore . 16 parts In-Stock

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Corphita

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Corohmni

South Africa . 498 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Bastille Electronics

Australia . 170 parts In-Stock

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$69.046

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Modulus Dynamics

Lithuania . 1,733 parts In-Stock

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Aztec Data Supply Inc.

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Semicontronic

India . 189 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 10,569 parts In-Stock

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Qasali Group International

UK . 2,478 parts In-Stock

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MARBEL Systems

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Argo Parts USA

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Supply Digital

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Overview

Discover the power of the XC7S50-1FTGB196I from Xilinx, a top-tier manufacturer known for delivering cutting-edge Field Programmable Gate Arrays (FPGA). With over 52,000 logic cells and 4,075 CLBs, this FPGA offers unparalleled performance and flexibility. Whether you're in telecommunications, automotive, or aerospace industries, this product provides maximum value with its low profile, fine pitch package design. Experience faster processing speeds, higher clock frequencies, and reliable operation even in extreme temperatures. Elevate your projects with the XC7S50-1FTGB196I and unlock limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliability to the FPGA.

No. of Logic Cells: 52160

Having a high number of logic cells allows for complex digital designs and computations to be implemented efficiently.

Surface Mount: YES

Being surface mountable makes it easy to integrate the FPGA onto circuit boards, simplifying the design and assembly process.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

No. of CLBs: 4075

The large number of Configurable Logic Blocks (CLBs) allows for versatile programming and customization of logic functions.

No. of Inputs: 250

Having a high number of inputs enables the FPGA to handle multiple data streams and inputs, increasing its processing capability.

Package Shape: SQUARE

The square package shape provides uniformity in design and makes it easier to integrate the FPGA into different systems.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process and ensures a secure connection to the circuit board.

No. of Terminals: 196

Having a sufficient number of terminals facilitates easy connectivity and integration into circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA's programmable nature allows for flexibility in design and reconfiguration, making it ideal for prototyping and development.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides compactness and efficient use of space on the circuit board.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures reliable operation even at lower power levels, enhancing energy efficiency.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the FPGA can operate reliably in a wide range of environmental conditions.

Pitch Of Terminal: 1 mm

The compact pitch of terminals allows for high-density integration of the FPGA on the circuit board, saving space.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low combinatorial delay of a Configurable Logic Block ensures fast and efficient processing of logic operations.

Organization: 4075 CLBS

The organized structure of 4075 Configurable Logic Blocks provides a clear architectural framework for designing complex logic circuits.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the FPGA can function reliably even in harsh environments or extreme cold conditions.

Finishing Of Terminal Used: MATTE TIN

The use of matte tin finish on terminals ensures good electrical conductivity and resistance to corrosion, enhancing longevity.

Position Of Terminal: BOTTOM

The terminal position at the bottom of the package simplifies the PCB layout and routing of connections for efficient design.

Maximum Seated Height: 1.55 mm

The low maximum seated height allows for a slim and compact profile of the FPGA on the circuit board, saving space.

Width: 15 mm

The compact width of 15 mm makes the FPGA suitable for use in space-constrained applications or designs.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, the FPGA can process data and logic operations at high speeds, enhancing performance.

No. of Outputs: 250

Having a high number of outputs allows the FPGA to drive multiple devices or components, enabling versatile functionality.

Length: 15 mm

The compact length of 15 mm contributes to a space-efficient design and integration of the FPGA into various systems.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures reliable operation in industrial environments with varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S50-1FTGB196I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

52160

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

4075

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

4075 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA196,14X14,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

1 mm

No. of Terminals:

196

Standards

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e3

Trade Compliance

XC7S50-1FTGB196I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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