Loading...
Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCKU15P-3FFVA1156E by Xilinx

XCKU15P-3FFVA1156E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.71 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-3FFVA1760E by Xilinx

XCKU15P-3FFVA1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-3FFVE1517E by Xilinx

XCKU15P-3FFVE1517E

Xilinx

Xilinx XCKU15P-3FFVE1517E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.927 V.

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-3FFVE1760E by Xilinx

XCKU15P-3FFVE1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU15P-L1FFVA1156I by Xilinx

XCKU15P-L1FFVA1156I

Xilinx

Xilinx XCKU15P-L1FFVA1156I FPGA features 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.

FPGA

1143450

668

668

65340

65340 CLBS

It also Operates at 0.85 V

.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.51 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-L2FFVA1156E by Xilinx

XCKU15P-L2FFVA1156E

Xilinx

Xilinx XCKU15P-L2FFVA1156E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 110°C.

FPGA

1143450

668

668

65340

65340 CLBs

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.71 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

XCKU15P-L2FFVE1517E by Xilinx

XCKU15P-L2FFVE1517E

Xilinx

Xilinx XCKU15P-L2FFVE1517E FPGA offers 1143450 logic cells, 65340 CLBs, and 668 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.742 V. Suitable for industries needing reliable and efficient solutions in a compact square package style with a grid array design.

FPGA

1143450

668

668

65340

65340 CLBs

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCKU15P-L2FFVE1760E by Xilinx

XCKU15P-L2FFVE1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1143450

668

668

65340

65340 CLBs

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU3P-1FFVA676E by Xilinx

XCKU3P-1FFVA676E

Xilinx

Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-1FFVB676E by Xilinx

XCKU3P-1FFVB676E

Xilinx

Xilinx XCKU3P-1FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring low supply voltage (0.825-0.876 V) and operating temperatures (0-100°C). Suitable for various industries needing advanced programmable ICs in a compact grid array package.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-1FFVB676I by Xilinx

XCKU3P-1FFVB676I

Xilinx

Xilinx XCKU3P-1FFVB676I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-1FFVD900E by Xilinx

XCKU3P-1FFVD900E

Xilinx

Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU3P-1FFVD900I by Xilinx

XCKU3P-1FFVD900I

Xilinx

Xilinx XCKU3P-1FFVD900I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it's ideal for industrial applications requiring high-performance computing in a compact form factor with a grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU3P-2FFVA676I by Xilinx

XCKU3P-2FFVA676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-2FFVB676I by Xilinx

XCKU3P-2FFVB676I

Xilinx

Xilinx XCKU3P-2FFVB676I FPGA features 355,950 logic cells and 20,340 CLBs. With 304 inputs/outputs, it operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-2FFVD900I by Xilinx

XCKU3P-2FFVD900I

Xilinx

Xilinx XCKU3P-2FFVD900I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876V, it's ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU3P-3FFVA676E by Xilinx

XCKU3P-3FFVA676E

Xilinx

Xilinx XCKU3P-3FFVA676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.927 V. Suitable for various industries due to its versatility and robust design.

FPGA

355950

304

304

20340

20340 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-3FFVB676E by Xilinx

XCKU3P-3FFVB676E

Xilinx

Xilinx XCKU3P-3FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.927 V. Suitable for various industries due to its plastic/epoxy package body material and grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-L1FFVB676I by Xilinx

XCKU3P-L1FFVB676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

355950

304

304

20340

20340 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-L1FFVD900I by Xilinx

XCKU3P-L1FFVD900I

Xilinx

Xilinx XCKU3P-L1FFVD900I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact package with a max operating temperature of 100°C.

FPGA

355950

304

304

20340

20340 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU3P-L2FFVB676E by Xilinx

XCKU3P-L2FFVB676E

Xilinx

Xilinx XCKU3P-L2FFVB676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 110°C. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly.

