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XC7S15-1FTGB196Q

Xilinx

XC7S15-1FTGB196Q by Xilinx

The Xilinx XC7S15-1FTGB196Q is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and wide operating temperature range from -40°C to 125°C.

Median Price

$27.250

Lifecycle Status

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Nova Conductors

Japan . 900 parts In-Stock

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AZTECH Wire

Italy . 207 parts In-Stock

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Ampacity Inc.

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Continental Prestige Electronics

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Netroflash

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One Stop Electronics

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Semicontronic

India . 1,207 parts In-Stock

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MARBEL Systems

Belgium . 3,409 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 644 parts In-Stock

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Qasali Group International

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Corohmni

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Aztec Data Supply Inc.

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Argo Parts USA

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Supply Digital

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Overview

Unleash the power of cutting-edge technology with the XC7S15-1FTGB196Q by Xilinx, a top-tier manufacturer renowned for its high-quality Field Programmable Gate Arrays (FPGA). This innovative product boasts 12800 logic cells and 1000 CLBs, making it ideal for a wide range of applications. From automotive to industrial electronics, this FPGA offers unmatched flexibility and performance. With a maximum clock frequency of 1098 MHz and a low profile grid array package style, customers can expect seamless integration and optimal functionality. Elevate your projects to new heights with the XC7S15-1FTGB196Q – the ultimate solution for your programming needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this FPGA lightweight and cost-effective, ideal for various applications.

No. of Logic Cells: 12800

With a high number of logic cells, this FPGA offers versatility and flexibility for complex digital designs.

Surface Mount: YES

Being surface mountable, this FPGA is easy to solder onto a printed circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage requirement of 1.05V ensures energy efficiency and reduces power consumption.

No. of CLBs: 1000

The 1000 configurable logic blocks provide ample resources for implementing a wide range of logic functions.

No. of Inputs: 100

With 100 inputs, this FPGA can accommodate multiple signal sources for processing and manipulation.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on a PCB, optimizing board space usage.

Form of Terminal: BALL

The ball terminal design ensures reliable connections and simplifies the soldering process during assembly.

No. of Terminals: 196

The 196 terminals provide sufficient I/O capabilities for connecting to external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field programmable device, this FPGA offers flexibility for reconfiguring logic functions as needed, making it adaptable for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances signal integrity, reduces crosstalk, and allows for high-density mounting on a PCB.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement of 0.95V enables operation in low-power environments, suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this FPGA can withstand high-temperature environments, making it reliable for extended use.

Pitch of Terminal: 1 mm

The 1mm terminal pitch simplifies PCB layout and routing, ensuring efficient signal transmission and reducing the risk of signal interference.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low combinatorial delay of 1.27ns in a Configurable Logic Block (CLB) ensures fast processing of logic operations, improving overall system performance.

Organization: 1000 CLBs

The organized structure of 1000 CLBs provides a systematic and scalable platform for implementing complex logic functions in digital circuits.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FPGA can function in harsh environmental conditions, suitable for industrial or automotive applications.

Finishing of Terminal Used: MATTE TIN

The use of matte tin finishing on the terminal enhances solderability and durability, ensuring long-term reliability in operation.

Position of Terminal: BOTTOM

The bottom positioning of terminals allows for easy access and connection during PCB assembly, simplifying the overall integration process.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55mm enables a slim profile and compact footprint, ideal for space-constrained designs.

Width: 15 mm

The 15mm width provides a compact form factor, allowing for efficient board space utilization in densely populated PCB layouts.

Maximum Clock Frequency: 1098 MHz

With a maximum clock frequency of 1098MHz, this FPGA offers high-speed processing capabilities for demanding applications.

No. of Outputs: 100

The 100 outputs provide multiple signal paths for delivering processed data or control signals to external devices in the system.

Length: 15 mm

The 15mm length contributes to the overall compact size of the FPGA, enabling integration into small form factor electronic devices.

Grading of Temperature: AUTOMOTIVE

The automotive-grade temperature rating ensures reliability and stability of performance in automotive applications subjected to varying temperature conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S15-1FTGB196Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

12800

No. of Inputs:

100

No. of Outputs:

100

No. of CLBs:

1000

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Organization:

1000 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA196,14X14,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

1 mm

No. of Terminals:

196

Standards

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e3

Trade Compliance

XC7S15-1FTGB196Q Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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