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XC7S50-1CSGA324Q

Xilinx

XC7S50-1CSGA324Q by Xilinx

The Xilinx XC7S50-1CSGA324Q is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and wide operating temperature range (-40 to 125 °C).

Median Price

$87.110

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Mouser Electronics

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Digiode

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Nova Conductors

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AZTECH Wire

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Corphita

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Modulus Dynamics

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Qasali Group International

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Overview

Unlock endless possibilities with the Xilinx XC7S50-1CSGA324Q Field Programmable Gate Array. Manufactured by the reputable Xilinx, this FPGA boasts high-quality construction and advanced technology, making it ideal for a wide range of applications. Whether you're in automotive, consumer electronics, or telecommunications, this versatile FPGA offers unparalleled flexibility and performance. Experience the value of customization and innovation with the XC7S50-1CSGA324Q, where your imagination is the only limit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material is lightweight and durable, making this FPGA suitable for various applications where weight and durability are important factors.

No. of Logic Cells: 52160

Having a high number of logic cells allows for complex and large-scale designs to be implemented on this FPGA.

Surface Mount: YES

Surface mount capability makes it easy to integrate this FPGA onto PCBs for electronic systems.

Maximum Supply Voltage: 1.05 V

Low maximum supply voltage helps in reducing power consumption and heat generation, making this FPGA energy efficient.

No. of CLBs: 4075

Having a high number of Configurable Logic Blocks (CLBs) allows for flexible and customizable logic implementation in designs.

No. of Inputs: 250

Having a high number of inputs allows for the FPGA to interface with a variety of external components and signals.

Package Shape: SQUARE

Square shape offers efficient use of PCB real estate and easy integration into circuit designs.

Form Of Terminal: BALL

Ball terminals provide secure connections and ease of soldering during PCB assembly.

No. of Terminals: 324

Having numerous terminals allows for versatile connectivity and signal routing options for the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC allows for reprogramming and customization, making it suitable for prototyping and testing of different designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration and space-saving on the PCB.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for flexibility in power supply design and compatibility with low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliability in harsh environmental conditions and thermal stability during operation.

Pitch Of Terminal: 0.8 mm

Having a small terminal pitch allows for high-density routing and compact PCB designs.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay in CLBs ensures fast response time and high-speed performance of the FPGA.

Organization: 4075 CLBS

The organizational structure of 4075 CLBs provides a balance between logic density and flexibility for various design requirements.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows for reliable operation even in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with a combination of tin, silver, and copper ensures good electrical conductivity and corrosion resistance for long-term reliability.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easy soldering and assembly of the FPGA onto PCBs.

Maximum Seated Height: 1.5 mm

Low seated height enables slim and compact PCB design while accommodating the FPGA within tight spaces.

Width: 15 mm

Compact width allows for efficient use of PCB real estate and easy integration into circuit designs.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency enables fast processing and high-speed data throughput in applications requiring rapid computations.

No. of Outputs: 250

Having a high number of outputs allows for the FPGA to drive multiple external components and signals, enhancing system functionality.

Length: 15 mm

Compact length allows for efficient use of PCB real estate and easy integration into circuit designs.

Grading Of Temperature: AUTOMOTIVE

Automotive-grade temperature grading ensures reliability and performance in automotive applications that require durability and high operating temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S50-1CSGA324Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

52160

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

4075

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

4075 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Trade Compliance

XC7S50-1CSGA324Q Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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