FPGA

355950

304

304

20340

20340 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVA676E by Xilinx

XCKU5P-1FFVA676E

Xilinx

Xilinx XCKU5P-1FFVA676E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-speed processing and customization in industries like telecommunications, aerospace, and automotive due to its advanced programmable capabilities. Operates b/w -40°C to 100°C with a supply voltage range of 0.825V to 0.876V.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVB676E by Xilinx

XCKU5P-1FFVB676E

Xilinx

Xilinx XCKU5P-1FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVB676I by Xilinx

XCKU5P-1FFVB676I

Xilinx

Xilinx XCKU5P-1FFVB676I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly processes.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVD900E by Xilinx

XCKU5P-1FFVD900E

Xilinx

Xilinx XCKU5P-1FFVD900E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. It operates b/w -40 to 100°C and has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance computing in compact spaces with stringent power requirements.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU5P-1FFVD900I by Xilinx

XCKU5P-1FFVD900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU5P-2FFVB676I by Xilinx

XCKU5P-2FFVB676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-2FFVD900I by Xilinx

XCKU5P-2FFVD900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU5P-3FFVB676E by Xilinx

XCKU5P-3FFVB676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L1FFVB676I by Xilinx

XCKU5P-L1FFVB676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L2FFVA676E by Xilinx

XCKU5P-L2FFVA676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L2FFVB676E by Xilinx

XCKU5P-L2FFVB676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L2FFVD900E by Xilinx

XCKU5P-L2FFVD900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU9P-1FFVE900E by Xilinx

XCKU9P-1FFVE900E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

599550

304

304

34260

34260 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU9P-1FFVE900I by Xilinx

XCKU9P-1FFVE900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

599550

304

304

34260

34260 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU9P-2FFVE900I by Xilinx

XCKU9P-2FFVE900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

599550

304

304

34260

34260 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCKU9P-L1FFVE900I by Xilinx

XCKU9P-L1FFVE900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

599550

304

304

34260

34260 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

XCVU065-H1FFVC1517E by Xilinx

XCVU065-H1FFVC1517E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

783300

520

520

44760

44760 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU095-H1FFVA2104E by Xilinx

XCVU095-H1FFVA2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

67200

67200 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

3.86 mm

BGA2104,46X46,40

Bottom

Ball

Tin Silver Copper

1 mm

2104

S-PBGA-B2104

e1

XCVU095-H1FFVC1517E by Xilinx

XCVU095-H1FFVC1517E

Xilinx

Xilinx XCVU095-H1FFVC1517E FPGA features 1176000 logic cells, 67200 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatile package style and operating temperature range from 0 to 100°C.

FPGA

1176000

832

832

67200

67200 CLBS

Also Operates at 1 V nominal supply

0.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.51 mm

BGA1517,39X39,40

Bottom

Ball

Tin Silver Copper

1 mm

1517

S-PBGA-B1517

e1

XCVU11P-1FLGA2577E by Xilinx

XCVU11P-1FLGA2577E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

52.5 mm

52.5 mm

4.24 mm

BGA2577,51X51,40

Bottom

Ball

1 mm

2577

S-PBGA-B2577

XCVU11P-1FLGB2104I by Xilinx

XCVU11P-1FLGB2104I

Xilinx

Xilinx XCVU11P-1FLGB2104I FPGA offers 2835000 logic cells, 162000 CLBs, and 624 inputs/outputs. Ideal for industrial applications with a temperature range of -40 to 100°C. Package style is grid array with square shape and bottom terminal position.

FPGA

2835000

624

624

162000

162000 CLBS

.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU11P-1FLGC2104E by Xilinx

XCVU11P-1FLGC2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU11P-1FLGC2104I by Xilinx

XCVU11P-1FLGC2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.32 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU11P-2FLGF1924I by Xilinx

XCVU11P-2FLGF1924I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

37320

37320 CLBS

.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.24 mm

BGA1924,44X44,40

Bottom

Ball

1 mm

1924

S-PBGA-B1924

XCVU11P-2FSGD2104I by Xilinx

XCVU11P-2FSGD2104I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU11P-3FSGD2104E by Xilinx

XCVU11P-3FSGD2104E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

47.5 mm

47.5 mm

4.59 mm

BGA2104,46X46,40

Bottom

Ball

1 mm

2104

S-PBGA-B2104

XCVU11P-L2FLGF1924E by Xilinx

XCVU11P-L2FLGF1924E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: SQUARE;

FPGA

2835000

624

624

162000

162000 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

4.24 mm

BGA1924,44X44,40

Bottom

Ball

1 mm

1924

S-PBGA-B1924